NXP i.MX Category - Page 36 of 66 - CNX Software

August 15, 2017August 15, 2017 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Aspencore 2017 Embedded Markets Study – Programming Languages, Operating Systems, MCU Vendors, and More

Aspencore media group asked readers of their EE Times and Embedded.com websites to fill out an online survey about their embedded system projects. They got 1,234 respondents mostly from North America (56.3%), followed by Europe (25.2%), and Asia (10.6%). This resulted in a 102-page market study which you can download here. I’ve extracted a few slides to have a look at some of the trends. C language is still the most used language in embedded systems, but other languages like C++, Python and even assembly language are gaining traction. Operating system is more spread with Linux being the most used via Embedded Linux distributions, Debian, and Ubuntu. FreeRTOS comes in second place, while Android registers fourth with 13%. Git has finally supplanted Subversion in 2017, with all other version control software losing ground. Switching to some hardware slides, 44% used a development board to start their embedded design with ST […]

August 10, 2017August 10, 2017 by Jean-Luc Aufranc (CNXSoft) - 20 Comments

VoltaStream ZERO NXP i.MX6ULL Linux Audio Board Follows Raspberry Pi Zero Form Factor

Back in 2013. Philip came with the idea of designing a development board for audio application, and after various experiments with off-the shelf Raspberry Pi boards and audio DACs, he founded PolyVection company, and started designing the board. Forwarding to today, he has completed his work and introduced VoltaStream ZERO to the world, a board based on NXP i.MX6ULL processor with 512MB or 1GB RAM, and a choice of Texas Instruments DAC. It also follows Raspberry Pi Zero form factor, like the upcoming Banana Pi BPI-M2 Zero board. VoltaStream ZERO specifications: SoC – NXP i.MX6ULL ARM Cortex-A7 processor @ 996 MHz System Memory – 512 MB or 1 GB DDR3 Storage – micro SD card slot Audio 1x I2S for integrated DAC, 1x I2S for GPIO access, 1x S/PDIF header / TOSLINK jack Analog DAC – Texas Instruments PCM5121 (106 dB) or PCM5142 (112 dB) USB – 1x micro USB […]

July 24, 2017November 21, 2018 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Variscite DART-6UL SoM, an Alternative to Intel Edison Module

Intel recently announced it will discontinue manufacturing and selling all SKUs of the Intel® Edison compute modules and developer kits. The initial version of Edison was released in the beginning of 2014, with a second version being released by the end of 2014. It was intended for the IoT market, with dimensions of 35.5x25x3.9mm. The Edison features an Intel Atom processor, consisting of two Atom Silvermont cores running at 500MHz. It includes a fixed configuration of 1GB integrated RAM, and 4GB eMMC flash on-board. Dual-band (2.4GHz and 5GHz) Wi-Fi, Bluetooth 4.0 and USB controllers complete the package. According to Intel’s announcement, the last shipment of Edison family boards is planned for December 2017. This announcement will have a critical impact on companies that already integrated the Edison board in their products, as well as the many companies that engaged in the development process of integrating the Edison board into their products. While some of these companies are rushing to place […]

July 3, 2017June 18, 2018 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Linux 4.12 Release – Main Changes, ARM & MIPS Architectures

Linus Torvalds has just released Linux 4.12: Things were quite calm this week, so I really didn’t have any real reason to delay the 4.12 release. As mentioned over the various rc announcements, 4.12 is one of the bigger releases historically, and I think only 4.9 ends up having had more commits. And 4.9 was big at least partly because Greg announced it was an LTS kernel. But 4.12 is just plain big. There’s also nothing particularly odd going on in the tree – it’s all just normal development, just more of it that usual. The shortlog below is obviously just the minor changes since rc7 – the whole 4.12 shortlog is much too large to post. In the diff department, 4.12 is also very big, although the reason there isn’t just that there’s a lot of development, we have the added bulk of a lot of new header files […]

June 13, 2017 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Android Can Now Boot with a Full Open Source Graphics Stack on NXP i.MX6 Boards

While the Android operating systems is itself open source, it still relies on proprietary binary files to leverage GPU acceleration, VPU hardware decoding, wireless connectivity, and so on. It’s been possible to run Android with an open source software graphics stack, but it’s normally terribly slow and barely usable. But Collabora has announced it could now boot Android with a full-graphics stack on iMX6 platforms using no proprietary blobs at all. To do so, they leveraged the work done on Etnaviv open source drivers for Vivante GPUs, and adding the different formats used for graphical buffers in Android and Mesa library using modifiers representing different properties of buffers. They further explain: Support was added in two places; Mesa and gbm_gralloc. Mesa has had support added to many of the buffer allocation functions and to GBM (which is the API provided by Mesa, that gbm_gralloc uses). gbm_gralloc in turn had support […]

June 8, 2017 by Jean-Luc Aufranc (CNXSoft) - No Comments

Amazon AWS Greengrass Brings Local Compute, Messaging, Data Caching & Sync to ARM & x86 Devices

Amazon Web Services (AWS) provides cloud computing services to manage & store data from IoT Nodes over the Internet, but in some cases latency may be an issue, and Internet connectivity may not be reliable in all locations. AWS Greengrass provides a solution to those issues by running some of the IoT tasks within the local network in ARM or x86 edge gateways running Linux. You can still manage your devices from AWS cloud, but a Linux gateway running Greengrass Core runtime will be able to run AWS Lambda functions to perform tasks locally, keep device data in sync, and communicate with devices running AWS IoT Device SDK. Greengrass benefits include: Response to Local Events in Near Real-time Offline operation – Connected devices can operate with intermittent connectivity to the cloud, and synchronizes with AWS IoT once it is restored Secure Communication – AWS Greengrass authenticates and encrypts device data […]

June 7, 2017 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Love to Code Board is Designed to Teach Coding via Paper Circuits, MakeCode Visual Programming Editor

Chibitronics has launched “Love to Code” board to enable beginners to try out programming without having to install software. The tiny board comes with a clip that designed for “paper circuits”, and can be programmed with either Microsoft MakeCode editor for visual programming, or the company’s online editor inspired from Arduino IDE. Love to Code board hardware (tentative) specifications: MCU – NXP Kinetis KL02 ARM Cortex M0+ @ 48 MHz with 32KB flash, 4KB RAM USB – 1x micro USB port used to power and program the board over a Y cable with micro USB and an audio jack to be connected to your smartphone as shown below) Expansion – 4x through holes for TXT, +5V, GND, and RGB, 6x programmable ports on clip to drive LED stickers, or used as switch / sensor inputs. Misc – Programming button, RGB LED The way it works is that you can first […]

June 2, 2017 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Compulab’s Miniature “Bend & Fold” UCM-iMX7 System-on-Module Could Fit into a Watch

Many companies are still releasing NXP – soon to be Qualcomm – i.MX 6/7 system-on-modules, but I don’t cover all of them, since we have already many to choose from. But Compulab’s latest UCM-iMX7 SoM differentiates itself by it size, using the company’s “Ultra-compact Multilevel Module” (UCMM) technology, to pack NXP i.MX7 processor, 2GB RAM, 64 GB eMMC flash, and a wireless module into a 30 x 27 x 8 mm volume that could potentially fit into something as small as a watch. The picture above clearly shows how UCMM technology works with the module comprised of two rigid PCBs and one flexible layer routing signals between the two allowing to bend and fold the rigid parts together to form a vertical stack. The principle could be extended to more PCBs and flexible layers, sof for example you could have four PCBs with three flexible layers in future / custom […]