Infineon PASCO2V15 CO2 sensor achieves ±50 ppm accuracy with built-in microphone and IR emitter

PASCO2V15 XENSIV PAS CO2 Sensor

Infineon’s PASCO2V15 CO2 sensor is a compact and precise carbon dioxide sensor that uses photoacoustic spectroscopy (PAS) leveraging its built-in microphone and IR emitter to detect CO2 levels by measuring pressure changes caused by the absorption of infrared light by CO2 molecules. The sensor is highly precise (±50 ppm ±5%) and can cover a wide range (0 to 32,000 ppm). it also includes features like pressure compensation and automatic baseline offset correction for reliability. With its small size and low power consumption, the PASCO2V15 can be integrated into HVAC systems, room controllers, smart thermostats, air purifiers, and other devices to optimize ventilation and improve energy efficiency. PASCO2V15 CO2 sensor specifications Sensor technology  – Photoacoustic Spectroscopy (PAS) with Non-Dispersive Infrared (NDIR) principles Gas measured – Carbon Dioxide (CO2) Measurement range – 0 to 32,000 ppm Accuracy – ± (50 ppm +5%) of reading between 400 ppm and 3000 ppm Output Interfaces […]

Altera’s 7nm Agilex 3 SoC FPGA features Cortex-A55 cores, AI Tensor Block, DSP, 10 GbE, and more.

Altera Agilex 3 AI SoC FPGA

Altera, an independent subsidiary of Intel, has launched the Altera Agilex 3 SoC FPGA lineup built on Intel’s 7nm technology. According to Altera, these FPGAs prioritize cost and power efficiency while maintaining essential performance. Key features include an integrated dual-core Arm Cortex A55 processor, AI capabilities within the FPGA fabric (tensor blocks and AI-optimized DSP sections), enhanced security, 25K–135K logic elements, 12.5 Gbps transceivers, LPDDR4 support, and a 38% lower power consumption versus competing FPGAs. Built on the Hyperflex architecture, it offers nearly double the performance compared to previous-generation Cyclone V FPGAs. These features make this device useful for manufacturing, surveillance, medical, test and measurement, and edge computing applications. Altera’s Agilex 3 AI SoC FPGA specifications Device Variants B-Series – No definite information is available C-Series – A3C025, A3C050, A3C065, A3C100, A3C135 SoC FPGAs Hard Processing System (HPS) – Dual-core 64-bit Arm Cortex-A55 up to 800 MHz that supports secure […]

u-blox X20 all-band GNSS module offers centimeter-level accuracy, u-blox F9 pin-to-pin compatibility

u blox X20 all band GNSS module

u-blox has recently launched the X20 all-band GNSS module with an integrated L-band receiver that supports all available GNSS satellite signals (L1/L2/L5/L6) and can provide centimeter-level accuracy globally. The module also includes PPP (Precise Point Positioning) correction on top of RTK (Real-time Kinematic) and features like end-to-end security functions, advanced jamming/spoofing detection, and other software features. These features make this device useful for industrial automation, automotive, UAVs, and ground robotics applications. Multi-band GNSS receivers using L1, L2, L5, and the new L6/E6 band frequencies enhance accuracy, reliability, security, and other benefits. That includes better PNT (Positioning, Navigation and Timing) and RTK performance, access to global precise point positioning (PPP) services like Galileo HAS, faster convergence times in PPP for industrial and automotive use, and access to regional PPP services like MADOCA-PPP. Additionally, it helps comply with regional regulations like AIS-140 for NavIC in India and improves jamming and spoofing immunity […]

NXP i.MX RT700 dual-core Cortex-M33 AI Crossover MCU includes eIQ Neutron NPU and DSPs

NXP i.MX RT700 AI crossover MCU block diagram

NXP has recently announced the release of  NXP i.MX RT700 RT700 AI crossover MCU following the NXP i.MX RT600 series release in 2018 and the i.MX RT500 series introduction in 2021. The new i.MX RT700 Crossover MCU features two Cortex-M33 cores, a main core clocked at 325 MHz with a Tensilica HiFi 4 DSP and a secondary 250 MHz core with a low-power Tensilica HiFi 1 DSP for always-on sensing tasks. Additionally, it integrates a powerful eIQ Neutron NPU with an upgraded 7.5 MB of SRAM and a 2D GPU with a JPEG/PNG decoder. These features make this device suitable for applications including AR glasses, hearables, smartwatches, wristbands, and more. NXP i.MX RT700 specifications: Compute subsystems Main Compute Subsystem Cortex-M33 @ up to 325 MHz with Arm TrustZone, built-in Memory Protection Unit (MPU), a floating-point unit (FPU),  a HiFi 4 DSP and supported by NVIC for interrupt handling and SWD […]

ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

ADLINK AVA 1000 T2G gateway top view

The ADLINK AVA-1000 T2G gateway is a rugged, EN50155-compliant T2G (Train-to-Ground) gateway designed for railway and industrial environments. Powered by a choice of NXP i.MX8M Plus Quad Cortex-A53 processor or an Intel Processor N50 Alder Lake-N processor. The i.MX8M Plus model is equipped with up to 8GB LPDDR4 and a 64GB eMMC flash whereas the Alder Lake variant features up to 4GB LPDDR5 memory and a 32GB eMMC flash. In terms of connectivity, the gateway features three M12 GbE ports and supports a wide range of options including 5G, WiFi 6, and GNSS. The AVA-1000 T2G gateway’s fanless design, wide operating temperature range, and 24-110V DC input ensure reliable operation in industrial environments. Additionally, its compliance with EN50155 and other industrial standards makes it ideal for various industrial applications. AVA-1000 T2G gateway specifications System Processor (multiple options) NXP i.MX8M Plus quad-core Cortex-A53 processor @ up to 1.8 GHz with Cortex-M7 […]

reServer Industrial J501 – An NVIDIA Jetson AGX Orin carrier board with 10GbE, 8K video output, GMSL camera support

reServer Industrial J501 Carrier board

Seeed Studio’s reServer Industrial J501, a Jetson AGX Orin carrier board designed for building Edge AI systems. With up to 275 TOPS of exceptional AI performance, this carrier board is designed for advanced robotics and edge AI applications for industrial environments. The carrier board features GbE and 10GbE LAN via RJ45 ports, three USB 3.1 ports, an HDMI 2.1 output, and multiple M.2 slots for expansion, including support for wireless connectivity via the M.2 Key B socket. Additionally, it has support for 8K video decoding and up to 8 GMSL cameras via an optional extension board. reServer Industrial J501 Jetson AGX Orin carrier board specification System-on-Module (one or the other) SoM –  NVIDIA Jetson AGX Orin 64GB with CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ […]

Portwell PEB-2274 3.5-inch fanless Intel Atom x6425E SBC offers triple display support, dual GbE, three M.2 sockets, and more

PEB 2274 3.5 Inch Elkhart Lake SBC

Portwell has recently launched PEB-2274, a 3.5-inch fanless SBC built around Intel Atom x6425E Elkhart Lake SoC. Key features include up to 32GB DDR4 memory, two Gigabit Ethernet ports, three M.2 sockets for storage and expansion, and a wide 9V to 36V DC power input. Additionally, it has various display interfaces (HDMI, DP, LVDS), multiple serial ports, USB, and audio options. We have already covered several other 3.5-inch inch Elkhart Lake SBCs with dual Ethernet ports including the Avalue ECM-EHL 3.5-inch SBC, Congatec Conga-PA7 Pico-ITX board, the iBase IB836 3.5-inch SBC, and the AAEON GENE-EHL5 SBC. All these boards support dual Ethernet and some of them have support for triple ethernet ports. But what’s unique about the PEB-2274 is that it has dual GbE ethernet, triple display, and a design specifically for industrial applications. Portwell PEB-2274 specifications: SoC – Intel Atom x6425E quad-core processor @ 2.00 GHz / 3.00 GHz […]

Adafruit Feather RP2350 board with HSTX port enables video output and display interfaces

Adafruit Feather RP2350 with HSTX Port

“Adafruit Feather RP2350 with HSTX port” is a Raspberry Pi RP2350 MCU development board that features an onboard 22-pin high-speed serial transmit interface (HSTX) port. The board also features a built-in 200mA+ LiPo charger, an RGB LED, a STEMMA QT connector, and a USB Type-C port for power and programming. The board is compatible with FeatherWings and supports development with various programming languages. These features make this board suitable for a wide range of applications, from embedded projects and IoT devices to educational purposes and prototyping. Previously we have covered a variety of RP2350-powered development boards, including the MOTION 2350 Pro, designed for robotics and motor control; the Solder Party’s RP2350 Stamp, ideal for space-constrained applications; and the WIZnet Raspberry Pi RP2350 boards designed for IoT and internet-connected applications. Feel free to check those out if you want to take a look at some of the unique development boards. Adafruit […]

UP 7000 x86 SBC