Intrinsyc Open-Q 820Pro SoM Comes with a Faster Snapdragon 820E Processor, 4GB RAM

Snapdragon 820E Development Board

Intrinsyc Open-Q 820 system-on-module was introduced in 2017 with a Qualcomm Snapdragon 820 processor, 3GB RAM, and a built-in wireless module for 802.11ac WiFi 5, and Bluetooth 4.1 connectivity. The company has now announced an almost identical ultra-compact module but based on Qualcomm Snapdragon 820E and featuring 4GB RAM. Open-Q 820Pro μSoM is a drop-in replacement for Open-Q820 requiring only some software changes. Snapdragon 820E is said to deliver 9% faster CPU and 5% faster GPU speeds at the same power consumption compared to Snapdragon 820. Open-Q 820Pro μSoM specifications: SoC – Qualcomm Snapdragon 820E (APQ8096SG) Embedded Platform with four Kryo cores including 2x cores @ up to 2.342GHz, and 2x cores @ up to 1.6GHz, Adreno 530 GPU @ 652.8 MHz,  Hexagon 680 DSP @ 825 MHz System Memory – Dual-channel 4 GB LPDDR4  @ 1866 MHz (PoP) Storage – 32 GB UFS 2.0 1-lane gear3 flash Connectivity Pre-certified 802.11 b/g/n/ac 2×2 MU-MIMO WiFi 5 and  Bluetooth 4.1 module …

MYiR Launches MYC-JX8MX CPU Module & MYD-JX8MX Devkit Powered by NXP i.MX 8M Processor

MYD-JX8MX Development Board

MYiR Tech Limited (aka MYiR) has launched a new NXP i.MX 8 CPU module – MYC-JX8MX – powered by NXP i.MX 8M processor, as well as the corresponding MYD-JX8MX development kit. The module integrates up to 2GB LPDDR4 RAM, 8GB eMMC flash, 256Mbit QSPI Flash, Gigabit Ethernet PHY & PMIC onboard, and I/O signals are accessible from a 314-pin MXM 3.0 expansion connector. Typical applications for the company’s latest system-on-module include scanning/imaging solutions, building automation and smart home, human-machine interface (HMI), machine vision or other consumer and industrial applications requiring multimedia capabilities. MYC-JX8MX CPU Module Specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ 1.3GHz,  Arm Cortex-M4 real-time core @ 266MHz, 2D and 3D GPU System Memory – 1GB or 2 GB LPDDR4 (supports up to 4GB LPDDR4) Storage – 8GB eMMC Flash (supports up to 64GB), 256Mbit QSPI Flash 314-pin MXM 3.0 edge connector with: 1x Gigabit Ethernet 3x Serial ports 3 x I2C, 2x SPI, 4x …

Mcuzone RK3308 SoM and MDK3308-EK Evaluation Kit are Designed for Smart Voice Applications

Mcuzone MDK3308-EK Rockchip-RK3308 Development Board

Rockchip RK3308 is a quad-core Cortex-A35 processor that was announced in 2018 together with RK3326  specifically for Smart AI solutions. While the processor is equipped with an RGB LCD output interface, it does not come with a 2D or 3D graphics accelerator, so it’s better suited to smart speakers with an optional display using a basic user interface. I’ve not seen many hardware platforms or boards based on the processor, but today I noticed “Hangzhou Wild Chip Tech” had an RK3308 system-on-module, as well as development kits for sale on Aliexpress with the module price starting at $23. Mcuzone MDK3308 Coreboard Specifications: SoC – Rockchip RK3308 quad-core Cortex-A35 processor @ 1.3 GHz with NEON and VFPv4 FPU System memory / storage configurations: 256MB DDR3/3L + 256MB NAND flash 512MB DDR3/3L + 8GB eMMC flash 2x 100-pin dual row headers (1.27mm pitch) exposing: Display – LCD interface up to 1024×600 (RGB), up to 1280×720 (LVDS) Networking – 10/100M Ethernet (apparently multiplexed …

iWave Systems Unveils iW-RainboW-G34M-SM i.MX 8M Mini/Nano System-on-Module

i.mx 8m nano system-on-module

NXP nomenclature for their i.MX 8M processors can be a little confusing. First discovered in 2016, the original i.MX 8M processor family comes with one to four Arm Cortex-A53 cores, a real-time Cortex M4 core, targets multimedia application with FullHD or  4K decoding/encoding support and is manufactured using a 28nm process. NXP then announced i.MX 8M Mini processor family in February 2018 with a 14-nm FinFET processor allowing a higher maximum CPU frequency of 2.0 GHz, less video output interfaces (no HDMI, nor DisplayPort), and optional Full HD video encoder and decoder, .e.g no 4K. Finally, earlier this year, the company unveiled NXP i.MX 8M Nano further power-optimized with the same 14nm manufacturing process, but a lower frequency of 1.5 GHz, and a Cortex-M7 core replacing the Cortex-M4 core found in previous i.MX 8M processors. This allows i.MX 8M Nano SoC to have a 2W TDP, and achieve sub-watt power consumption in IoT edge projects. We’ve already written about i.MX …

Pre-production HoneyComb LX2K 16-Core Mini ITX Arm Workstation is up for pre-order for $550

HoneyComb LX2K Arm Workstation

A few months ago, we wrote that SolidRun was working on ClearFog ITX workstation with an NXP LX2160A 16-core Arm Cortex-A72 processor, support for up to 64GB RAM, and a motherboard following the mini-ITX form factor that would make it an ideal platform as an Arm developer platform. Since then the company split the project into two parts: the ClearFog CX LX2K mini-ITX board will focus on networking application, while HoneyComb LX2K has had some of the networking stripped to keep the cost in check for developers planning to use the mini-ITX board as an Arm workstation. Both boards use the exact same LX2160A COM Express module. HoneyComb LX2K specifications: COM Module – CEx7 LX2160A COM Express module with NXP LX2160A 16-core Arm Cortex A72 processor @ 2.2 GHz (2.0 GHz for pre-production developer board) System Memory – Up to 64GB DDR4 dual-channel memory up to 3200 Mpts via SO-DIMM sockets on COM module (pre-production will work up to 2900 …

SolidRun i.MX 8M Mini SoM Includes Gyrfalcon Lightspeeur 2803S AI Accelerator

Solidrun i.MX 8M Mini SoM

There are already plenty of NXP i.MX 8M Mini boards and system-on-modules, but so far none of those included a neural network accelerator. But that’s now an option as SolidRun and Gyrfalcon teamed up to design SolidRun i.MX 8M Mini system-on-module that combines NXP i.MX 8M Mini processor with Gyrfalcon Lightspeeur 2803S NPU (Neural Processing Unit) in order to speed up AI workloads at the edge. SolidRun i.MX 8M Mini SoM Specifications: SoC (one or the other) NXP i.MX8M Mini S single core Arm Cortex-A53 processor up to 1.8 GHz, Arm Cortex-M4 core up to 400MHz, GC NanoUltra 3D GPU + GC320 2D GPU NXP i.MX8M Mini D dual-core Arm Cortex-A53 processor up to 1.8 GHz, Arm Cortex-M4 core up to 400MHz, GC NanoUltra 3D GPU + GC320 2D GPU NXP i.MX8M Mini Q quad-core Arm Cortex-A53 processor up to 1.8 GHz, Arm Cortex-M4 core up to 400MHz, GC NanoUltra 3D GPU + GC320 2D GPU NPU – Gyrfalcon Technology …

FriendlyELEC SOM-RK3399 Development Kit Targets AI & Machine Vision Applications

SOM-RK3399 Development Kit SSD Modem

FriendlyELEC is better known for their low-cost tiny single board computers, but the company has also introduced systems-on-module in the past such as Smart6818 module powered by Samsung S5P6818 octa-core processor. The company has now launched another system-on-module with SOM-RK3399, which as its name implied features Rockchip RK3399 processor, as well as a corresponding carrier board mostly designed for artificial intelligence and computer vision applications. SOM-RK3399 System-on-Module Specifications: SoC – Rockchip RK3399 big.LITTLE hexa-core processor with 2x Cortex-A72 cores up to 2.0GHz, 4x Cortex-A53 cores up to 1.5GHz, Mali-T864 GPU with support for OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11, and AFBC, and VPU capable of handling 4K VP9 and 4K 10bits H265/H264 60fps decoding, Dual VOP, etc System Memory – Dual-Channel 2GB DDR3 Storage – 16GB eMMC 5.1 flash Networking 802.11a/b/g/n/ac, Bluetooth 4.1, Wi-Fi and Bluetooth combo module (AP6356S), dual antenna interface Realtek RTL8211E Gigabit Ethernet transceiver USB – 2x USB-C ports on the module 260-pin edge connector with Storage – …

Intrinsyc Launches Open-Q 212A SoM & Qualcomm Home Hub 300 Development Kit

Snapdragon 212 Home Hub SBC

Intrinsyc has just announced the availability of the Open-Q 212A system-on-module and Home Hub Development Kit based on Qualcomm Home Hub 300 Platform powered by the Qualcomm APQ8009 SoC better known as Snapdragon 212. The module supports multi-mic beamforming, audio canceling, HiFi audio, as well as WiFi 5 and Bluetooth connectivity, which makes it suitable for integration into cost-sensitive home hub, home automation, and smart audio devices featuring voice control, AI, and wireless connectivity. Open-Q 212A system-on- module Open-Q 212A SoM, which should not be confused with the company’s Open-Q 212 SBC released two years ago, features for the following specifications: SoC – Qualcomm Snapdragon 212 processor (APQ8009) quad-core Arm Cortex-A7 @  1.267GHz with Adreno 304 GPU, Qualcomm QDSP6 DSP System Memory – 1GB LPDDR3 RAM Storage – 4GB eMMC Flash storage Video – [email protected] playback;  up to 720p playback with H.264 (AVC) and H.265 (HEVC); up to 720p H.264 (AVC) capture Audio – Qualcomm WCD9326 Hi-Fi audio codec Wireless …