Amlogic 2018 Roadmap Reveals S905X2, S905C, and S922 Processors

I’ve been asked what’s next for Amlogic a few times recently, and today I received an Amlogic 2017/2018 roadmap dated Q3 2017 that shows three new processors beside Amlogic S805X, which has yet to be launched into products: Amlogic S905C, S905X2 and S922. So let’s have a look at the three new processors. Amlogic S905C specifications: CPU – Quad core ARM Cortex A53 processor GPU- ARM Mali-450MP2 System Memory  – Up to 3GB DDR3/3L, LPDDR2/3 memory Storage – NAND flash, eMMC 5.0 flash, and NOR flash interfaces Video – 4K60 HEVC decoder, 4K30 H.264 decoder, and AVS+ decoder with HDR10, HLG, 1080p60 H.264 encoder Video Output – HDMI 2.0b, CVBS Audio – integrated audio DAC Integrated DVB-C demodulator , 1x TS input Others – 10/100M Ethernet, 2x USB 2.0 Package – 13 x 13 mm BGA Engineering samples have been available since July 2017, and it looks to be targeting the Chinese cable TV market with an AVS+ decoder and …

NXP LPC Microcontrollers Roadmap for 2017 – LPC800 and LPC54000 Series

With the acquisition of Freescale, NXP now has both Kinetis and LPC ARM Cortex M micro-controller families. The company has kept selling both so far, but it’s unclear whether they’ll keep developing new Kinetis MCU family in the future. There’s no such doubt about LPC family with the company having published a 2017 roadmap for ARM Cortex M0+ based LPC 800 series, and ARM Cortex M4 based LPC54000 series. LPC800 series MCUs are promoted as 8-bit MCU alternatives, and three new models are expected next year: LPC84x ARM Cortex M0+ @ 30 MHz with 64KB flash, 8 to 16KB RAM available in QFN and LQFP packages. LPC802 ARM Cortex M0+ @ 15 MHz with 16KB flash, 2KB RAM available in TSSOP packages LPC804 ARM Cortex M0+ @ 15 MHz with 32KB flash, 4KB RAM available in QFN or TSSOP packages There will be new models of the more powerful LPC54000 series: LPC546xx ARM Cortex-M4 @ 180 MHz with 256 to …

Intel Gemini Lake Celeron & Pentium Processors Will Replace Apollo Lake Processors in 2018

While Laptops and mini PCs powered by Intel Apollo Lake low lower Celeron and Pentium processors are slowly starting to show up, and should go into full swing in 2017, Intel is also working on their successors, which according to a leaked roadmap for 2017-2018 will be Gemini Lake processors. Gemini Lake will also have a 4 to 6 Watts TDP, and come in a BGA package, but there’s nothing much else we know, except the first processors should become available in Q4 2017 or Q1 2018. Other families include mid-range Cannon Lake family with 5.2 to 15 W TDP with some Core M and Core ix processors, and the higher-end Coffee Lake family succeeding Kaby Lake and Skylake processors. Another slide shows Gemini Lake processors will target the same products as Braswell and Apollo Lake processors with 2-in-1 laptops, ultra-thin notebooks, and mainstream notebooks. I’m pretty sure we’ll also see Celeron Nxxx and Pentium Jxxx Gemini Lake processors in …

Intel Apollo Lake NUC6CAYS & NUC6CAYH NUC mini PCs Specifications Released

Intel Apollo Lake is the next generation of low power processor family that should replace Braswell Celeron processors, and Fanlesstech got hold of the specifications for two upcoming “Arches Canyon” NUC6CAYS and NUC6CAYH NUCs (Next Unit of Computing) mini PCs based on the processors, as well as the 2016-2018 roadmap for the complete (consumer grade) Intel NUC family. The only differences between the two models are that NUC6CAYH is a barebone model without memory or storage, nor operating system. So I’ll just list NUC6CAYS specifications: SoC – Intel Celeron Jxxx quad core processor @ x GHz to y GHz (burst) with Intel HD graphics up to z MHz (10W TDP) System Memory – 2GB DDR3L-xxxx SO-DIMM (dual channel), upgradeable up to 8GB DDR3L-1866 Storage – 32GB eMMC flash, 2.5″ SATA3 bay for 9.5mm hard drives, SDXC slot with UHS-I support Video Output – HDMI 2.0 (4K @ 60 Hz), VGA Audio – Up to 7.1 channels via HDMI, 3.5mm headset …

Renesas R-Car H3 Deca-Core Processor and Driverless Car Roadmap

Renesas has recently unveiled R-Car H3 deca-core processor for automotive applications with four Cortex A57 cores, four Cortex A5 cores, and two Cortex-R7 “dual-lock step” cores for real-time processor, and has part the releases showed the expected roadmap for the implementation of driverless / autonomous cars. Let’s start with the processor (R8A77950) and SiP module (R8J77950) specifications: CPU cores –  quad core  ARM Cortex-A57, quad core ARM Cortex-A53, and dual lock-step ARM Cortex-R7 cores with respectively 48KB/32KB, 32KB/32KB, and 32KB/32KB L1 instructions/operand cache. GPU – IMG PowerVR Series6XT GX6650 External memory – LPDDR4-SDRAM up to 1600 MHz, data bus width: 32 bits x 4 ch (12.8GB/s x 4) Expansion bus – 2 ch PCI Express2.0 (1 lane) Video Out – 3x display output Input / camera – 8x video inputs Video codec module (H.265, H.264/AVC, MPEG-4, VC-1, etc.) IP conversion module 2x TS Interfaces Stream and Security Processor Video image processing (Up and down scaling, Dynamic γ correction, Color space …

AMD to Launch ARM Cortex A57 “Amur” Mobile SoCs in 2015, ARM “K12” Mobile SoCs in 2016

AMD started using ARM Cortex A5 to add TrustZone security to their x86 processor, they followed with their ARM based Opteron A1100 processor for server last year, recently they announced Hierofalcon embedded processors powered by up to eight Cortex A57 processor, and starting this year and beyond, the company will launch “ultra-low power’ mobile SoCs  using ARM cores, at least according to a leaked roadmap. Two ARM families are planned: “Amur” APU planned for 2015 with: Up to 4 ARM Cortex A57 cores GCN Graphics Compute Units AMD Secure Processor (Trustzone?) ~2W TDP 20nm process, FT4 BGA package “Styx” APU planned for 2016 with: Up to two “K12” CPU cores. These should be high performance custom-designed ARM cores. Next-gen GCN Graphics Compute Units Full HSA 1.0 support (Heterogeneous System Architecture) AMD Secure Processor ~2W TDP 14 nm process, FT4 BGA package With this kind of thermal dissipation, AMD Android and Windows tablets are the likely candidates for such chips, as …