Jean-Luc Aufranc (CNXSoft), Author at CNX Software - Embedded Systems News

June 2, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Bestechnic BES2700YP Arm Cortex-M55 Bluetooth Audio SoC targets headphones, earbuds, portable speakers

Bestechnic BES2700YP is an Arm Cortex-M55 Bluetooth Audio SoC designed for Smart earbuds with adaptive ANC, Smart Bluetooth headphones/headsets, ANC hearing-aids, Bluetooth speakers, and other portable audio devices When I wrote about the Ambiq Apollo330 Plus SoC family last week, I realized it was the first time I covered Arm Cortex-M55 microcontrollers with built-in wireless, in that case Bluetooth LE 5.4 and 802.15.4 (Thread/Matter) radios, and that’s how I came across the BES2700YP SoC with a more narrow use cases since it’s made for Smart Bluetooth audio applications. BES Technic BES2700YP key features and specifications: CPU Subsystem – Arm Cortex-M55 core Sensor Hub Subsystem – Arm STAR-MC1 core (improved Arm Cortex-M33 core) with sensor engine, BECO NPU, and VAD (Voice Activity Detection) Memory – 4 MB SRAM shared across the CPU, Bluetooth, and Sensor Hub cores Storage – Flash in package, boot ROM Bluetooth Subsystem Arm STAR-MC1 core (Arm Cortex-M33 […]

May 30, 2025May 30, 2025 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Battery-powered SQUiXL devkit pairs 4-inch touchscreen display with ESP32-S3 WiFi and Bluetooth SoC

Unexpected Maker’s SQUiXL is a battery-powered ESP32-S3 WiFi and Bluetooth IoT controller and development platform with a 4-inch touchscreen display with 480×480 resolution. Designed for makers, hardware engineers, embedded developers, and home automation enthusiasts, the SQUiXL integrates with 8MB PSRAM and a 16MB SPI flash for plenty of resources for the firmware. Other features include a microSD card, an amplifier with speaker connector, a haptic driver and motor, an RTC, and a STEMMA/Qt connector for expansion. SQUiXL specifications: WiSoC – Espressif Systems ESP32-S3 CPU – Dual-core Tensilica LX7 @ up to 240 MHz with vector instructions for AI acceleration Memory – 512KB RAM Wireless – 2.4 GHz WiFi 4 and Bluetooth 5.0 LE + Mesh Memory – 8MB octal PSRAM Storage 16MB QSPI flash MicroSD card slot (multiplexed with audio amplified) Display – 4-inch 480×480 RGB display with capacitive touch (GT911) Audio MAX98357A I2S Audio Amplifier (multiplexed with microSD card […]

May 30, 2025May 30, 2025 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Ambiq Apollo330 Plus SoC Series Cortex-M55 MCU family offers optional Bluetooth 5.4 LE and 802.15.4 radios

Ambiq Apollo330 Plus SoC Series is a new family of ultra-low-power, sub-threshold Arm Cortex-M55 microcontrollers with optional Bluetooth 5.4 LE and 802.15.4 radios for IoT and Smart Home applications. The Ambiq Apollo330 Plus MCU itself appears to be a cost-down version of the Ambiq Apollo510 general-purpose Cortex-M55 MCU introduced last year, with the removal of display and graphics support, lower RAM and NVM capacities (2MB/2MB vs. 3.75MB/4MB), and fewer I/Os, but with a wider 1.71 to 3.63V voltage supply range. Two other SKUs add wireless: the Apollo330B Plus includes a Bluetooth 5.4 LE radio, and the Apollo330M Plus an extra 802.15.4 radio for Zigbee, Thread, and Matter as a multiprotocol SoC. Ambiq Apollo330 Plus specifications: CPU Core – 32-bit Arm Cortex-M55 @ 96 MHz / 250 MHz (turboSPOT) with Helium technology, Network coprocessor Memory- 2MB SRAM Storage 2MB NVM SDIO v3.0 and eMMC flash controllers Wireless Arm Cortex-M4F network processor […]

May 29, 2025May 29, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

xMEMS µCooling fan-on-a-chip adds solid-state active cooling to SSDs for laptops and data centers

xMEMS Labs µCooling fan-on-a-chip solution now supports solid-state drives (SSDs) used in NVMe M.2 SSDs used in laptop PCs and enterprise E3.S form factor SSDs used in AI data centers with a temperature reduction of as much as 30%. The solution is based on the same technology as the xMEMS XMC-2400 1 mm-thin micro cooling fan-on-a-chip introduced last year, and aims to replace passive heat spreaders and flow from system fans with a hyper-localized active cooling directly to the NAND flash and controller ICs from within the SSD itself, making it mostly invisible to the user and enabling thinner and more dense designs. If the illustration pictured above matches reality, the xMEMS µCooling fan-on-a-chip is not placed in the chips themselves, contrary to a similar solution like AirJet, but in a strategic location on the SSD’s PCB, so that it can blow air to cool the chips. The chip is […]

May 29, 2025June 2, 2025 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

OBJEX Link S3LW ultra-low-power ESP32-S3 LoRaWAN board takes up to 100W power input

OBJEX Link S3LW is a small development board based on the ultra-low-power ELPM-S3LW module with ESP32-S3 MCU and LoRaWAN connectivity and the ability to take 100W input via USB-C or a 2-pin terminal block for driving motors, controlling RGB LED strips, and other high-power projects. It’s compliant with the USB PD standard, features two 28-pin headers and a STEMMA I2C connector for expansion, as well as a built-in CP2102/CP2104 USB to serial bridge for debugging, and a few buttons. The company also offers an OBJEX ELPM-S3 module and OBJEX Link S3 board with the same features, minus LoRa/LoRaWAN support. OBJEX Link S3LW specifications: Wireless module ELPM-S3LW v1.2 Wireless SoC – ESP32-S3FN8 CPU – Dual-core 32-bit Xtensa LX7 microcontroller with AI vector instructions up to 240MHz, RISC-V ULP co-processor Memory – 512KB SRAM Storage – 8MB flash Wireless – 2.4GHz WiFi 4 (802.11b/g/n), Bluetooth 5.0 BLE + Mesh LoRa support LoRa […]

May 29, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

NXP MCX W72x Cortex-M33 wireless SoC supports Bluetooth 6.0 with Channel Sounding, Zigbee, Thread and Matter

NXP MCX W72x series Cortex-M33 wireless SoCs support for Bluetooth 6.0 and an 802.15.4 radio for Zigbee, Thread, and Matter. The MCX W72x family also implements Bluetooth Channel Sounding for accurate distance measurements with the help of a Localization Compute Engine (LCE) to reduce latency. It’s the second MCU part of the MCX W wireless family following the MCX W71x MCU, and the new MCX W72x wireless microcontroller is offered with up to 264 KB SRAM, 2MB flash, features a dedicated Cortex-M33 core to handle Bluetooth and 802.15.4 radios, implements an EdgeLock Secure Enclave for security, and integrates plenty a range of I/Os in a 48-pin package. NXP MCX W72x key features and specifications: MCU cores and memory/storage Application core – Arm Cortex-M33 core up to 96 MHz with 2 MB program Flash with ECC, 264 kB SRAM with ECC and parity Networking core – Arm Cortex-M33 core with dedicated […]

May 28, 2025May 31, 2025 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Radxa ROCK 4D SBC – A Raspberry Pi lookalike powered by Rockchip RK3576 SoC with 6 TOPS AI accelerator

Radxa ROCK 4D is yet another Rockchip RK3576 SBC, but offered in a credit card form factor similar to the Raspberry Pi 3 model with the usual 40-pin GPIO header, Gigabit Ethernet ports, and four USB ports. We first noticed it when we covered the Radxa Dual 2.5G Router HAT, and I’ve just seen it added to the Linux 6.15 release, so I thought it might be a good time to cover it, especially since it’s already for sale on Allnet and AliExpress starting at $31 plus shipping. Radxa ROCK 4D specifications: SoC – Rockchip RK3576 or RK3576J (industrial-grade version) CPU – Octa-core CPU with 4x Cortex-A72 cores at 2.2 GHz, 4x Cortex-A53 cores at 2.0 GHz GPU – Arm Mali-G52 MC3 GPU with support for OpenGL ES 1.1, 2.0, and 3.2, OpenCL 2.0, and Vulkan 1.2 NPU – 6 TOPS (INT8) AI accelerator with support for INT4, INT8, INT16, […]

May 28, 2025May 28, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

UP Squared TWL / Squared Pro TWL boards are powered by Intel Core 3 Processor N355, N250, or N150 Twin Lake CPU

AAEON has just introduced upgrades to its Alder Lake-N-powered UP Squared 7100 and UP Squared Pro 7000 SBCs with the UP Squared TWL and UP Squared Pro TWL development boards equipped with Twin Lake CPUs, either Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150. Both SBCs can operate in the -20°C to 70°C temperature range, support up to three independent displays, and offer M.2 expansion sockets for storage and wireless, a 40-pin GPIO header, RS232/RS485 interfaces, and three USB ports. However, the UP Squared TWL is a smaller 90×85.6mm SBC with dual gigabit Ethernet, and the UP Squared Pro TWL has a slightly larger design (101.6×101.6mm) with dual 2.5GbE, a SATA port, MIPI CSI camera support, and optional cellular connectivity. UP Squared TWL Specifications: Twin Lake SoC (one or the other) Intel Processor N150 quad-core processor @ up to 3.6 GHz (Turbo) with 6MB cache, 24EU […]