The HiHope_NearLink_DK_WS63E_V03 is a low-power NearLink dev board built around the HiHope HH-SPARK-WS63E module, which features the HiSilicon NearLink WS63E SoC with 2.4GHz Wi-Fi 6, BLE 5.2, and SparkLink (SLE) 1.0 support. It’s designed for Smart Home and AIoT applications requiring low power and high security. The NearLink WS63E SoC features a 240MHz 32-bit CPU, 606KB SRAM, and a 4MB flash. The board exposes various interfaces like SPI, QSPI, I2C, UART, ADC, PWM, and GPIOs through GPIO headers. Security features include hardware AES, RSA, ECC, and FIPS140-2-compliant RNG. Target applications include Smart Home appliances, wearables, medical monitoring, industrial testing, energy management, and Smart Agriculture. HiHope NearLink_DK_WS63E specifications: SoC – HiSilicon NearLink WS63E 32-bit microprocessor up to 240 MHz 606 KB SRAM, 300 KB ROM 4MB embedded Flash Wireless (2.4GHz) Wi-Fi IEEE 802.11b/g/n/ax (ch1–ch14), 20/40MHz (n), 20MHz (ax) Data rates: up to 150 Mbps (HT40), 114.7 Mbps (HE20) MAC: 802.11d/e/i/k/v/w; Features: A-MPDU, […]
$7 NearLink WS63E board supports Wi-Fi 6, BLE, and SparkLink Low Energy (SLE)
