OnLogic unveils Karbon 800 Series Alder Lake-S embedded computers

OnLogic Karbon 800 Alder Lake-S embedded computer

We’ve already seen the newly announced Intel Alder Lake-S desktop IoT processors in some COM Express and COM HPC modules, and quickly mentioned Vecow ECX-3000 rugged computer, and now, OnLogic has just announced the Karbon 800 Series, a family of Alder Lake-S embedded computers. There will be four Karbon 800 models at launch, equipped with up to an Intel Core i9 16-core processor, 64 GB of DDR4 ECC or non-ECC memory, as well as single and dual PCIe Gen 4 slots, and optional “ModBay” hot-swappable bays to add connectivity and storage option up to a six 2.5-inch SSD RAID array or 14 Ethernet ports. All four Karbon 800 embedded computer supports the same processor and memory options, and mostly differ in their storage and expansion options: Karbon 801 Storage – Support for NVME Storage Expansion – 4G Cellular, Wi-Fi, Bluetooth Karbon 802 Storage – 2x 2.5-inch SSD with optional Hot […]

TDP (Thermal Design Power) vs PBP (Processor Base Power) – Are there differences?

TDP (Thermal Design Power) metric has been used for years to help manufacturers design appropriate cooling solutions for Intel/AMD processors and give an idea of their power consumption. But I did not immediately catch up that TDP was gone from the recent Alder Lake IoT processors announcement, and Intel is now using PBP (Processor Base Power) instead, while somehow cTDP (configurable TDP) down/up numbers are still provided. Beyond the announcement, if we look into the Intel Ark database, older processors still show TDP, while it’s completely gone for new processors with the specs instead listing Processor Base Power (PBP), and for the ones with Turbo mode “Maximum Turbo Power” (MTP) is also included. But what do those mean exactly? Intel “explains”: TDP definition: Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. […]

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

Alder Lake COM-HPC COM Express

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

COM-HPC Alder Lake-H

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

Intel unveils Alder Lake desktop and mobile IoT processors

Intel Alder Lake-H Mobile IoT processsor

Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]

Entry-level Alder Lake Pentium G7400 and Celeron G6900 processors show up online

Pentium G7400 & Celeron G6900

Intel recently formally announced the 12th generation Alder Lake hybrid processors family with some high-end processors like the 125W Core i9-12900K processor designed for gaming.  But we know some low-power parts are also expected, and  @momomo_us recently shared a screenshot showing listings for the boxed version of Intel Pentium Gold G7400 and Celeron G6900 processor. The screenshot contains limited information revealing the $123 Pentium Gold G7400 comes with a 6 MB cache and clocks at up to 3.70 GHz, while the $91 Celeron G6900 features 4M of cache and a 3.40 GHz maximum CPU clock speed. Both are available in an (FC-)LGA16A package. What we do not know for sure from the screenshot is whether the two processors are indeed part of the Alder Lake family. and media reports like the NotebookCheck.net article that tipped us of the leak suspect they could either be an Alder Lake SoC, or Comet […]

Linux 5.14 Release – Main changes, Arm, MIPS, and RISC-V architectures

Linux 5.14 release

Linus Torvalds has just announced Linux 5.14 release which happens to almost coincide with the anniversary of the initial announcement of the “small” project on August 25, 1991, about 30 years ago. Here’s Linux 5.14’s announcement: So I realize you must all still be busy with all the galas and fancy balls and all the other 30th anniversary events, but at some point you must be getting tired of the constant glitz, the fireworks, and the champagne. That ball gown or tailcoat isn’t the most comfortable thing, either. The celebrations will go on for a few more weeks yet, but you all may just need a breather from them. And when that happens, I have just the thing for you – a new kernel release to test and enjoy. Because 5.14 is out there, just waiting for you to kick the tires and remind yourself what all the festivities are […]

Intel packaging & process roadmap to 2025 and beyond

Intel Process Technology History

Intel has a mixed history with its ability to keep production schedules for new processes, with notably its 10nm process suffering from years of delays before finally being deployed into chips. But the US company has now held an event unveiling the process & package roadmap through 2025 and beyond, which includes 7nm, 4nm, 3nm, and even the switch the angstrom scale (1A = 0.1 nm) with a 20A process expected in 2024/2025. Intel Process roadmap to 2025 and beyond On the process node sides of things, here’s what to expect in the next few years: Intel 7 delivers 10% to 15% performance-per-watt improvements, and will be found in Alder Lake for client in 2021 and Sapphire Rapids for the data center, with the latter expected to be in production in Q1 2022. Intel 4 promises a 20% performance-per-watt increase over Intel 7, and is the first Intel FinFET node […]