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Qualcomm Snapdragon 845 Octa Core Kryo 385 SoC to Power Premium Smartphones, XR Headsets, Windows Laptops

December 7th, 2017 9 comments

Qualcomm Snapdragon 845 processor was expected since May 2017 with four custom Cortex A75 cores, four Cortex A53 cores, Adreno 630 GPU, and X20 LTE modem. with the launch planned for Q1 2018. At least, that what the leaks said.

Qualcomm has now formally launched Snapdragon 845 Mobile Platform and rumors were mostly right, as the the octa-core processor comes with four Kryo 385 Gold cores (custom Cortex A75), four Kryo 385 Silver cores (custom Cortex A55) leveraging DynamIQ technology, an Adreno 630 “Visual Processing System”, and Snapdragon X20 modem supporting LTE Cat18/13.

The processor is said to use more advanced artificial intelligence (AI) allowing what the company calls “extended reality (XR)” applications, and will soon be found in flagship smartphones, XR headsets, mobile PCs, and more.

Qualcomm Snapdragon 845 (SDM845) specifications:

  • Processor
    • 4x Kryo 385 Gold performance cores @ up to 2.80 GHz (custom ARM Cortex A75 cores)
    • 4x Kryo 385 Silver efficiency cores @ up to 1.80 GHz (custom ARM Cortex A55 cores)
    • DynamIQ technology
  • GPU (Visual Processing Subsystem) – Adreno 630 supporting OpenGL ES 3.2, OpenCL 2.0,Vulkan 1.x, DxNext
  • DSP
    • Hexagon 685 with 3rd Gen Vector Extensions, Qualcomm All-Ways Aware Sensor Hub.
    • Supports Snapdragon Neural Processing Engine (NPE) SDK, Caffe, Caffe2, and Tensorflow
  • Memory I/F – LPDDR4x, 4×16 bit up to 1866MHz, 8GB RAM
  • Storage I/F – TBD (Likely UFS 2.1, but maybe UFS 3.0?)
  • Display
    • Up to 4K Ultra HD, 60 FPS, or dual 2400×2400 @ 120 FPS (VR); 10-bit color depth
    • DisplayPort and USB Type-C support
  • Audio
    • Qualcomm Aqstic audio codec and speaker amplifier
    • Qualcomm aptX audio playback with support for aptX Classic and HD
    • Native DSD support, PCM up to 384kHz/32bit
  • Camera
    • Spectra 280 ISP with dual 14-bit ISPs
    • Up to 16 MP dual camera, up to 32 MP single camera
    • Support for 16MP image sensor operating up to 60 frames per second
    • Hybrid Autofocus, Zero Shutter Lag, Multi-frame Noise Reduction (MFNR)
    • Video Capture – Up to 4K @ 60fps HDR (H.265), up to 720p @ 480fps (slow motion)
  • Connectivity
    • Cellular Modem – Snapdragon X20 with peak download speed: 1.2 Gbps (LTE Cat 18), peak upload speed: 150 Mbps (LTE Cat 13)
    • Qualcomm Wi-Fi 802.11ad Multi-gigabit, integrated 802.11ac 2×2 with MU-MIMO, 2.4 GHz, 5 GHz and 60 GHz
    • Qualcomm TrueWireless Bluetooth 5
  • Location – Support for 6 satellite systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; low power geofencing and tracking, sensor-assisted navigation
  • Security – Qualcomm Secure Processing Unit (SPU), Qualcomm Processor Security, Qualcomm Mobile Security, Qualcomm Content Protection
  • Charging – Qualcomm Quick Charge 4/4+ technology
  • Process – 10nm LPP

The company will provide support for Android and Windows operating systems. eXtended Reality (XR) is enabled with features such as room-scale 6DoF with simultaneous localization and mapping (SLAM), advanced visual inertial odometry (VIO), and Adreno Foveation. Maybe I don’t follow the phone market closely enough, but I can’t remember seeing odometry implemented in any other phones, and Adreon Foveation is not quite self-explaining, so the company explains it combines graphics rendering with eye tracking, and directs the highest graphics resources to where you’re physically looking, while using less resources for rendering other areas. This improves the experience, performance, and lower power consumption.

 

Click to Enlarge

Compared to Snapdragon 835, the new processor is said to be around 25 to 30% faster, the Spectra camera and Adreno graphics architectures are claimed to boost power efficiency by up to 30 percent, and the LTE modem is a bit faster (1.2 Gbps/150Mbps vs 1.0 Gbps/150Mbps). Quick Charge 4+ technology should deliver up  to 50 percent charge in 15 minutes. Earlier this year when SD835 was officially launched, there was virtually no mention of artificial intelligence support in mobile APs, but now NNA (Neural Network Accelerator) or NPE (Neural Processing Engine) are part of most high-end mobile processors, which in SD845 appears to be done though the Hexagon 685 DSP. High Dynamic Range (HDR) for video playback and capture is also a novelty in the new Snapdragon processor.

One of the first device powered by Snapdragon 845 will be Xiaomi Mi 7 smartphone, and according to leaks it will come with a 6.1″ display, up to 8GB RAM, dual camera, 3D facial recognition, and more. Further details about the phone are expected for Mobile World Congress 2018. Considering the first Windows 10 laptop based on Snapdragon 835 processor are expected in H1 2018, we may have to wait until the second part of the year for the launch of Snapdragon 845 mobile PCs.

More details may be found on Qualcomm Snapdragon 845 mobile platform product page.

Meet the First Windows 10 Arm “Always Connected PCs” – HP Envy x2 (2017) and ASUS NovaGo TP370

December 6th, 2017 28 comments

Qualcomm and Microsoft showcased some Snapdragon 835 based Windows 10 “Mobile PCs” at Computex 2017 last June, and while the press was allowed film the demo, the device could only be operated by a Qualcomm employee.

But both companies and their partners have made progress, and at the Snapdragon Technology Summit, Qualcomm announced “Always Connected PCs” which will run Windows 10, be always on and always connected at Gigabit LTE speeds, and support all-day battery life while keeping thin and fanless designs. all while incorporating Windows 10. HP and ASUS unveiled their very own “Always Connected PCs”, respectively Envy X2 and Novago TP370. What I used to call laptop or in this case 2-in-1 hybrid (laptop) is now apparently called “Always Connected PC”, but in any case let’s have a closer look at both devices.

HP Envy x2 (2017)

Specifications:

  • SoC – Qualcomm Snapdragon 835 Mobile Processor @ 2.6GHz with Adreno 540 GPU @ 710MHz
  • System memory – Up to 8GB RAM
  • Storage – Up to 256GB UFS 2.0 storage, micro SD card reader
  • Display – 12.3″ WUXGA+ (1920 x 1280) touch display
  • Audio – 1x combo audio jack; dual speaker; microphone array with Cortana voice-recognition support
  • Backlit Keyboard and touchpad
  • Connectivity
    • WiFi – 802.11a/b/g/n, 802.11ac
    • Qualcomm Snapdragon X16 modem (Gigabit LTE with DL: 1Gbps, UL: 150Mbps; 4×4 MIMO); 1x SIM card reader
  • Camera – 13MP rear camera and 5MP front camera
  • USB – 1x USB-C port
  • Misc – Volume buttons
  • Battery – Good for up to 20 hours of local video playback, over 700 hours of connected standby
  • Dimensions –  6.9 mm thick
  • Weight – 1.21 kg

ASUS Novago TP370

NovaGo-TP370QL specifications:

  • SoC – Qualcomm Snapdragon 835 Mobile Processor @ 2.6GHz with Adreno 540 GPU @ 710MHz
  • System memory – 4GB / 6GB / 8GB 1866MHz LPDDR4x (soldered)
  • Storage – 64GB / 128GB / 256GB UFS 2.0 storage, micro SD card slot up to 256 GB
  • Display – 13.3” LED-backlit Full HD (1920x 1080) display
  • Video Output – HDMI
  • Audio – 1x audio jack; dual speaker; smart amplifier; microphone array with Cortana voice-recognition support
  • Backlit keyboard and PTP touchpad
  • Connectivity
    • WiFi – 802.11a/b/g/n, 802.11ac (2×2 MIMO)
    • Qualcomm Snapdragon X16 modem (Gigabit LTE with DL: 1Gbps, UL: 150Mbps; 4×4 MIMO); 1x Combo Nano SIM (tray with needle)
  • Camera – 1280×720 HD camera
  • USB – 2x USB 3.1 Gen 1 Type-A ports
  • Sensors – Fingerprint sensor
  • Battery – 52 Wh lithium-polymer battery good for up to 22 hours battery life, over 30 days of modern standby
  • Dimensions – 31.6 x 22.1 x 1.49 cm
  • Weight – 1.39 kg

The 2-in-1 laptop always connected PC will run Windows 10 S by default, but a recommended free upgrade to Windows 10 Pro will be offered. More details may be found on the product page. Windows 10 S only allows the installation of apps in Windows Store, and Microsoft own Edge browser (no Firefox, no Chrome), so most people will likely upgrade to Windows 10 Pro, especially if it is free, and this is probably a condition imposed by Microsoft.

ASUS NovaGo is expected to be available early next year, while the HP Envy x2 is planned for Spring 2018. I could not find pricing on the official page, but Liliputing reports an “entry-level model with 4GB of RAM and 64GB of storage should sell for about $599, while an 8GB/256GB model will run $799”.

You’ll find various hands-on video for the Envy x2 (2017) model online, including the one from Engadget embedded below.

Qualcomm Centriq 2400 ARM SoC Launched for Datacenters, Benchmarked against Intel Xeon SoCs

November 9th, 2017 13 comments

Qualcomm Centriq 2400 ARM Server-on-Chip has been four years in the making. The company announced sampling in Q4 2016 using 10nm FinFET process technology with the SoC featuring up to 48 Qualcomm Falkor ARMv8 CPU cores optimized for datacenter workloads. More recently, Qualcomm provided a few more details about the Falkor core, fully customized with a 64-bit only micro-architecture based on ARMv8 / Aarch64.

Finally, here it is as the SoC formally launched with the company announcing commercial shipments of Centriq 2400 SoCs.

Qualcom Centriq 2400 key features and specifications:

  • CPU – Up to 48 physical ARMv8 compliant 64-bit only Falkor cores @ 2.2 GHz (base frequency) / 2.6 GHz (peak frequency)
  • Cache – 64 KB L1 instructions cache with 24 KB single-cycle L0 cache, 512 KB L2 cache per duplex; 60 MB unified L3 cache; Cache QoS
  • Memory – 6 channels of DDR4 2667 MT/s  for up to 768 GB RAM; 128 GB/s peak aggregate bandwidth; inline memory bandwidth compression
  • Integrated Chipset – 32 PCIe Gen3 lanes with 6 PCIe controllers; low speed I/Os; management controller
  • Security – Root of trust, EL3 (TrustZone) and EL2 (hypervisor)
  • TDP – < 120W (~2.5 W per core)

Click to Enlarge

The SoC is ARM SBSA v3 compliant, meaning it can run any compliant operating systems without having to resort to “cute embedded nonsense hacks“. The processor if optimized for cloud workloads, and the company explains the SoC are already been used demonstrated for the following tasks:

  • Web front end with HipHop Virtual Machine
  • NoSQL databases including MongoDB, Varnish, Scylladb
  • Cloud orchestration and automation including Kubernetes, Docker, metal-as-a-service
  • Data analytics including Apache Spark
  • Deep learning inference
  • Network function virtualization
  • Video and image processing acceleration
  • Multi-core electronic design automation
  • High throughput compute bioinformatics
  • Neural class networks
  • OpenStack Platform
  • Scaleout Server SAN with NVMe
  • Server-based network offload

Three Qualcom Centriq 2400 SKUs are available today

  • Centriq 2434 – 40 cores @ 2.3 / 2.5 GHz; 50 MB L3 cache; 110W TDP
  • Centriq 2452 – 46 cores @ 2.2 / 2.6 GHz; 57.5 MB L3 cache; 120W TDP
  • Centriq 2460 – 48 cores @ 2.2 / 2.6 GHz; 60 MB L3 cache; 120W TDP

Qualcomm Centriq 2460 (48-cores) was compared to an Intel Xeon Platinum 8160 with 24-cores/48 threads (150 W) and found to perform a little better in both integer and floating point benchmarks.

The most important metrics for server SoCs are performance per thread, performance per watt, and performance per dollars, so Qualcomm pitted Centriq 2460, 2452 and 2434 against respectively Intel Xeon Platinum 8180 (28 cores/205W  TDP), Xeon Gold 6152 (22 cores/140W TDP), and Xeon Silver 4116 (12 cores/85W  TDP). Performance per watt was found to be significantly better for the Qualcomm chip when using SPECint_rate2006 benchmark.

Performance per dollars of the Qualcomm SoCs look excellent too, but…

Qualcomm took Xeon SoCs pricing from Intel’s ARK, and in the past prices there did not reflect the real selling price of the chip, at least for low power Apollo Lake / Cherry Trail processors.

This compares to the prices for Centriq 2434 ($880), Centriq 2452 ($1,373), and Centriq 2460 ($1,995).

Qualcomm also boasted better performance per mm2, and typical power consumption of Centriq 2460 under load of around 60W, well below the 120W TDP. Idle power consumption is around 8 watts using C1 mode, and under 4 Watts when all idle states are enabled.

If you are wary of company provided benchmarks, Cloudflare independently tested Qualcomm Centriq and Intel  Skylake/Broadwell servers using Openssl speed, compression algorithms (gzip, brotli…), Go, NGINX web server, and more.

Multicore OpenSSL Performance

Usually, Intel single core performance is better, but since ARM has more cores, multi-threaded performance is often better on ARM. Here’s their conclusion:

The engineering sample of Falkor we got certainly impressed me a lot. This is a huge step up from any previous attempt at ARM based servers. Certainly core for core, the Intel Skylake is far superior, but when you look at the system level the performance becomes very attractive.

The production version of the Centriq SoC will feature up to 48 Falkor cores, running at a frequency of up to 2.6GHz, for a potential additional 8% better performance.

Obviously the Skylake server we tested is not the flagship Platinum unit that has 28 cores, but those 28 cores come both with a big price and over 200W TDP, whereas we are interested in improving our bang for buck metric, and performance per watt.

Currently my main concern is weak Go language performance, but that is bound to improve quickly once ARM based servers start gaining some market share.

Both C and LuaJIT performance is very competitive, and in many cases outperforms the Skylake contender. In almost every benchmark Falkor shows itself as a worthy upgrade from Broadwell.

The largest win by far for Falkor is the low power consumption. Although it has a TDP of 120W, during my tests it never went above 89W (for the go benchmark). In comparison Skylake and Broadwell both went over 160W, while the TDP of the two CPUs is 170W.

Back to software support, the SoC is supported by a large ecosystem with technologies such as memcached, MongoDB, MySQL, …, cloud management solutions such as  Openstack and Kubernetes, programming languages (Java, Python, PHP, Node, Golang…), tools (GVV/ LLVM, GBD…), virtualization solution including KVM, Xen and Docker, as well as operating systems like Ubuntu, Redhat, Suse, and Centos.

Qualcomm is already working on its next generation SoC: Firetail based on Qualcomm Saphira core. But no details were provided yet.

Thanks to David for the links.

Qualcomm Snapdragon 636 Delivers Up to 40% Better Performance Over Snapdragon 630, Supports FHD+ Displays

October 18th, 2017 No comments

Qualcomm has announced a new “Mobile Platform” with Snapdragon 636 that combines eight Kryo 260 cores, an Adreno 509 GPU, and X12 LTE modem for “high quality devices with top-level features at a low price point”, which must mean “mid range”.

The new Snapdragon 636 offers an update to Snapdragon 630 / 660 solutions released last year with up to 40% performance boost, 10% faster 3D graphics, and support for ultra-wide FHD+ displays (18:9 aspect ratio).

Key features for Snapdragon 636:

  • CPU – 8x Qualcomm Kryo 260 cores clocked at up to 1.8 GHz
  • GPU – Adreno 509 with support for OpenGL ES 3.2, OpenCL 2.0 full,Vulkan, DX12
  • DSP – Hexagon 680 DSP with All-Ways Aware Technology, Neural Processing Engine SDK, Caffe/Caffe2 and Tensorflow support
  • Memory I/F –  LPDDR4/4X, dual channel up to 1333MHz, 8GB RAM
  • Storage I/F – eMMC and UFS flash
  • Display – Up to 2160×1080 FHD+ resolution; DisplayPort and USB type-C support for external displays
  • Video – Up to 4K @ 30 fps playback and capture; up to 1080p @ 120 fps capture; H.264, H.265, VP9, VP8 codecs
  • Audio – Qualcomm Aqstic audio codec and speaker amplifier; Qualcomm aptX audio playback with support for aptX classic and HD
  • Camera – Up to 24MP single camera, up to 16MP dual camera; Qualcomm Spectra 160 ISP
  • Modem – Snapdragon X12 LTE modem: Cat 12 for downlink (600 Mbps max); Cat 13 for uplink (150 Mbps max)
  • Wireless Connectivity – Dual band 802.11ac 1×1 WiFi, Bluetooth 5
  • Location – GPS, Glanass, BeiDou, Galileo, QZSS and SBAS
  • Security – Qualcomm Mobile Security: smart camera,  application security, Qualcomm processor security
  • Charging – Quick Charge 4 technology

Snapdragon 636 is also pin-to-pin compatible with Snapdragon 630/660, so OEMs will have an easier time upgrading their models.

The Snapdragon 636 Mobile Platform is expected to ship to customers in November 2017. More info on the product page.

Mediatek Helio X20 vs Qualcomm Snapdragon 625 – 3D Graphics Benchmarks and CSR2 Game

October 17th, 2017 4 comments

I’ve been using Vernee Apollo Lite smartphone with a Mediatek Helio X20 deca-core ARM Cortex A72/A53 processor coupled with an ARM for a little over a year. Recently, I’ve received Xiaomi Mi A1 smartphone for a Qualcomm Snapdragon 625 SoC featuring eight ARM Cortex A53 cores and an Adreno 506 GPU.

In theory, the latter is a downgrade, and the Xiaomi phone is indeed quite slower in Antutu with overall score of 60,161 points against 85,840 points in the Mediatek phone. 3D graphics performance is also lower with 12,849 vs 17,828 points. Both smartphone have the same resolution (1920×1080), so it’s a little confusing to be told you’d “better to play games in low quality mode” for the Mediatek phone, and “game performance is mid-level” for the Snapdragon one.

But anyway Helio 20 should work better in 3D games than Snapdragon 625 if we are to believe the numbers. Most apps run fine on Vernee Apollo Lite, but one game I play is sometimes extremely sluggish, especially in a specific section of the user interface. That game is CSR Racing 2 (aka CSR2), and the section is called “Rare import” where the game will sometimes freeze for a few seconds apparently while rendering some animations. The phone may also overheat while playing, and I’ve used Boots hot & cold pack a few times to keep it cool and make the game playable, but that’s another story 🙂

So I was interesting to find out if CSR2 would also freeze in Xiaomi Mi 2, and see how it performs while actually playing, so I placed both phones side-by-side to check it out.

The video above does not actually show the worst case for the Mediatek processor, as sometimes the animations in “rare imports” would freeze for 3 to 4 seconds and several times during the process. So far, Xiaomi Mi A1 has been working very well in that section. In the video I mentioned that I could not see much difference between the two phones during playback, but after playing further I found the Xiaomi Mi A1 is also smoother to play. After also double-checking the video, it’s also clear there are less texture details and fewer objects shown in the Snapdragon 625 phone, as shown in the photo below with trees shown in Vernee Apollo Lite, but not the Xiaomi phone.

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The app is likely auto-detecting the phone performance, and it works well for one, and not quite as well for the other. It’s also possible the developers focus on the most popular phones from Samsung, Motorola, HTC, and other brands which are usually equipped with Exynos or Snapdragon processors, rather than Mediatek ones. I could not find an option to manually adjust the image quality/resolution in the game.

The conclusion is that you can’t simply look at benchmarks to find out if a particular game will work well on your phone. In this case Helio X20 is closed to 40% faster in Antutu 3D GPU benchmark, but the user experience is much better with the Snapdragon 625 phone, albeit at the cost of a little less graphics details. Other games will likely differ depending on the implementation.

Snapdragon X50 5G Modem Makes it First Data Connection

October 17th, 2017 1 comment

5G technology is expected to launch in 2019, and Qualcomm has recently made a step towards this goal with the company announcing their first 5G data connection with Snapdragon X50 modem on on 28GHz mmWave Spectrum.

The demonstration took place in Qualcomm Technologies’ laboratories in San Diego, and achieved Gigabit download speeds using several 100 MHz 5G carriers.

Snapdragon X50 (Left); 26GHz mmWave antenna module (Right)

Snapdragon X50 5G Modem’s product page lists some of the key features of the chip:

  • Up to 5 gigabits per second download speeds
  • Initial support for operation in the 28 GHz millimeter wave band. It can connect using up to 800 MHz of bandwidth via 8×100 MHz carrier aggregation.
  • Supports advanced multiple input, multiple output (MIMO) techniques such as adaptive beamforming and beam tracking
  • Composed of the modem as well as the SDR051 mmWave transceiver

The modem can be paired with a Snapdragon processor to provide multi-mode 4G/5G capability, and the company expects it to be found in fixed wireless applications, with Snapdragon X50 5G modem to replace fiber-to-the-home (FTTH) installations with wireless 5G connections.

The company also unveiled their first mmWave 5G smartphone reference design, which they use to test and optimize 5G mmWave performance using a mobile form factor.  The Snapdragon X50 5G NR (New Radio) modem family is expected to be found in 5G smartphones and networks in the H1 2019. Whether you can use that technology that early or not will depend on your budget, your country’s  5G license policy, and launch of 5G services by telecommunication companies.

Qualcomm Provides Details about 64-bit ARM Falkor CPU Cores used in Centriq 2400 Server-on-Chip

August 21st, 2017 8 comments

Qualcomm officially announced they started sampling Centriq 2400 SoC with 48 ARMv8 cores for datacenters & cloud workloads using a 10nm process, but at the time the company did not provide that many details about the solution or the customization made to the CPU cores.

Qualcomm has now announced that Falkor is the custom CPU design in Centriq 2400 SoC with the key features listed by the company including:

  • Fully custom core design – Designed specifically for the cloud datacenter server market, with a 64-bit only micro-architecture based on ARMv8 (Aarch64).
  • Scalable building block The Falkor core duplex includes two custom Falkor CPUs, a shared L2 cache and a shared bus interface to the Qualcomm System Bus (QSB) ring interconnect.
  • Designed for performance, optimized for power
    • 4-issue, 8-dispatch heterogeneous pipeline designed to optimize performance per unit of power, with variable length pipelines that are tuned per function to maximize throughput and minimize idle hardware.
    • power management techniques: independent p-state control for each of the CPUs and L2, with entry to and exit from low-power states controlled by hardware state machines, and hardware state retention for power-collapsed sleep states with ultra-fast recovery.
  • Performance under memory-intensive workloads Falkor is designed to fulfill the demand for larger instruction footprints using an innovative split instruction cache comprised of a single-cycle, low-power 24KB L0 I-cache complementing its 64KB L1 I-cache. The core also supports a 32KB L1 D-cache with a 3-cycle load-use latency. The L1 D-cache is augmented by a sophisticated multi-level hardware prefetch engine that dynamically adapts to system conditions.
  • Datacenter features
    • ARM Execution Levels (EL0-EL3) and TrustZone secure execution environment.
    • ARMv8 instruction extensions to accelerate cryptographic transform and secure hash operations such as AES, SHA1, and SHA2-256
    • RAS mechanisms needed to keep a datacenter running, such as fault isolation, reporting, and handling techniques.
  • System on a chip – The 48 Falkor CPUs are brought together in a fully-integrated SoC with high-bandwidth and low-latency ring interconnect, large L3 cache and multiple memory controllers. It also includes an on-die hardware-based immutable root of trust that authenticates firmware before the first line of firmware is ever executed

Centriq 2400 SoC is scheduled to start shipping later this year. You’ll find an in-depth overview of Falkor micro-architecture, and more slides on Anandtech.

Qualcomm Snapdragon 450 is a 14nm LTE “Mobile Platform” for Mid-Range Smartphones and Tablets

June 28th, 2017 No comments

Qualcomm has a made several announcements at Mobile World Congress Shanghai 2017, with processors like Snapdragon Wear 1200 Wearables SoC, as well as Snapdragon 450 octa-core mobile platform, allegedly the first 14nm processor made for mid-range mobile devices.

Click to Enlarge

Qualcomm Snapdragon 450 specifications:

  • CPU – 8x ARM Cortex A53 cores @ up to 1.8 GHz
  • GPU – Adreno 506 GPU with OpenGL ES 3.1, OpenCL 2.0 Full, DirectX 12, GPU tessellation, geometry shading
  • DSP – Hexagon 546 DSP
  • Memory I/F – LPDDR3
  • Display – Full HD 1080p60; Qualcomm EcoPix,TruPalette, improveTouch technology
  • Audio – Qualcomm Aqstic with VoLTE w/Ultra HD Voice (EVC), high-fidelity music playback (24-bit/192 KHz), Dolby 5.1
  • Modem – Snapdragon X9 LTE modem up to 300 Mbps download (Cat 7) and 150 Mbps uplink (Cat. 13)
  • Wireless Connectivity – 802.11ac MU-MIMO, Gen8C Lite location technology, Bluetooth 4.1 LE
  • USB – USB 3.0 interface
  • Camera – Up to 13MP dual camera, up to 21MP single camera; real-time Bokeh, Qualcomm ClearSight camera features
  • Video – 1080p60 HEVC playback and capture
  • Security – Qualcomm “Mobile Security”
  • Fast Charging – Quick Charge 3.0
  • Process – 14nm FinFET technology

The processor is an upgrade to the Snapdragon 435 processor with faster CPU and GPU bringing roughly 25% improvement in performance, better battery life with up to 30 percent reduction in power when gaming,  and better camera support with support for real-time Bokeh effects and dual 13MP cameras. The Snapdragon 450 is also said to be the the first mid-range mobile SoC to supports a USB 3.0 interface.

Sampling is scheduled for Q3 2017, and mobile devices based on the processor are expected by the end of 2017. No product page has been setup on Qualcomm website yet.