2803 Plai Plug
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$69.99 Gyrfalcon 2803 Plai Plug Delivers 24 TOPS per Watt

Last year we covered an alternative to Intel Movidius Neural Compute Stick with Orange Pi AI Stick 2801 powered by Gyrfalcon Lightspeeur 2801S neural processor, and delivering up to 5.6 TOPS, or 2.8TOPS @ 300mW for $69.  Since then Gyrfalcon introduced Lightspeeur 2803(S) AI accelerator delivering up to 24 TOPS, or 16.8 TOPS @ 700 mW. We’ve recently seen the new neural processor will be integrated into SolidRun  i.MX 8M Mini & Nano systems-on-module, and today the company published a press release to announce their latest 2803 Plai Plug providing an upgrade to their existing 2801 Plai Plug (Orange Pi AI Stick 2801) for about the same $69.99 price tag. Gyrfalcon 2803 Plai Plug preliminary specifications: AI Accelerator – Gyrfalcon Lightspeeur 2803S with 2-dimensional Matrix Processing Engine (MPE) and AI Processing in Memory (APiM) Storage – eMMC flash Host interface – USB 3.0 port Power Consumption – 700mW at 16.8 […]

NXP Immersiv3d audio reference design
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NXP Immersiv3D Enables DSP-Free Dolby Atmos & DTS:X Audio Systems

High-fidelity audio systems such as soundbars, smart speakers, and AV receivers have traditionally relied on DSPs (Digital Signal Processors) to deliver low-latency audio processing, and enable audio and video synchronization. DSPs add to the cost of the overall design however, and with Immersiv3D technology, NXP has leveraged Arm Cortex-A53 and M4 cores in their NXP i.MX 8M Mini processor to completely remove the need for DSP in audio systems, shaving the BoM cost by up to 20%  according to an article on EETimes. Immersiv3D also enables immersive audio support with Dolby Atmos and DTS:X, advanced audio pre/post processing, advanced features like voice control for the smart home. Immersiv3D audio solution was designed to help OEMs to bring to market affordable consumer audio devices with Dolby Atmos and DTS:X, and beside the audio processing software, NXP is also offering an Immersiv3D audio reference design to help them delelop sound bars based […]

ArmSoM RK3588 AIModule7 NVIDIA Jetson Nano-compatible SOM
Kinara Ara 2 M.2 Module
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Geniatech AIM M2 M.2 module features Kinara Ara-2 40 TOPS AI accelerator

There are plenty of M.2 AI modules based on accelerators such as Hailo-8, MemryX MX3, or Axelera AI, but the Geniatech AIM M2 module is based on the Kinara Ara-2 40 TOPS AI accelerator that we’ve yet to cover here on CNX Software. The Key-M module is designed to handle Generative AI and transformer-based models such as Stable Diffusion at a lower price point than competitors, and operates at a typical sub-2W power consumption in computer vision workloads. Target applications include AI assistants/Copilot, gaming, smart retail, physical security, and factory automation. Geniatech AIM M2 specifications: AI Accelerator Kinara Ara-2 NPU with 40 TOPS of AI power Package – 17x17mm FCBBA System Memory – 16GB RAM (4GB/8GB Option) Host interface – PCIe Gen4 x4 Security – Secure boot and encrypted memory access Misc – Heatsink cooling Supply Voltage – 3.3V Power Consumption – Under 2 Watts (typical) TDP – 12 Watts […]

Toradex SMARC modules with NXP i.MX 8MPlus and i.MX 95
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Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain

Toradex has introduced its first SMARC-compliant system-on-modules (SoMs) with the SMARC iMX8M Plus and SMARC iMX95 SoMs based on NXP i.MX 8M Plus and NXP i.MX 95 SoC respectively. The company has made proprietary system-on-modules for years with the Colibri, Apalis, Aquila, and Verdin families. Those typically are cost-optimized and use most or all I/Os from the selected SoC, but customers are tied to one supplier: Toradex. To offer more flexibility, the company decided to introduce its first standardized system-on-modules by selecting the SMARC 2.2 standard for compatibility with existing SMARC-compliant carrier boards and adding the Swiss company as an alternative supplier. Highlights of the SMARC iMX8M Plus module: SoC – NXP i.MX 8M Plus CPU Quad-core ARM Cortex-A53 application processor @ 1.6 GHz Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator […]

Linux 6.13 Changelog
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Linux 6.13 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linus Torvalds has just announced the release of Linux 6.13 on the Linux Kernel Mailing List: So nothing horrible or unexpected happened last week, so I’ve tagged and pushed out the final 6.13 release. It’s mostly some final driver fixes (gpu and networking dominating – normal), with some doc updates too. And various little stuff all over. The shortlog is appended for people who want to see the details (and, as always, it’s just the shortlog for the last week, the full 6.13 log is obviously much too big). With this, the merge window for 6.14 will obviously open tomorrow. I already have two dozen pull requests pending – thank you, you know who you are. Linus Release about two months ago, Linux 6.12 – the new LTS version – brought us real-time “PREEMPT_RT” support that had always required out-of-tree patchsets until now, the completion of the EEVDF (Earliest Eligible […]

FOSDEM 2025 Schedule Embedded
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FOSDEM 2025 schedule – Embedded, Open Hardware, RISC-V, Edge AI, and more

FOSDEM 2025 will take place on February 1-2 with over 8000 developers meeting in Brussels to discuss open-source software & hardware projects. The free-to-attend (and participate) “Free and Open Source Software Developers’ European Meeting” grows every year, and in 2025 there will be 968 speakers, 930 events, and 74 tracks. Like every year since FOSDEM 2015 which had (only) 551 events, I’ll create a virtual schedule with sessions most relevant to the topics covered on CNX Software from the “Embedded, Mobile and Automotive” and “Open Hardware and CAD/CAM” devrooms, but also other devrooms including “RISC-V”, “FOSS Mobile Devices”, “Low-level AI Engineering and Hacking”, among others. FOSDEM 2025 Day 1 – Saturday 1 10:30 – 11:10 – RISC-V Hardware – Where are we? by Emil Renner Berthing I’ll talk about the current landscape of available RISC-V hardware powerful enough to run Linux and hopefully give a better overview of what to […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025
Voipac iMX93 Industrial Development Kit
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VOIPAC iMX93 industrial development kit targets AI, HMI, and Edge Computing applications

VOIPAC Technologies has recently launched its iMX93 Industrial Development Kit (iMX93 module and iMX development baseboard) which comes in Max, Pro, Basic, and Lite configurations. The system-on-module (SoM) is built around the NXP i.MX93 SoC with dual-core Arm Cortex-A55 application processor running at up to 1.7GHz, a Cortex-M33 co-processor running at up to 250MHz, and an Arm Ethos-U65 microNPU with up to 0.5 TOPS of AI performance. Other features include DDR4 memory, eMMC Flash, and industrial-grade 100-pin shielded connectors for signal integrity and thermal performance. Additionally, the devkit also exposes CAN, PWM, ADC, etc.. signals and supports WiFi 6, Bluetooth 5.3, and dual GbE. These features make the VOIPAC iMX93 industrial development kit suitable for applications including AI, machine learning, human-machine interface (HMI) solutions, and more. iMX93 Industrial Development Kit specifications: System-on-Module (four options) iMX93 Industrial Module Max SoC – NXP i.MX 93 dual-core @ 1.7 GHz with real-time Cortex-M33 co-processor NPU […]

ADLINK AVA 1000 T2G gateway top view
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ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

The ADLINK AVA-1000 T2G gateway is a rugged, EN50155-compliant T2G (Train-to-Ground) gateway designed for railway and industrial environments. Powered by a choice of NXP i.MX8M Plus Quad Cortex-A53 processor or an Intel Processor N50 Alder Lake-N processor. The i.MX8M Plus model is equipped with up to 8GB LPDDR4 and a 64GB eMMC flash whereas the Alder Lake variant features up to 4GB LPDDR5 memory and a 32GB eMMC flash. In terms of connectivity, the gateway features three M12 GbE ports and supports a wide range of options including 5G, WiFi 6, and GNSS. The AVA-1000 T2G gateway’s fanless design, wide operating temperature range, and 24-110V DC input ensure reliable operation in industrial environments. Additionally, its compliance with EN50155 and other industrial standards makes it ideal for various industrial applications. AVA-1000 T2G gateway specifications System Processor (multiple options) NXP i.MX8M Plus quad-core Cortex-A53 processor @ up to 1.8 GHz with Cortex-M7 […]

Boardcon CM3588 Rockchip RK3588 System-on-Module designed for AI and IoT applications