Debashis Das, Author at CNX Software

July 16, 2026 by Debashis Das - No Comments

OpenInfrared Point is an ESP32-S3 powered universal remote hub with Infrared, BLE, NFC, audio streaming (Crowdfunding)

OpenInfrared Point is a universal remote hub built around ESP32-S3 that lets users control compatible devices from a smartphone by scanning a QR code or tapping an NFC tag, eliminating the need for dedicated remote controls. Powered via USB-C, the Point hub can learn IR codes from existing remote controls and supports infrared, IP (HTTP), and Bluetooth Low Energy (BLE) device control, with RF support planned as a future add-on. Hardware features include an IR output for external emitters, an audio input for private TV audio streaming, built-in NFC, QR-code access, and support for controlling TVs, projectors, AV receivers, air conditioners, streaming devices, and other compatible equipment. OpenInfrared Point specifications: Wireless Module – ESP32-S3-WROOM-1 SoC – Espressif Systems ESP32-S3 CPU – Dual-core Tensilica LX7 up to 240 MHz with vector extension for AI/ML workloads RAM – 512KB SRAM; 8MB PSRAM Wireless – WiFi 4 and Bluetooth LE 5 Storage – 16MB […]

July 15, 2026 by Debashis Das - 2 Comments

Bigme Hibreak Dual 2 – An Android 16 smartphone with 6.13-inch 80fps E-Ink and 5-inch LCD display (Crowdfunding)

Bigme has launched the Hibreak Dual 2, an Android 16 smartphone with a 6.13-inch 80fps E-Ink display on the front and a 5-inch LCD on the rear. Built around the MediaTek Dimensity 8300 processor and supports dual 5G connectivity, positioning it as an E-Ink smartphone with flagship-class hardware. The front E-Ink can be used for reading, writing, and general everyday use, whereas the LCD in the back serves as a conventional smartphone display for applications that require higher refresh rates and full-color output, like video gaming and navigation. This dual-screen setup allows users to switch between the two displays depending on the task. Bigme Hibreak Dual 2 specifications: SoC – MediaTek Dimensity 8300 CPU – Octa-core processor with 4x Arm Cortex-A715 and 4x Cortex-A510 GPU – Arm Mali-G615 VPU Video Encoding – H.264, HEVC Video Playback – H.264, HEVC, VP9, AV1 AI accelerator – MediaTek NPU 780 Memory – 12GB […]

July 13, 2026July 12, 2026 by Debashis Das - No Comments

Raspberry Pi gets 10BASE-T1S/T1L Single Pair Ethernet (SPE) HAT+ board

Germany-based Brechel Electronic has launched two new Single Pair Ethernet (SPE) expansion boards for Raspberry Pi platforms: the BE-IIS-HPP-T1S and the BE-IIS-HPP-T1L. Designed for technology evaluation, industrial network prototyping, and educational laboratory use, these boards add 10 Mbit/s Ethernet communication over a single twisted pair to standard Raspberry Pi SBCs. The BE-IIS-HPP-T1S is based on the Microchip LAN8651 10BASE-T1S MAC-PHY and supports IEEE 802.3cg Single Pair Ethernet over multidrop networks with up to 8 nodes, enabling distances up to 25 meters on a shared bus. For longer-reach point-to-point links, the company offers the BE-IIS-HPP-T1L, built around Analog Devices ADIN1110 MAC-PHY. Both boards are part of the BE-IIS HAT++ ecosystem, which allows multiple industrial communication HATs to be stacked on a single Raspberry Pi without running into SPI or GPIO resource conflicts. Brechel Electronic 10BASE-T1L and 10BASE-T1S specifications: Compatibility – Raspberry Pi HAT+ compliant T1L – Supports Pi 3, 4, 5, and Zero […]

July 9, 2026July 9, 2026 by Debashis Das - No Comments

Makerfabs MaUWB for Home Assistant – An ESP32-S3 UWB module with PoE and enclosure

Makerfabs MaUWB for Home Assistant is an ESP32-S3-based Ultra-Wideband (UWB) module designed for indoor positioning and Real-Time Location Systems (RTLS). It runs ESPHome for Home Assistant integration, enabling it to be used as part of a UWB-based positioning system to track tagged devices in homes, offices, and other indoor environments. The module combines an ESP32-S3 with a MaUWB UWB module based on the Qorvo DW3000, featuring a PA/LNA for long-range ranging. Compared to the earlier ESP32-S3 version, it drops the OLED and adds a WIZnet W5500 Ethernet controller that supports PoE. The module also supports Wi-Fi 4 and Bluetooth 5.0, and comes in an enclosure for fixed installations. Makerfabs MaUWB for Home Assistant specifications: Wireless Module – ESP32-S3-WROOM-1 SoC – Espressif Systems ESP32-S3 CPU – Dual-core Tensilica LX7 up to 240 MHz with vector extension for AI/ML workloads RAM – 512KB SRAM; 8MB PSRAM Wireless – WiFi 4 and Bluetooth LE 5 […]

July 8, 2026July 8, 2026 by Debashis Das - 6 Comments

KKSB 10-inch and 19-inch rack panels target Raspberry Pi clusters, support Pi HATs and active coolers

KKSB Cases has introduced a series of rack panels designed for Raspberry Pi clusters in standard rack enclosures. The lineup includes a 10-inch 1U model for two Raspberry Pi boards, a 19-inch 1U model for five boards, and a 19-inch 2U model for up to ten boards. All the panels support Raspberry Pi 5, Raspberry Pi 4, Raspberry Pi 3, Pi 2, and other boards sharing the same mounting hole pattern. The rack panels are made from powder-coated steel and expose the USB and Ethernet ports on the front of the rack for easier cable management. Each slot provides room for Raspberry Pi HATs and the official Raspberry Pi active cooler. KKSB also includes hex standoffs and 40-pin GPIO headers so HATs can be installed above the SBCs when additional clearance is required. Each Raspberry Pi is first attached to an individual mounting tray, which is then secured into the […]

July 6, 2026July 5, 2026 by Debashis Das - No Comments

Tiny Calixto Systems AM62L STAMP SOM targets industrial automation, HMI applications, EV chargers

Calixto Systems has introduced the AM62L STAMP SOM, a tiny (40x40mm) system-on-module around the Texas Instruments AM62L dual-core Arm Cortex-A53 CPU running at up to 1.25 GHz, along with an evaluation kit. Designed for embedded Linux applications, the module targets industrial automation, HMIs, EV chargers, and smart retail. Calixto AM62L STAMP SOM The SoM integrates up to 2GB LPDDR4x RAM and 8GB or 16GB eMMC storage, along with Gigabit Ethernet, two USB 2.0 OTG interfaces, dual SD interfaces, MIPI DSI and parallel RGB display support, McASP audio, and a wide range of industrial I/Os, including CAN FD, eight UARTs, four SPI buses, five I2C buses, ADC, DAC, PWM, GPIO, and a GPMC interface. It also integrates hardware security features such as AES encryption, RSA/ECC acceleration, DRBG, TRNG, and a unique device ID for secure embedded applications. AM62L STAMP SOM specifications: SoC – Texas Instruments Sitara AM62Lx single-core/dual-core Arm Cortex-A53 processor @ […]

July 6, 2026July 5, 2026 by Debashis Das - 1 Comment

u-blox F11 low-power dual-band GNSS chips and modules consume just 7mW in LEAP mode

u blox UBX F11270 KB and UBX F11170 CC L1,L5 dual band GNSS with just 7mW power consumption

u-blox has introduced the F11 platform, a new family of low-power GNSS chips and modules that includes the UBX-F11270-KB and UBX-F11170-CC dual-band GNSS chips, the UBX-M11070-KB chip (L1-only), the MAX-M11N module (L1-only), and the EVK-F112 evaluation kit. These are designed for battery-powered applications such as aftermarket telematics, asset tracking, wearables, drones, micromobility, and other industrial and consumer devices. Among those, the UBX-F11270-KB and UBX-F11170-CC support dual-band L1/L5 GNSS that automatically switch between L1/L5 operation based on signal conditions. The UBX-M11070-KB chip and MAX-M11N module are L1 band only, but all the modules and chips in the series support LEAP (Low Energy Accurate Positioning) mode with a typical power consumption of around 7 mW. Other features include indoor detection, polygonal geofencing, and multipath mitigation. u-blox UBX-F11270-KB and UBX-F11170-CC specifications: GNSS Engine – u-blox F11 platform Memory / Storage UBX-F11270-KB – Embedded flash memory supports firmware upgrade UBX-F11170-CC – Optional external SPI […]

July 6, 2026July 6, 2026 by Debashis Das - No Comments

AMD Versal Premium Gen 2 MoP adaptive SoC integrates 32GB LPDDR5X to shrink board footprint by 60%

AMD has announced the Versal Premium Gen 2 Memory-on-Package (MoP) adaptive SoCs, adding an integrated memory option to the Premium Gen 2 family, a topic we covered back in November 2024. While the core silicon (dual-core Cortex-A72 + dual-core Cortex-R5F + high-end FPGA fabric) remains the same, the new devices (2VP3422, 2VP3522, and 2VP3622) integrate up to 32 GB of LPDDR5X memory directly inside the package. This removes the need for external high-speed memory on the board and reduces PCB area by up to 60%. This also eliminates high-speed memory routing on the carrier board, increasing the maximum memory bandwidth to 288 GB/s. AMD Versal Premium Gen2 MoP specifications: CPU cores Dual-core Arm Cortex-A72 application core, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC Memory on Package 32 GB of LPDDR5X DRAM […]