Linaro Connect San Diego 2019 Schedule – IoT, AI, Optimizations, Compilers and More

Linaro Connect San Diego 2019

Linaro has recently released the full schedule of Linaro Connect San Diego 2019 that will take place on  September 23-27. Even if you can’t attend, it’s always interested to check out the schedule to find out what interesting work is done on Arm Linux, Zephyr OS, and so on. So I’ve created my own virtual schedule with some of the most relevant and interesting sessions of the five-day event. Monday, September 23 14:00 – 14:25 – SAN19-101 Thermal Governors: How to pick the right one by Keerthy Jagadeesh, Software Engineer, Texas Instruments With higher Gigahertz and multiple cores packed in a SoC the need for thermal management for Arm based SoCs gets more and more critical. Thermal governors that define the policy for thermal management play a pivotal role in ensuring thermal safety of the device. Choosing the right one ensures the device performs optimally with in the thermal budget. In this presentation Keerthy Jagadeesh, co-maintainer of TI BANDGAP AND …

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Samsung Galaxy Book S Snapdragon 8cx Laptop to Launch soon for $1,000

Snapdragon 8cx laptop

Qualcomm Snapdragon 8cx was announced as the first Snapdragon processor specifically designed for connected mobile PCs (aka laptops with cellular connectivity) last December. Earlier this year we got confirmation 8cx would support 5G connectivity as an option, and in May, we got news Lenovo Limitless 5G laptop was coming and got some benchmarks showing Snapdragon 8cx with performance similar to an Intel Core i5 Kaby Lake-R processor (15 Watt TDP) while offering much longer battery life. It’s Samsung turn to announce their Snapdragon 8cx laptop with Samsung Galaxy Book S that will be available this fall for $999 and up. Samsung Galaxy Book S specifications: SoC – Qualcomm Snapdragon 8cx Compute Platform with eight 64-bit Armv8 cores in two clusters: Kryo 495 Gold cores (Cortex-A76 class) @ 2.84 GHz + Kryo 495  cores (Cortex-A55 class) @ 1.8GHz ; 7nm process; 7W TDP System Memory – 8GB RAM (LPDDR4X) Storage – 256/512GB storage (NVMe?) + MicroSD slot up to 1TB Display …

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ASUS ROG Phone II with Snapdragon 855+ | High Performance Gaming Phone

ASUS ROG Phone II Active Cooler

ASUS officially announced the launch of their new gaming phone, the ROG Phone II. The device will become the world’s first gaming phone to be powered by the new Snapdragon 855 Plus Mobile Platform. ASUS first gaming phone, the ROG Phone, launched in 2018, and it was quite popular. This ROG Phone II is an improved upon version of the first one. A unique feature of the new device is the Kryo 485 CPU in the Snapdragon 855 Plus. The CPU will run at up to 2.96GHz — a 4.2% improvement compared to the 2.84Ghz of the Snapdragon 855, while the Adreno 640 GPU is clocked 15% faster than in the current Snapdragon 855 Mobile Platform. Specifications of ASUS ROG II phone Here are the highlights of the features and specifications. Display 120Hz FHD+ AMOLED display 240Hz touch sampling rate, 49ms touch latency (compared to 87ms on the Samsung Galaxy S10+ and 85ms on the OnePlus 7 Pro according to …

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Qualcomm Snapdragon 855 Plus SoC Update Closes on the 3.0 GHz Mark

Snapdragon 855 Plus

Qualcomm Snapdragon 855 was officially unveiled in December 2018, and is found in several premium phones and at least one development kit.  The processor features one Kryo 485 Gold (A76-class) core clocked @ 2.84GHz, with 7 others cores in another 3-core Kryo 485 Gold cluster @ 2.42 GHz, and a 4-core Kryo 485 Silver (A55-class) cluster clocked at 1.80 GHz. Qualcomm has now announced the Snapdragon 855 Plus processor that’s virtually the same as the original, but with the high-performance Kryo 485 Gold core frequency boosted to close to 3.0 GHz (2.96 GHz), and the Adreno 640 GPU also getting faster at 672 MHz against 585 MHz for Snapdragon 855. The differences are highlighted in bold in the comparison table below courtesy of Anandtech. SoC Snapdragon 855 Snapdragon 855 Plus (855+) CPU 1x Kryo 485 Gold (A76 derivative) @ 2.84GHz 1x512KB pL2 3x Kryo 485 Gold (A76 derivative) @ 2.42GHz 3x256KB pL2 4x Kryo 485 Silver (A55 derivative) @ 1.80GHz …

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Qualcomm 215 64-bit SoC Targets Entry-level Smartphones

Qualcomm 215

Qualcomm Technologies has recently announced the Qualcomm 215 Mobile Platform quad core Cortex-A53 processor with a dual ISP for entry-level smartphones. Compared to the Snapdragon 212 quad core Cortex-7 32-bit processor, the new Qualcomm Snapdragon 215 64-bit processor offers a 50% increase in CPU performance, and up to 28% increased gaming performance thanks to its Adreno 308 GPU. It also adds an Hexagon DSP for low power audio and sensor processing which allows up to 5 days of audio playback. Qualcomm 215 (QM215) specifications: CPU – 4x Arm Cortex A53 up to 1.3 GHz GPU – Adreno 308 GPU with support for OpenGL ES 3.2, DirectX, OpenCL DSP – Qualcomm Hexagon DSP Memory I/F – LPDDR3 up to 3 GB RAM @ 672 MHz Storage I/F – eMMC 4.5 and SD 3.0 (UHS-I) Display – Up to 1560×720 resolution (19.5:9 aspect ratio); support for external display Video Capture – 1080p30 Playback – 1080p H.265, H2.64 and VP8 Audio – High …

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Linux 5.2 Release – Main Changes, Arm, MIPS & RISC-V Architectures

Linux 5.2 Changelog

Linus Torvalds announced the release of Linux 5.2 last Sunday: So I was somewhat pre-disposed towards making an rc8, simply because of my travels and being entirely off the internet for a few days last week, and with spotty internet for a few days before that [*]. But there really doesn’t seem to be any reason for another rc, since it’s been very quiet. Yes, I had a few pull requests since rc7, but they were all small, and I had many more that are for the upcoming merge window. Part of it may be due to the July 4th week, of course, but whatever – I’ll take the quiet week as a good sign. So despite a fairly late core revert, I don’t see any real reason for another week of rc, and so we have a v5.2 with the normal release timing. There’s no particular area that stands out there – the changes are sosmall that the appended …

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Inforce Introduces Snapdragon 660 & 845 Modules with On-Device AI

ACC-1C20 Carrier Board

Inforce Computing has just launched two new pin-compatible system-on-modules, namely Inforce 6502 and Inforce 6701, powered by Qualcomm Snapdragon 660 & Snapdragon 845 SoC respectively. In their newsletter, the company claims those are their first modules with on-device AI capabilities with the Snapdragon 660 enabling “advanced visual computing, enhanced graphics and on-device machine learning capabilities”, while the more powerful Snapdragon 845 is better suited for “immersive multimedia experiences including optimized AI performance for a more responsive, power-efficient user- experience and capture of cinema-grade videos in [email protected] resolution. Inforce 6502 Snapdragon 660 SoM Specifications: SoC – Qualcomm Snapdragon 660 with 8-core Kryo 260 processor, Adreno 512 GPU, Qualcomm Hexagon 680 DSP with Hexagon Vector eXtensions (HVX) for Caffe2 and Tensorflow System Memory & Storage – 3GB LPDDR4, Dual-Channel + 32GB eMMC flash in single eMCP package Connectivity Bluetooth 5.0 + Wi-Fi 5 802.11ac 2×2 with MU-MIMO and Dual Band Simultaneous (DBS) via WCN3990 + 2x MHF4 connectors GPS/ GLONASS location via …

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Intrinsyc Open-Q 820Pro SoM Comes with a Faster Snapdragon 820E Processor, 4GB RAM

Snapdragon 820E Development Board

Intrinsyc Open-Q 820 system-on-module was introduced in 2017 with a Qualcomm Snapdragon 820 processor, 3GB RAM, and a built-in wireless module for 802.11ac WiFi 5, and Bluetooth 4.1 connectivity. The company has now announced an almost identical ultra-compact module but based on Qualcomm Snapdragon 820E and featuring 4GB RAM. Open-Q 820Pro μSoM is a drop-in replacement for Open-Q820 requiring only some software changes. Snapdragon 820E is said to deliver 9% faster CPU and 5% faster GPU speeds at the same power consumption compared to Snapdragon 820. Open-Q 820Pro μSoM specifications: SoC – Qualcomm Snapdragon 820E (APQ8096SG) Embedded Platform with four Kryo cores including 2x cores @ up to 2.342GHz, and 2x cores @ up to 1.6GHz, Adreno 530 GPU @ 652.8 MHz,  Hexagon 680 DSP @ 825 MHz System Memory – Dual-channel 4 GB LPDDR4  @ 1866 MHz (PoP) Storage – 32 GB UFS 2.0 1-lane gear3 flash Connectivity Pre-certified 802.11 b/g/n/ac 2×2 MU-MIMO WiFi 5 and  Bluetooth 4.1 module …

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