MediaTek Genio 1200 Linux system-on-module powers Cortex-A78/A55 AIoT development kit

I-Pi SMARC 1200

ADLINK Technology has just unveiled the SMARC 2.1 compliant LEC-MTK-I12000 system-on-module (SoM) powered by MediaTek Genio 1200 octa-core Cortex-A78/A55 AIoT processor coupled with up to 8GB RAM and 256GB UFS storage, as well as the I-Pi SMARC 1200 development kit designed for robotics and AIoT applications. LEC-MTK-I1200 MediaTek Genio 1200 system-on-module LEC-MTK-I1200 SoM specifications: SoC – MediaTek Genio 1200 (MT8395) octa-core processor with 4x Cortex-A78 cores @ 2.2GHz, 4x Cortex-A55 cores @ 2.0GHz with penta-core Arm Mali-G57 GPU @ 880MHz with support for OpenGL ES 3.2/2.0/1.1, Vulkan 1.1/1.0, OpenCL 2.2, 4.8 TOPS NPU, HiFi 4 audio DSP, etc… System Memory – 4 or 8 GB LPDDR4X Storage – 32, 64, 128, or 256 GB UFS storage, compatible with UFS gear 2.1 Wireless – 802.11b/g/n/ac WiFi 5 2×2 MU-MIMO, Bluetooth 5.0 314-pin MXM connector with Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display HDMI 2.0b […]

Arm SystemReady SR-certified Ampere Altra Developer Platform launched for $3,999

Ampere Altra Developer Platform

ADLINK has just announced the availability of the Arm SystemReady SR-certified Ampere Altra Developer Platform equipped with the company’s COM-HPC Ampere Altra module with 32 to 80 64-bit Arm Neoverse N1 cores, 32GB to 128GB RAM. An adaptation to the earlier AVA Developer Platform expected to sell for $5,450, the Ampere Altra Developer Platform got a price cut to $3,999 at launch for a system with a 32-core processor, and 32GB DDR4. The system targets software developers wanting to build cloud-to-edge applications using standardized Arm hardware. Ampere Altra Developer Platform specifications: SoM – COM-HPC Ampere Altra module with Ampere Altra 32 to 80-core 64-bit Arm Neoverse N1 processor up to 1.7/2.2/2.6 GHz (32/64/80 cores, TPD: 60W to 175W), 32 GB to 128GB DDR4 ECC memory Storage – 128 GB NVMe M.2 SSD Mainboard – COM-HPC Server Base carrier board Video – VGA port Audio – 3.5mm audio jack Networking 1x […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

COM-HPC Alder Lake-H

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

ADLINK LEC-RB5 – A Qualcomm QRB5165 SMARC module designed for drones and robots

Qualcomm QRB5165 SMARC module

ADLINK Technology LEC-RB5 is a SMARC compliant system-on-module powered by the Qualcomm QRB5165 octa-core Cortex-A77 class processor which we’ve already seen in Qualcomm Flight RB5 high-end drone reference design and Lantronix Open-Q 5165RB system-on-module designed for robotics applications. The LEC-RB5 SMARC module ships with up to 8GB PoP LPDDR4 memory, 256GB UFS storage, provides on-device artificial intelligence capabilities (up to 15 TOPS), support for up to 6 cameras, and low power consumption. The main target applications are high-end robots and drones in the consumer, enterprise, defense, industrial, and logistics sectors. LEC-RB5 SMARC SoM specifications: SoC – Qualcomm QRB5165 octa-core Kryo 585 processor with a Kryo Gold Prime @ 2.84 GHz, 3x 3 Kryo Gold @ 2.42 GHz, 4x Kryo Silver @ 1.81 GHz, Adreno 650 GPU @ up to 587 MHz, Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9, video encode HW acceleration for […]

AVA Developer Platform offers 32 64-bit Arm cores, 32GB RAM, 10GbE for $5,450

AVA Developer Plaform

The AVA Developer Platform was announced together with ADLink COM-HPC Ampera Altra server module for embedded applications with up to 80 64-bit Arm cores, up to 768GB DDR4, 4x 10GbE, and 64x PCIe Gen4 lanes. The AVA Developer Platform is not fitted with the top-end COM-HPC module, but still, with a 32-core COM-HPC Ampere Altra module fitted with 32 GB DDR4 memory, plus a 128 GB NVMe M.2 SSD, and an Intel Quad X710 10GbE LAN card, it still makes an impressive workstation for native Arm development. We did not know the price the last time, but now we do as the workstation is available for pre-order for $5,450. AVA Developer Platform specifications: SoM – COM-HPC Ampere Altra module with Ampere Altra 32-core 64-bit Arm Neoverse N1 processor up to 3.3 GHz (TPD: 60W), 32 GB DDR4 memory Storage – 128 GB NVMe M.2 SSD (From photos see below: extra […]

ADLINK COM-HPC Ampere Altra 80-core Arm server module targets embedded applications

ADLINK COM-HPC Ampere Altra

ADLINK has integrated Ampere Altra, an up to 80-core Armv8.2 server processor with up to 175W TDP, into a COM-HPC module designed for embedded applications, together with the AVA Developer Platform equipped with a 32-core processor and housed in an “ultra-silent liquid-cooled tower system”. Both the ADLINK COM-HPC Ampere Altra module and the developer kit are compliant with the just-announced Arm’s Scalable Open Architecture for Embedded Edge (SOAFEE), a “software initiative and reference implementation providing a cloud-native environment for embedded edge development”. ADLINK COM-HPC Ampere Altra COM-HPC Ampere Altra key features and specifications: SoC – Ampere Altra with 32x to 80x Armv8.2 Neoverse N1-based cores with up to 3.3 GHz frequency,  up to 128 lanes of high-speed PCIe Gen4 and 8×72 ECC protected DDR4 3200 memory; TDP: 60 to 175 Watts depending on the number of cores System Memory – Up to 768GB DDR4 with 6x individual memory channels Networking […]

Express-TL Tiger Lake-H COM Express module offers 8K video, PCIe Gen4 x16 connectivity

Tiger Lake-H COM Express

We just noticed some Intel Tiger Lake-H Xeon/Core/Celeron processors for embedded systems last week, and at the time it was not clear when they’d be announced and/or become available. It turns out it did not take long, as ADLINK has just unveiled their TL-Express COM Express Basic Size Type 6 module with the new processors. The new computer-on-module offers a more powerful alternative to the company’s cExpress-TL Tiger Lake UP3 COM Express Compact module, with up to 8 cores/16 threads, 128 GB memory, 8K video output, support for -40°C – 85°C industrial temperature range, and the company also claims it is the first COM Express module to support PCI Express Gen 4 x16, doubling the bandwidth of previous COM Express modules in the market. Express-TL COM Express Compact 6 CPU module specifications: Tiger Lake-H Embedded SoC (one or the other) Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 […]

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