High-fidelity audio systems such as soundbars, smart speakers, and AV receivers have traditionally relied on DSPs (Digital Signal Processors) to deliver low-latency audio processing, and enable audio and video synchronization. DSPs add to the cost of the overall design however, and with Immersiv3D technology, NXP has leveraged Arm Cortex-A53 and M4 cores in their NXP i.MX 8M Mini processor to completely remove the need for DSP in audio systems, shaving the BoM cost by up to 20% according to an article on EETimes.
Immersiv3D also enables immersive audio support with Dolby Atmos and DTS:X, advanced audio pre/post processing, advanced features like voice control for the smart home.
Immersiv3D audio solution was designed to help OEMs to bring to market affordable consumer audio devices with Dolby Atmos and DTS:X, and beside the audio processing software, NXP is also offering an Immersiv3D audio reference design to help them delelop sound bars based on the solution.
The press release further explains:
The NXP Immersiv3D audio solution gives audio developers, designers and integrators a leap forward to add intelligence and Artificial Intelligence (AI) functionality while reducing cost. This includes development of enhancements like selective noise canceling where only certain sound elements are removed like car traffic or speech processing like changing speaker dialect or languages.
The solution introduces an easy-to-use, low-cost enablement for voice capability expansion. Audio systems built using NXP’s Immersiv3D with the i.MX 8M Mini applications processor will give consumers the flexibility to add different audio speakers, regardless of brand, to stream simultaneous and synchronized audio with voice control from their systems.
Beside audio processing, the use of Arm cores also enables other advanced A.I. features which would not be possible with DSP only solutions, and Arm processors are eaier to program than DSPs, so time to market should be shortened as well.
At this point, there’s not a lot of public information about Immersiv3D, but NXP is currently showcasing the technology at CES 2019 between January 8-11.