2.5GbE News - Page 2 of 37 - CNX Software

January 29, 2026January 29, 2026 by Debashis Das - No Comments

Avalue EMS-ARH – A fanless, modular industrial “Arrow Lake-H” PC featuring IET interface with DDI, PCIe, USB 3.0…

Avalue EMS-ARH is a fanless industrial PC that supports “Arrow Lake-H” Core Ultra 7 and Core Ultra 5 processors with wide temperature tolerance, and various I/O options. This compact PC is suitable for industrial, medical, and transportation environments that require silent operation. The system supports up to 64GB of DDR5-6400 memory via two SO-DIMM slots, NVMe SSD using an M.2 Key-M socket, and wireless or cellular via M.2 Key-E and Key-B slots with SIM support. Additionally, it features two 2.5GbE ports, multiple USB 3.2 and USB 2.0 ports, two RS-232/422/485 serial interfaces, 8-bit GPIO, and triple 4K display output via DisplayPort 1.4 and dual HDMI 2.0b. It supports a wide 9-36V DC input, an IET expansion interface (see below for details), and a fanless design for harsh edge deployments. Avalue EMS-ARH specifications: Arrow Lake SoC (one or the other) Intel Core Ultra 5 225H 14-core (4P + 8E + 2LPE) Arrow Lake processor […]

January 28, 2026 by Debashis Das - No Comments

Congatec conga-TCRP1 COM Express Type 6 module features AMD Ryzen AI Embedded P100 SoC with 50 TOPS NPU

conga TCRP1 COM Express Compact (Type 6) module with AMD Ryzen AI Embedded P100 Series SoCs

Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 Series processors, which feature AMD’s latest Zen 5 architecture, RDNA 3.5 graphics, and an XDNA 2 NPU for 59 TOPS of combined AI performance, including up to 50 TOPS from the NPU. The module supports up to 96 GB of DDR5-5600 memory and is available in 4-core and 6-core variants with a configurable 15 W to 54 W TDP, allowing both passive and active cooling designs. It supports up to four independent displays, offers PCIe Gen4 and PEG x4 expansion, and includes 2.5 GbE, USB 3.2 Gen 2, and USB 2.0 ports, along with SATA or optional onboard NVMe storage options. Additional features include TPM 2.0, UEFI firmware, and hardware monitoring. The module is available in both commercial and industrial variants with operating temperatures down to -40 °C, which […]

January 26, 2026January 26, 2026 by Debashis Das - 1 Comment

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

January 19, 2026January 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Bedrock RAI300 fanless industrial PC is powered by an AMD Ryzen AI 9 HX 370 mobile AI SoC

SolidRun Bedrock RAI300 is the first industrial PC powered by a 12-core/24-thread AMD Ryzen AI 9 HX 370 mobile processor, typically used in premium consumer and commercial AI laptops. The fanless industrial computer supports up to 128GB DDR5 SO-DIMM memory to run AI models on the 50 TOPS NPU (80 TOPS combined) of the AMD processor, up to three M.2 NVMe 2280 PCIe Gen4 x4 storage devices, up to four display through HDMI 2.1 and DP 2.1 video outputs, and features up to four 2.5 Gbps Ethernet ports, a USB4 port, four USB 3.2 ports, and more. It’s available in two models: a thin “Tile” model and a thicker “60W model” to cater to different TDP configurations, ranging from 8W to 54W, and cooling options. Bedrock RAI300 specifications: SoC – AMD Ryzen AI 9 HX 370 “Strix Point” CPU – 12-core/24-thread processor with four Zen 5 cores up to 2.0/5.1 […]

January 16, 2026 by Jean-Luc Aufranc (CNXSoft) - 9 Comments

NanoPC-T6 Plus Rockchip RK3588 SBC switches from LPDDR4x to LPDDR5 (up to 32GB)

It’s been a while since FriendlyELEC has released a board, and the NanoPC-T6 Plus SBC is more of a variant of the NanoPC-T6 and NanoPC-T6 LTS rather than a really new board. It’s still based on a Rockchip RK3588 octa-core SoC, and equipped with two HDMI 2.1 ports, an HDMI input port, MIPI DSI/CSI interfaces, two 2.5GbE ports, and M.2 sockets for NVMe SSD and wireless, among other features. The main change appears to be that the new model is now offered with up to 32GB LPDDR5 rather than up to 16GB LPDDR4x in the previous models. It’s closer to the NanoPC-T6 LTS, although it now supports two analog microphones instead of just one, and restores the M.2 Key-B socket for optional 4G LTE connectivity found in the original NanoPC-T6. The 10-pin UART + 2x USB 2.0 header found in the LTS variant gives way to a 3-pin UART debug […]

January 8, 2026January 9, 2026 by Debashis Das - No Comments

Intel Core Ultra Series 3 Panther Lake-H CPU powers TGS-2000 series stackable Edge AI computers

Vecow TGS 2000 Series Panther Lake Edge AI computers

At CES 2026, Intel unveiled the Core Ultra Series 3 processors, codenamed Panther Lake-H, built on the Intel 18A (1.8-nanometer class) process, and targeting both consumer and industrial applications. Vecow introduced one of the first industrial Panther Lake-H platforms with the TGS-2000 series, a new family of ultra-compact, stackable Edge AI computers designed for high-performance space-constrained applications and based on either the 16-core Intel Core Ultra 9 386H or 12-core Intel Core Ultra 5 336H SoC. This new 2000 series is an upgrade of the previous TGS-1000 series, which was launched in 2024 with Intel Meteor Lake processors. While the overall design stays mostly the same, the transition to Core Ultra Series 3 enhances AI performance, reaching up to 100 TOPS combined performance with the selected SKUs (note: the top-end Panther Lake-H CPU can deliver up to 180 TOPS). The TGS-2000 Series is available in three variants, including the fanless […]

December 30, 2025December 30, 2025 by Debashis Das - 5 Comments

Add four Gigabit or 2.5Gbps Ethernet ports to the Raspberry Pi 5 with this expansion board

Waveshare PCIe TO 4 Ch Gigabit for Raspberry Pi 5

Waveshare PCIE TO 4-CH Gigabit/2.5G ETH Board (B) is a 4-port Gigabit or 2.5 Gbps Ethernet board designed for the Raspberry Pi 5. This board connects four RJ45 ports to the Pi’s 16-pin PCIe interface and also includes a mounting option for the Pi5 Connector Adapter (C). The only limiting factor is the Pi’s PCIe Gen2/Gen3 x1 interface, as the 2.5GbE ports share the available bandwidth and cannot operate at full speed simultaneously. The Gigabit Ethernet variant features Realtek RTL8153 USB to Ethernet controllers, while the 2.5GbE variant relies on RTL8156 controllers, and both integrate a VL805 PCIe to USB bridge chip. The board also includes status LEDs for link and activity indication, and draws power directly from the PCIe interface without requiring an external power supply. The device is plug-and-play and supports Raspberry Pi OS out of the box with no additional drivers required. Applications include routers, firewalls, network […]

December 19, 2025February 6, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Fanless Box PC features Intel Core Ultra 5/7/9 “Arrow Lake” CPU with up to 36 TOPS for Edge AI applications

AAEON BOXER-6648-ARS Fanless Arrow Lake Box PC

AAEON BOXER-6648-ARS is a powerful, yet fanless embedded Box PC equipped with the latest generation Intel Core Ultra 5/7/9 “Arrow Lake” CPU with up to 24 cores clocked at up to 5.6 GHz, 36 TOPS of AI performance, and 35W or 65W TDP. The embedded computer is offered with either an Intel H810 or Intel Q870 chipset, with the latter enabling Intel Active Management Technology (AMT) and 10 Gbps USB 3.2 Gen2 ports. Other features include up to 96GB RAM, NVMe and SATA storage, dual HDMI video output, dual 2.5GbE, a Gigabit Ethernet port, optional WiFi and Bluetooth, a 10-pin terminal block, and up to six RS232/RS422/RS485 COM ports. AAEON BOXER-6648-ARS specifications: Arrow Lake SoC (one or the other) Intel Core Ultra 5 245 – 14-core (6P + 8E) processor up to 3.5 GHz / 5.1 GHz (Turbo), 26MB L2 cache, 4x Xe core graphics; TDP: 65W; AI: 29 TOPS […]