Posted on by Jean-Luc Aufranc (CNXSoft) - 23 Comments on PiPo Snapdragon 850 2-in-1 Laptop to Sell for around $400

PiPo Snapdragon 850 2-in-1 Laptop to Sell for around $400

PiPo Snapdragon 850 Laptop

Current Qualcomm based Windows 10 laptops are mostly interesting for people wanting all-day battery life and/or being always connected over 4G LTE, as they are still pretty expensive, and performance somewhat underwhelming, although Snapdragon 8cx processor should change that. Chinese-based PiPo, known for their tablets,  mini PCs and Arm Android laptops, is working on solving affordability of Arm Windows 10 laptop with their Snapdragon 850 2-in-1 laptop, heavily inspired by Huawei MateBook E 2019, and expected to sell for half the price or around $400. PiPo 2-in-1 laptop preliminary specifications: SoC – Qualcomm Snapdragon 850 octa-core Kryo 385 Arm cores clocked @ up to 2.96 GHz with Adreno 630 Visual Processing Subsystem, Hexagon 685 DSP Systmem Memory – 8GB RAM Storage – 256GB flash storage Display – 12.3″ IPS display with 3000×2000 resolution, 10-point touch Audio – 3.5mm audio jack, Connectivity – WiFi 5 802.11ac/b/g/n + 4G LTE Camera – 5.0MP front-facing camera. 13MP rear camera USB – 1x USB …

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Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on Intrinsyc Unveils Open-Q 845 µSOM and Snapdragon 845 Mini-ITX Development Kit

Intrinsyc Unveils Open-Q 845 µSOM and Snapdragon 845 Mini-ITX Development Kit

Open-Q 845 µSOM Development Kit

Intrinsyc introduced the first Qualcomm Snapdragon 845 hardware development platform last year with its Open-Q 845 HDK designed for OEMs and device makers. But the company has now just announced a solution for embedded systems and Internet of Things (IoT) products with Open-Q 845 micro system-on-module (µSOM) powered by the Snapdragon 845 octa-core processor, as well as a complete development kit featuring the module and a Mini-ITX baseboard. Open-Q845 µSOM Specifications: SoC – Qualcomm Snapdragon SDA845 octa-core processor with 4x Kryo 385 Gold cores @ 2.649GHz + 4x Kryo 385 Silver low-power cores @ 1.766GHz cores, Hexagon  685 DSP, Adreno 630 GPU with OpenGL ES 3.2 + AEP (Android Extension Pack),  DX next, Vulkan 2, OpenCL 2.0 full profile System Memory – 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz Storage – 32GB or 64GB UFS Flash Storage Connectivity Wi-Fi 5 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector Bluetooth 5.x Audio & …

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Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on Linux 5.3 Release – Main Changes, Arm, MIPS & RISC-V Architectures

Linux 5.3 Release – Main Changes, Arm, MIPS & RISC-V Architectures

Linux 5.3 Changelog

Linus Torvalds has just announced the release of Linux 5.3: So we’ve had a fairly quiet last week, but I think it was good that we ended up having that extra week and the final rc8. Even if the reason for that extra week was my travel schedule rather than any pending issues, we ended up having a few good fixes come in, including some for some bad btrfs behavior. Yeah, there’s some unnecessary noise in there too (like the speling fixes), but we also had several last-minute reverts for things that caused issues. One _particularly_ last-minute revert is the top-most commit (ignoring the version change itself) done just before the release, and while it’s very annoying, it’s perhaps also instructive. What’s instructive about it is that I reverted a commit that wasn’t actually buggy. In fact, it was doing exactly what it set out to do, and did it very well. In fact it did it _so_ well that …

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Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on Fairphone 3 Socially Responsible Android Smartphone Launched for 450 Euros

Fairphone 3 Socially Responsible Android Smartphone Launched for 450 Euros

Fairphone 3

Most phones today are disposable items, and if yours stops working for whatever reason it’s hard to repair it yourself work, and repairing it at the shop may prove to be too expensive. They are not really expandable either,  so if you want a new feature, you may have to buy a completely new phone instead of simply adding a module with the functionality. The difficulty in repairing the phone and the lack of modularity leading to electronics waste. Finally, consumer products are cost-optimized, and that’s great for your wallet, but it may come at the cost of being made by slave labor either directly at the factory, or indirectly through the mining of materials. Aren’t you already feeling bad being complicit in destroying the planet and sponsoring human suffering while reading this on your device? Good! But luckily there’s a solution with Fairphone that aims to be an ethical / socially responsible smartphone that is modular, easy to repair, …

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Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on Linaro Connect San Diego 2019 Schedule – IoT, AI, Optimizations, Compilers and More

Linaro Connect San Diego 2019 Schedule – IoT, AI, Optimizations, Compilers and More

Linaro Connect San Diego 2019

Linaro has recently released the full schedule of Linaro Connect San Diego 2019 that will take place on  September 23-27. Even if you can’t attend, it’s always interested to check out the schedule to find out what interesting work is done on Arm Linux, Zephyr OS, and so on. So I’ve created my own virtual schedule with some of the most relevant and interesting sessions of the five-day event. Monday, September 23 14:00 – 14:25 – SAN19-101 Thermal Governors: How to pick the right one by Keerthy Jagadeesh, Software Engineer, Texas Instruments With higher Gigahertz and multiple cores packed in a SoC the need for thermal management for Arm based SoCs gets more and more critical. Thermal governors that define the policy for thermal management play a pivotal role in ensuring thermal safety of the device. Choosing the right one ensures the device performs optimally with in the thermal budget. In this presentation Keerthy Jagadeesh, co-maintainer of TI BANDGAP AND …

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Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on Samsung Galaxy Book S Snapdragon 8cx Laptop to Launch soon for $1,000

Samsung Galaxy Book S Snapdragon 8cx Laptop to Launch soon for $1,000

Snapdragon 8cx laptop

Qualcomm Snapdragon 8cx was announced as the first Snapdragon processor specifically designed for connected mobile PCs (aka laptops with cellular connectivity) last December. Earlier this year we got confirmation 8cx would support 5G connectivity as an option, and in May, we got news Lenovo Limitless 5G laptop was coming and got some benchmarks showing Snapdragon 8cx with performance similar to an Intel Core i5 Kaby Lake-R processor (15 Watt TDP) while offering much longer battery life. It’s Samsung turn to announce their Snapdragon 8cx laptop with Samsung Galaxy Book S that will be available this fall for $999 and up. Samsung Galaxy Book S specifications: SoC – Qualcomm Snapdragon 8cx Compute Platform with eight 64-bit Armv8 cores in two clusters: Kryo 495 Gold cores (Cortex-A76 class) @ 2.84 GHz + Kryo 495  cores (Cortex-A55 class) @ 1.8GHz ; 7nm process; 7W TDP System Memory – 8GB RAM (LPDDR4X) Storage – 256/512GB storage (NVMe?) + MicroSD slot up to 1TB Display …

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Posted on by Tiwalade Joanna Okedara - No Comments on ASUS ROG Phone II with Snapdragon 855+ | High Performance Gaming Phone

ASUS ROG Phone II with Snapdragon 855+ | High Performance Gaming Phone

ASUS ROG Phone II Active Cooler

ASUS officially announced the launch of their new gaming phone, the ROG Phone II. The device will become the world’s first gaming phone to be powered by the new Snapdragon 855 Plus Mobile Platform. ASUS first gaming phone, the ROG Phone, launched in 2018, and it was quite popular. This ROG Phone II is an improved upon version of the first one. A unique feature of the new device is the Kryo 485 CPU in the Snapdragon 855 Plus. The CPU will run at up to 2.96GHz — a 4.2% improvement compared to the 2.84Ghz of the Snapdragon 855, while the Adreno 640 GPU is clocked 15% faster than in the current Snapdragon 855 Mobile Platform. Specifications of ASUS ROG II phone Here are the highlights of the features and specifications. Display 120Hz FHD+ AMOLED display 240Hz touch sampling rate, 49ms touch latency (compared to 87ms on the Samsung Galaxy S10+ and 85ms on the OnePlus 7 Pro according to …

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Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on Qualcomm Snapdragon 855 Plus SoC Update Closes on the 3.0 GHz Mark

Qualcomm Snapdragon 855 Plus SoC Update Closes on the 3.0 GHz Mark

Snapdragon 855 Plus

Qualcomm Snapdragon 855 was officially unveiled in December 2018, and is found in several premium phones and at least one development kit.  The processor features one Kryo 485 Gold (A76-class) core clocked @ 2.84GHz, with 7 others cores in another 3-core Kryo 485 Gold cluster @ 2.42 GHz, and a 4-core Kryo 485 Silver (A55-class) cluster clocked at 1.80 GHz. Qualcomm has now announced the Snapdragon 855 Plus processor that’s virtually the same as the original, but with the high-performance Kryo 485 Gold core frequency boosted to close to 3.0 GHz (2.96 GHz), and the Adreno 640 GPU also getting faster at 672 MHz against 585 MHz for Snapdragon 855. The differences are highlighted in bold in the comparison table below courtesy of Anandtech. SoC Snapdragon 855 Snapdragon 855 Plus (855+) CPU 1x Kryo 485 Gold (A76 derivative) @ 2.84GHz 1x512KB pL2 3x Kryo 485 Gold (A76 derivative) @ 2.42GHz 3x256KB pL2 4x Kryo 485 Silver (A55 derivative) @ 1.80GHz …

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