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Orange Pi Development Boards

Amlogic 2018 Roadmap Reveals S905X2, S905C, and S922 Processors

January 10th, 2018 25 comments

I’ve been asked what’s next for Amlogic a few times recently, and today I received an Amlogic 2017/2018 roadmap dated Q3 2017 that shows three new processors beside Amlogic S805X, which has yet to be launched into products: Amlogic S905C, S905X2 and S922. So let’s have a look at the three new processors.

Click to Enlarge

Amlogic S905C specifications:

  • CPU – Quad core ARM Cortex A53 processor
  • GPU- ARM Mali-450MP2
  • System Memory  – Up to 3GB DDR3/3L, LPDDR2/3 memory
  • Storage – NAND flash, eMMC 5.0 flash, and NOR flash interfaces
  • Video – 4K60 HEVC decoder, 4K30 H.264 decoder, and AVS+ decoder with HDR10, HLG, 1080p60 H.264 encoder
  • Video Output – HDMI 2.0b, CVBS
  • Audio – integrated audio DAC
  • Integrated DVB-C demodulator , 1x TS input
  • Others – 10/100M Ethernet, 2x USB 2.0
  • Package – 13 x 13 mm BGA

Engineering samples have been available since July 2017, and it looks to be targeting the Chinese cable TV market with an AVS+ decoder and built-in DVB-C demodulator. Android and TVOS SDK will be provided. I had never heard about tvOS, and it looks to be the operating system used in Apple TV boxes. Will Amlogic processor be found in Apple devices, or is that another “TVOS”? [Update: TVOS should either be Android TV OS, or more likely NGB TVOS for the Chinese market. See comments]

Amlogic S905X2 is an update for S905X with a new manufacturing process and a mysterious dual core Dvalin GPU:

  • CPU – Quad core ARM Cortex A53 processor
  • GPU- Dvalin MP2
  • Video – Advanced HEVC, VP9 decoders; H.264, H.265 encoder
  • HDR – Dolby Vision, HDR10+
  • Ultra low power
  • Next gen process

Amlogic S922 will move to next gen Arm cores, and an upgraded GPU, but we don’t know a whole lot:

  • CPU – Octa-core next gen Arm CPU
  • GPU – Next gen GPU
  • Video – Dual 4K decode/4K encode
  • Full HDR standards
  • Display – MIPI DSI
  • Camera – MIPI CSI
  • Interfaces – USB type C, and PCI-e
  • Ultra low power

That processor should be able to handle 4K 3D videos thanks to the dual decoder, and will likely go beyond TV boxes, with the camera and display interfaces, so maybe Amlogic S922 laptops or tablets will be a thing at the end of 2018. If that’s the case, the processor will likely use an Arm Cortex A7x/A5x configuration, instead of just eight Cortex A55 cores.

NXP LPC Microcontrollers Roadmap for 2017 – LPC800 and LPC54000 Series

December 17th, 2016 No comments

With the acquisition of Freescale, NXP now has both Kinetis and LPC ARM Cortex M micro-controller families. The company has kept selling both so far, but it’s unclear whether they’ll keep developing new Kinetis MCU family in the future. There’s no such doubt about LPC family with the company having published a 2017 roadmap for ARM Cortex M0+ based LPC 800 series, and ARM Cortex M4 based LPC54000 series.

Click to Enlarge

Click to Enlarge

LPC800 series MCUs are promoted as 8-bit MCU alternatives, and three new models are expected next year:

  • LPC84x ARM Cortex M0+ @ 30 MHz with 64KB flash, 8 to 16KB RAM available in QFN and LQFP packages.
  • LPC802 ARM Cortex M0+ @ 15 MHz with 16KB flash, 2KB RAM available in TSSOP packages
  • LPC804 ARM Cortex M0+ @ 15 MHz with 32KB flash, 4KB RAM available in QFN or TSSOP packages

There will be new models of the more powerful LPC54000 series:

  • LPC546xx ARM Cortex-M4 @ 180 MHz with 256 to 512KB flash, 16KB EEPROM, 136 to 200KB RAM available in LQFP and TBGA packages
  • LPC546xx “Flashless” ARM Cortex-M4 @ 180 MHz with 360 KB RAM available in LQFP and TBGA packages

lpcxpresso54608-board

NXP will also soon launch LPC54608 development board (OM13092) to let people evaluate the new LPC546xx MCUs.

Thanks to Nanik for the tip.

Intel Gemini Lake Celeron & Pentium Processors Will Replace Apollo Lake Processors in 2018

September 16th, 2016 1 comment

While Laptops and mini PCs powered by Intel Apollo Lake low lower Celeron and Pentium processors are slowly starting to show up, and should go into full swing in 2017, Intel is also working on their successors, which according to a leaked roadmap for 2017-2018 will be Gemini Lake processors.

intel-roadmap-2017-2018

Gemini Lake will also have a 4 to 6 Watts TDP, and come in a BGA package, but there’s nothing much else we know, except the first processors should become available in Q4 2017 or Q1 2018. Other families include mid-range Cannon Lake family with 5.2 to 15 W TDP with some Core M and Core ix processors, and the higher-end Coffee Lake family succeeding Kaby Lake and Skylake processors.

intel-mobile-roadmap-2016-2017Another slide shows Gemini Lake processors will target the same products as Braswell and Apollo Lake processors with 2-in-1 laptops, ultra-thin notebooks, and mainstream notebooks. I’m pretty sure we’ll also see Celeron Nxxx and Pentium Jxxx Gemini Lake processors in mini PCs.

Via Liliputing

Intel Apollo Lake NUC6CAYS & NUC6CAYH NUC mini PCs Specifications Released

July 15th, 2016 16 comments

Intel Apollo Lake is the next generation of low power processor family that should replace Braswell Celeron processors, and Fanlesstech got hold of the specifications for two upcoming “Arches Canyon” NUC6CAYS and NUC6CAYH NUCs (Next Unit of Computing) mini PCs based on the processors, as well as the 2016-2018 roadmap for the complete (consumer grade) Intel NUC family.

Intel_Apollo_Lake_mini_PCThe only differences between the two models are that NUC6CAYH is a barebone model without memory or storage, nor operating system. So I’ll just list NUC6CAYS specifications:

  • SoC – Intel Celeron Jxxx quad core processor @ x GHz to y GHz (burst) with Intel HD graphics up to z MHz (10W TDP)
  • System Memory – 2GB DDR3L-xxxx SO-DIMM (dual channel), upgradeable up to 8GB DDR3L-1866
  • Storage – 32GB eMMC flash, 2.5″ SATA3 bay for 9.5mm hard drives, SDXC slot with UHS-I support
  • Video Output – HDMI 2.0 (4K @ 60 Hz), VGA
  • Audio – Up to 7.1 channels via HDMI, 3.5mm headset jack, 3.5mm rear speaker/TOSLINK combo jacl
  • Connectivity – Gigabit Ethernet (RJ45), Intel Wireless AC-316x M.2 module for 802.11ac 1×1 WiFi and Bluetooth 4.2 with internal antennas
  • USB – 2x front USB 3.0 ports at the front (yellow one for charging), 2x rear USB 3.0 ports, 2x internal USB 2.0 ports via header
  • Misc – IR receiver, Kensington lock
  • Power Supply – 12~19V DC input (65W wall-wart power supply included)
  • Dimensions – 115 x 111 x 51 (plastic casing with inner metal structure)

Intel_Apollo_Lake_NUCNUC6AYS will include Windows 10 Home x64 and Intel Remote Keyboard. Other features include multi-color front panel LED light ring, built-in dual array microphones, VESA mounting plate, front-panel and AUX_PWR internal headers. The NUCs will come with a 3 year warranty. Intel does not appear ready to give the complete SKU and operating frequency of the processors, but the good news is that Apollo Lake will be the first low power Intel processors to support HDMI 2.0 allowing for 4K output at 60 Hz.

Click to Enlarge

Click to Enlarge

The 2016-2018 NUC roadmap above was also “leaked” with more powerful Core i3, Core i5 and Core i7 NUCs. The first Apollo Lake NUC will be released in Q4 2016 with Windows 10, and the barebone version in Q1 2017.

Renesas R-Car H3 Deca-Core Processor and Driverless Car Roadmap

December 7th, 2015 3 comments

Renesas has recently unveiled R-Car H3 deca-core processor for automotive applications with four Cortex A57 cores, four Cortex A5 cores, and two Cortex-R7 “dual-lock step” cores for real-time processor, and has part the releases showed the expected roadmap for the implementation of driverless / autonomous cars.

Renesas R-Car H3 Processor and SIP Module Block Diagram

Renesas R-Car H3 Processor and SiP (System-in-Package) Module Block Diagram (Click to Enlarge)

Let’s start with the processor (R8A77950) and SiP module (R8J77950) specifications:

  • CPU cores –  quad core  ARM Cortex-A57, quad core ARM Cortex-A53, and dual lock-step ARM Cortex-R7 cores with respectively 48KB/32KB, 32KB/32KB, and 32KB/32KB L1 instructions/operand cache.
  • GPU – IMG PowerVR Series6XT GX6650
  • External memory – LPDDR4-SDRAM up to 1600 MHz, data bus width: 32 bits x 4 ch (12.8GB/s x 4)
  • Expansion bus – 2 ch PCI Express2.0 (1 lane)
  • Video
    • Out – 3x display output
    • Input / camera – 8x video inputs
    • Video codec module (H.265, H.264/AVC, MPEG-4, VC-1, etc.)
    • IP conversion module
    • 2x TS Interfaces
    • Stream and Security Processor
    • Video image processing (Up and down scaling, Dynamic γ correction, Color space conversion, I/P conversion, Super resolution processing, Rotation, Visual near lossless image compression)
    • Distortion compensation module x 4 ch(IMR-LSX4)
    • High performance Real-time Image recognition processor(IMP-X5)
  • Audio
    • Audio DSP
    • 10x sampling rate converter, 10x serial sound interface
    • MOST DTCP
  • Storage – 4x SD host interfaces. 2x MMC interfaces, 1x SATA
  • USB – 1x USB 3.0 Host interface (DRD), 2x USB 2.0 Host/Function/OTG interface
  • In car network and automotive peripherals
    • 3-pin Media local bus (MLB) interface
    • 2x Controller Area Network (CAN-FD support) interfaces
    • Ethernet AVB 1.0-compatible MAC built in
    • RGMII interface
  • Security – 2x Crypto engine (AES, DES, Hash, RSA); SystemRAM
  • Other peripherals
    • 48x SYS-DMAC, 16x Realtime-DMAC, 32x Audio-DMAC, 26x Audio(peripheral)-DMAC
    • 26x 32bit timer
    • 7x PWM timer
    • 7x I2C, 11x Serial communication interface (SCIF)
    • 2x Quad serial peripheral interface (QSPI) for boot, HyperFlash support
    • 4x SPI/IIS Clock-synchronized serial interface (MSIOF)
    • Ethernet controller (IEEE802.3u, RMII, without PHY)
    • 4x Digital radio interface (DRIF)
    • Interrupt controller (INTC)
    • Clock generator (CPG) with built-in PLL
    • On chip debugger interface
  • Low power mode – Dynamic Power Shutdown, AVS(Adaptive Voltage Scaling), DVFS(Dynamic Voltage and Frequency Scaling), and DDR-SDRAM power supply backup mode
  • Supply voltages – 3.3/1.8V (/IO), 1.1V (LPDDR4), 0.8V (core), 2.5V (EthernetAVB)
  • Package
    • 1384 pin Flip chip BGA (21mm × 21mm, 0.5mm pitch)
    • 1255-pin SiP module (42.5mm × 42.5mm, 0.8mm pitch)
  • Manufacturing Process – 16nm FinFET+
R-Car_H3_Processor_SiP_Module

Processor (Left) and SiP Module (Right)

This impressive system-on-chip supports Linux, Android, QNX Neutrino RTOS, Green Hills Integrity RTOS, and others operating systems. Development tools include an ICE for ARM CPU available from different vendors, and a development board with  “car information system-oriented peripheral circuits” that can  be used as a software development tool for application software. However, unless you decide to start a car company you probably won’t be able to buy this type of chip or evaluation board… Nevertheless, it could end up in your semi-autonomous car in a few years as while sample are available now,  mass production is scheduled to begin in March 2018, with ramping up to 100,000 units per month taking place in March 2019.

Driverless_Car_Roadmap

Autonomous car are a sure thing, with Google self-driving cars already on some roads (at slow speeds) and Formula E is even planning for driverless races, so the real question is about the time it may take to solve technical challenges, work out the regulations, and make the public confident enough to sit in autonomous cars. Renesas’ roadmap above shows R-Car H3 will be used for obstacle detection in 2018, semi-automated driving (ADAS = Advanced Driver Assistance Systems) in 2019, while fully autonomous cars may launch around year 2020 and beyond with the next generation (R-Car H4 ?) platform.

Renesas R-Car H3 Demo with 4K display and two secondary displays

Renesas R-Car H3 Demo with 4K display and two secondary displays

You can find more details on Renesas R-Car H3 page.

Via Nikkei Technology

AMD to Launch ARM Cortex A57 “Amur” Mobile SoCs in 2015, ARM “K12” Mobile SoCs in 2016

May 1st, 2015 10 comments

AMD started using ARM Cortex A5 to add TrustZone security to their x86 processor, they followed with their ARM based Opteron A1100 processor for server last year, recently they announced Hierofalcon embedded processors powered by up to eight Cortex A57 processor, and starting this year and beyond, the company will launch “ultra-low power’ mobile SoCs  using ARM cores, at least according to a leaked roadmap.

AMD Roadmap 2015 - 2016 (Click to Enlarge)

AMD Roadmap 2015 – 2016 (Click to Enlarge)

Two ARM families are planned:

  • “Amur” APU planned for 2015 with:
    • Up to 4 ARM Cortex A57 cores
    • GCN Graphics Compute Units
    • AMD Secure Processor (Trustzone?)
    • ~2W TDP
    • 20nm process, FT4 BGA package
  • “Styx” APU planned for 2016 with:
    • Up to two “K12” CPU cores. These should be high performance custom-designed ARM cores.
    • Next-gen GCN Graphics Compute Units
    • Full HSA 1.0 support (Heterogeneous System Architecture)
    • AMD Secure Processor
    • ~2W TDP
    • 14 nm process, FT4 BGA package

With this kind of thermal dissipation, AMD Android and Windows tablets are the likely candidates for such chips, as well as certainly low power mini PCs and HDMI sticks.

Via Liliputing and CPU World

PS: I will be on the road for some time, so I’ll post a bit less often, maybe 4 to 5 posts a week, and as usual tips / post ideas will be very welcome.