NXP i.MX Category - Page 18 of 70 - CNX Software

April 20, 2021April 23, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Linux 5.12 – Main Changes, Arm, MIPS and RISC-V Architectures

Linux 5.12 release was expected last Sunday, but Linus Torvalds decided to release one more release candidate, namely Linux 5.12-RC8, to “make sure things are all settled down“, so the latest Linux kernel is now expected this weekend. Tihs should not yield any significant changes, so we can check what’s new in Linux 5.12, notably with regards to Arm, MIPS, and RISC-V architectures often used in SoC’s found in embedded systems. Around two months ago, the release of Linux 5.11 added support for Intel’s software guard extensions (SGX) and Platform Monitoring Technology (PMT), AMD “Van Gogh” and “Dimgrey cavefish” graphics processors, MIPI I3C host controller interfaces, and much more. Some interesting changes in Linux 5.12 include: Added support for ACRN hypervisor designed for IoT & embedded devices Added support for Playstation DualSense & Nintendo 64 game controllers, as well as Nintendo 64 data cartridges Dynamic thermal power management via a […]

April 16, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

Zoom i.MX 8M Mini Development Kit supports power usage monitoring

NXP i.MX 8M Mini 14nm Cortex-A53/M4 processor has been around for a couple of years, and several SoM-based development kits are available including Variscite Symphony starter kit, HummingBoard Ripple SBC, or congatec conga-SEVAL007010 evaluation board. Beacon EmbeddedWorks’ Zoom i.MX 8M mini development kit is based on the company’s i.MX 8M Nano System on Module (SOM) and offers features not found on most other devkits or single board computers such as power usage monitoring and control through their Wattson power measurement application. Zoom i.MX 8M mini development kit key features & specifications: System-on-Module SoC – NXP i.MX 8M Mini processor with up to four Arm Cortex-A53 cores @ up to 1.8 GHz, an Arm Cortex-M4 real-time core at up to 400 MHz, Vivante 3D & 2D GPU’s System Memory – Up to 8GB of 32-bit wide LPDDR4 memory Storage – eMMC flash, QSPI NOR flash Networking Gigabit Ethernet PHY Wireless module […]

March 28, 2021April 1, 2021 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Semiconductors lead times in March 2021

As we previously mentioned previously there is a serious chip shortage that will lead to supply issues and higher prices for single board computers and other electronics products. A few days ago, Hardkernel had o increase the price for ODROID boards using DDR4 memory with increases of $3 to $4 for ODROID-N2+, ODROID-C4, and ODROID-HC4 boards. But besides price increase, some semiconductors will not be available at any price with extended periods as lead times of up to 52 weeks have been reported as shown in the table below, obtained from a trusted, anonymous source, which I have translated from Chinese. Every manufacturer is impacted, but items highlighted in red are severely impacted. Since include processors from Qualcomm, STMicroelectronics, and NXP, as well as Broadcom wireless chips which are found in nearly every SBC with WiFi or Bluetooth through Ampak modules. Here’s the source image in Chinese for reference. Jean-Luc […]

March 18, 2021December 19, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

ADLINK launches SMARC Short Size Module, Devkit with NXP i.MX 8M Plus

We had seen many i.MX 8M Plus modules with built-in AI accelerator announced at Embedded World 2021, including two SMARC modules from Congatec and iWave Systems. ADLINK has added another of i.MX 8M Plus module compliant with SMARC 2.1 “short” standard with LEC-IMX8MP system-on-module equipped with up to 8GB RAM, 128 GB eMMC flash, as well as a development kit called I-Pi SMARC IMX8M Plus prototyping platform. LEC-IMX8MP module specifications Specifications: SoC – NXP i.MX8M Plus with quad-core ARM Cortex-A53 processor, Vivante GC380 2D GPU and GC7000UL 3D GPU, 1080p60 video decoder & encoder, optional 2.3 TOPS Neural Processing Unit (NPU) System Memory – 2/4/8GB LPDDR4L-4266 Storage – 16, 32, 64, or 128GB eMMC flash (build option) Wireless – Optional 802.11 ac/a/b/g/n WiFi 5 2X2 MIMO and Bluetooth 5.0 module 314-pin MXM 3.0 edge connector Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display – […]

March 10, 2021 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Microsoft previews Azure Percept Edge AI development platform

Microsoft has recently announced the public preview of Azure Percept platform combining hardware and services to ease AI implementations at the edge through the use of Azure AI technologies and Azure cloud for device management, AI model development, and analytics. The hardware currently available includes the Azure Percept DK (Development Kit) with an NXP i.MX 8M powered WiFi & Bluetooth gateway/carrier board, the Azure Percept Vision system on module (SoM), as well as the optional Azure Percept Audio SoM with a 4-mic array. Key features and specifications: Azure Percept DK carrier board SoC – NXP iMX 8M quad-core Cortex-A53 processor System Memory – 4GB RAM Storage – 16GB flash Connectivity – Ethernet, WiFi and Bluetooth connectivity via Realtek USB – 2x USB-A 3.0 port, 1x USB-C port Security – Nuvoton NCPT750 Trusted Platform Module (TPM) version 2.0 Power Supply – 19V/3.4A Systems-on-Module Azure Percept Vision SoM based on Intel Movidius […]

March 9, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 8M Plus 2.5-inch Pico-ITX SBC supports UIO40-Express expansion modules

With NXP i.MX 8M Plus AI processor nearing mass production, we’ve seen many companies introduce i.MX 8M Plus systems-on-module at Embedded World 2021. But as one would come to expect, there should also be single board computers based on the new processor, and Advantech has unveiled the RSB-3720 2.5-inch SBC (aka Pico-ITX SBC) compatible with the company’s UIO40-Express expansion boards. RSB-3720 specifications: SoC – NXP i.MX8M Plus dual or quad-core Arm Cortex-A53 processor up to 1.8GHz (1.6 GHz for industrial temperature range) with Cortex-M7 real-time core, Vivante GC7000UL 3D GPU, 1080p60 H.265/H.264/VP9 decoder, 1080p60 H.265/H.264 encoder, 2.3 TOP/s Neural Network Accelerator System Memory – 4GB or 6GB LPDDR4 4000MT/s Storage – 16 GB eMMC Flash for OS, 8 MB QSPI NOR Flash for board information, microSD socket Video Output – HDMI 2.0a up to 3840 x 2160 at 30Hz Single or dual-channel 24 Bit LVDS with backlight power, 5/12V, Max. […]

March 8, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

NXP unveils i.MX 8ULP Cortex-A35/M33 secure processors with optional Azure Sphere certification

NXP may have just unveiled plans for i.MX 9 processor family with Arm Ethos U65 microNPU, and advanced security using the company’s EdgeLock enclave, but NXP also introduced new members to its popular i.MX 8 series with i.MX 8ULP and i.MX 8ULP-CS (Cloud Secured) processors. Both processors come with a mix of Cortex-A35 application processor(s) and Cortex-M33 real-time core, as well as Energy Flex low-power architecture and EdgeLock secure enclave, but i.MX 8ULP-CS includes Microsoft Pluton for secure cloud connectivity and lacks 2D/3D graphics and the HiFi 4 audio DSP. NXP i.MX 8ULP and 8ULP-CS key features and specifications: CPU i.MX 8ULP – Up to two Arm Cortex-A35 @ 1.0 GHz and Arm Cortex-M33 @ 216 MHz, i.MX 8ULP-CS – One Arm Cortex-A35 @ 1.0 GHz and Arm Cortex-M33 @ 216 MHz GPU (i.MX 8ULP only) – 2D GPU, and 3D GPU with support for OpenGL ES 3.1, OpenCLTM, Vulkan […]

March 5, 2021March 8, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 9 processors to integrate Arm Ethos U-65 microNPU, EdgeLock secure enclave

NXP i.MX 6 and i.MX 8 processors are widely used in industrial boards and systems-on-module, and the company has now teased a new family with i.MX 9 processors integrating Arm Ethos-U65 1 TOPS microNPU, as well as the company’s EdgeLock secure enclave for increased security. The company did not provide that many technical details, so we still don’t know which CPU cores, GPU, and exact peripherals will be found in the processor. But we do know the i.MX 9 processors will be manufactured with a 16/12nm FinFET class of process technology optimized for low power, and features the “Energy Flex” architecture that combines “heterogeneous domain processing (independent applications processor and real-time domains with a separate low-power multi-media domain), design techniques, and process technology to maximize performance efficiency”. That means most blocks of the processor can be turned off for low power audio or CAN networking use cases, and other industrial […]