Getting a 3-inch Smartphone in 2020? You can with Unihertz Jelly 2 (Crowdfunding)

Most smartphones have 5″ or larger displays these days as it’s just more convenient to read emails, browse the web, or play games, than the smaller displays we had ten years ago. But some people may still prefer smaller smartphones that are lighter and really fit into any pockets. Those are just pretty hard to find, luckily some companies such as Unihertz are filling the needs for this niche market. Two years ago, the company introduced the Unihertz Atom smartphone with a 2.4″ display, and earlier this year launched Atom XL 4″ smartphone, but the company is now preparing to launch a new crowdfunding campaign for Jelly 2 smartphone powered by a MediaTek Helio P60 processor and equipped with a 3-inch display. Unihertz Jelly 2 specifications: SoC – MediaTek Helio P60 octa-core with four Arm Cortex-A73 up 2.0 GHz and four Arm Cortex-A53 up to 2.0 GHz, Arm Mali-G72 MP3 at 800MHz, System Memory – 6GB RAM Storage – 128GB …

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UFS 3.1 Storage Devices to Deliver Better Performance, Lower Power Consumption

JEDEC first introduced UFS 3.0 embedded flash in September 2017 with promises of 2.4GB/s transfer rates, and somehow this was bumped to 2.9GB/s (23.2 Gbps) when UFS 3.0 specification was published in January 2018. JEDEC has now published UFS 3.1 specification with the same theoretical performance, but some new features that should improve write performance, random read performance, as well as lower power consumption and costs. Precisely two documents are now available for purchase, unless you work for a JEDEC member, in which case those are free downloads: The Universal Flash Storage (UFS) version 3.1, JESD220E. An optional new companion standard, JESD220-3: UFS Host Performance Booster (HPB) Extension. The first defines three main improvements as part of UFS 3.1: Write Booster – an SLC non-volatile cache that amplifies write speed DeepSleep – a new UFS device low power state targeting lower-cost systems that share UFS voltage regulators with other functions Performance Throttling Notification – allows the UFS device to notify …

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Samsung Exynos 9820 Application Processor Supports 2 Gbps LTE, 8K Videos, UFS 3.0 Storage

Exynos 9820

Samsung has just unveiled a new high-end Exynos processor that comes with an enhanced NPU (Neural Processing Unit), and an LTE Advanced Pro modem supporting 2.0 Gbps downloads. Exynos 9820 is a tri-cluster octa-core processor with two custom Arm cores, two Cortex-A75 cores, and four Cortex-A55 cores coupled with an Arm Mali-G76 MP12, and manufactured using Samsung’s latest 8nm LPP FinFET process, which reduces power consumption by up to 10 percent compared to 10nm LPP process. Samsung Exynos 9820 key features and specifications: CPU – Dual-core custom CPU +  dual-core Cortex-A75 + quad-core Cortex-A55 GPU – ARM Mali-G76 MP12 Integrated NPU Memory I/F – LPDDR4x Storage I/F – UFS 3.0, UFS 2.1 Display – WQUXGA (3840×2400), 4K UHD (4096×2160) Cellular Connectivity LTE Modem – LTE-Advanced Pro Cat.20 8CA 2Gbps (DL) / Cat.20 3CA 316Mbps (UL) 4×4 Multiple-Input, Multiple-Output (MIMO), 256-QAM (Quadrature Amplitude Modulation), and Enhanced Licensed-Assisted Access (eLAA) technology. Camera – Up to 22MP rear camera, up to 22MP front-facing …

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Hikey 970 Development Board is Now Up for Pre-order for $299.99

Four A.I. development boards compliant with 96Boards specifications were announced at Linaro Connect HK 2018 last month: HiKey 970, Ultra96, as well as ROCK960 PRO & Enterprise Edition. So for we only knew pricing for Ultra96 ($249), but I’ve now noticed Hikey 970 “Super Edge AI Computing Platform”  is now up for pre-order for $299.99 on Lenovator website, with shipping planned for the end of April. [Update: Also found on Seeed Studio for the same price] Hikey 970 specifications: SoC – Huawei/Hisilicon Kirin 970 with 4x Cortex A73 @ 2.36GHz,  4x Cortex A53 @ 1.8GHz, Arm Mali G72-MP12 GPU, NPU (Neural Processing Unit) with 256MAC/cycle @ 960MHz System Memory – 6GB 1866MHz, 4 Channel LPDDR4x Storage – 64GB UFS storage, micro SD card slot, PCIe Gen3 on M.2 M key connector Video Output – HDMI 1.4 type A up to 1080p60 (TBC), 1x 4-lane MIPI DSI (via HS expansion connector) Video – MPEG2 @ 80 Mbps, MPEG4 @ 50 Mbps, …

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Samsung Exynos 9610 (7 Series) Processor Unveiled with Full HD 480 FPS Slow-Motion Support

Samsung has announced yet another Exynos 7 series application processor with  Exynos 9610, built on Samsung’s 10-nanometer (nm) FinFET process, and supporting premium features such as deep learning-based image processing and slow motion video recording at 480 frames per second in full HD. The SoC includes four Cortex-A73 cores, four Cortex-A53, and Arm Mali-G72MP GPU, a sensor hub based on a Cortex M4F real-time core, an LTE Cat 13 modem, 802.11ac WiFi and more. Samsung Exynos 9610 key specifications: CPU – Quad core Arm Cortex-A73 @ up to 2.3 GHz, quad core Arm Cortex-A53 @ up to 1.6 GHz GPU – Arm Mali-G72 MP3 Memory I/F – LPDDR4x Storage I/F – UFS 2.1, eMMC 5.1 Display – Up to WQXGA (2560×1600) Camera – Rear: 24MP; Front: 24MP,; Dual Camera: 16+16MP Video – 4K UHD 120fps encoding and decoding with HEVC/H.265), H.264, VP9 Connectivity LTE Modem –  LTE Cat.12 3CA 600Mbps (DL) / Cat.13 2CA 150Mbps (UL) Wi-Fi 802.11ac 2×2 MIMO, …

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Mediatek Helio P60 Cortex A73/A53 Mobile Processor Includes NeuroPilot AI technology

Neural Network Accelerators (NNA) may have become a must-have block in high-end mobile processors. Huawei Kirin 970, Samsung Exynos 9810, and Qualcomm Snapdragon 845 (via its Hexagon DSP) processors all come with NNA or NPU (Neural Processing Unit) to speed up tasks and comsume less power for tasks related to artificial intelligence / machine learning. Mediatek has also jumped on the bandwagon with Helio P60 chipset featuring four Cortex A73 cores, four Cortex A53 cores, an Arm Mali-G72MP3 GPU and a multi-core mobile APU (AI Processing Unit) leveraging the company’s NeuroPilot AI technology. Mediatek P60 key specifications: CPU – big.LITTLE Octa-core with four Arm Cortex-A73 up 2.0 GHz and four Arm Cortex-A53 up to 2.0 GHz GPU – Arm Mali-G72 MP3 at 800MHz Multi-core AI processing unit (Mobile APU) – 280 GMAC/s; offers deep learning facial recognition, object and scene identification, user behavior-informed performance and other AI and AR application enhancements. System Memory – Up to 8GB, dual-channel LPDDR4x @ …

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HiKey 960 Android Development Board Gets a 4GB RAM Version for $250

Hikey 960 development board is one of the most powerful Arm boards on the market thanks to Huawei/Hisilicon Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 cores, and a Mali-G71 MP8 GPU, fast storage with 32GB UFS 2.1 flash, and 3GB LPDDR3 memory. Like the earlier Hikey (620) board, the board is also an official reference board for AOSP, so you should be able to run the latest Android version, and also play with sensors using Neonkey SensorHub 96Boards mezzanine board. If you are somehow limited by the 3GB RAM on the board, you can rejoice as Seeed Studio has just launched a 4GB RAM version selling for $249, or about $10 extra. Note that shipping is only scheduled for February 2, 2018, so those are pre-orders. The rest of the specifications for Hikey 960 4GB RAM version are unchanged: SoC – Huawei Kirin 960 octa-core big.LITTLE processor with 4x ARM Cortex A73 cores @ …

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UFS 3.0 Embedded Flash to Support Full-Duplex 2.4GB/s Transfer Speeds

All my devices still rely on eMMC flash for storage, but premium smartphones, for example, make use of UFS 2.0/UFS 2.1 flash storage with performance similar to SSD, with Samsung UFS 2.0 storage achieving up to 850MB/s read speed, 260 MB/s write speed, and 50K/30K R/W IOPS. UFS 3.0 promises to roughly double the performance of UFS 2.0/2.1 with transfer rates of up to 2.4 GB/s, and separately, the UFS Card v2.0 standard should deliver UFS 2.1 performance on removable storage. Several Chinese and Taiwanese websites, including CTimes and Benchlife, have reported that companies have started getting UFS 3.0 & UFS Card v2.0 licenses from JEDEC, and Phison is working on a controller to support both new standards, and scheduled to launch in 2018. Premium smartphone SoC are only expect to support UFS 3.0 in 2019 and beyond, and hopefully by that time eMMC will have been replaced by UFS 2.0/2.1 in entry level and mid range devices. The outlook for …

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