ASRock Industrial NUC(S) Ultra 300 BOX Series is powered by Intel Core Ultra 5 325 or Ultra 7 358H “Panther Lake” SoC

ASROCK NUC Ultra 300 BOX Series NUC BOX 325

ASRock Industrial NUC(S) Ultra 300 BOX Series are powered by the Intel Core Ultra Series 3 “Panther Lake” SoC family, delivering up to 180 TOPS of AI performance. The NUC Ultra 300 BOX Series (117.5 x 110.0 x 49mm) integrates two 2.5GbE RJ45 jacks and three USB 3.0 ports, while the slimmer NUCS Ultra 300 BOX Series (117.5 x 110.0 x 38mm) comes with one 2.5GbE RJ45 jack and four USB 3.0 ports. They support DDR5 7200 MHz memory and M.2 NVMe (PCIe Gen5/Gen4) SSD storage, and offer four display interfaces up to 8K resolutions, WiFi 7 wireless connectivity, and more. The industrial mini PCs were first unveiled at CES 2026, but the press release lacked details, and I was unable to find extra information at the time. We now have more details with four SKUs available: the Intel Core Ultra 5 325-based NUC BOX-325 and NUCS BOX-325, and the […]

ASRock Industrial unveils DSC-NV003-WT NVIDIA Jetson AGX Orin Developer Kit

ASRock DSC-NV003-WT Jetson AGX Orin Developer kit

ASRock Industrial DSC-NV003-WT is an NVIDIA Jetson AGX Orin Developer Kit designed for edge AI, robotics, drones, Smart Cities, and advanced industrial applications with a wide operating temperature range (-25 to 50°C) and up to 275 TOPS of AI processing power. The solution is offered with NVIDIA Jetson AGX Orin Series (Industrial/64GB/32GB), supports up to four 4-lane MIPI or GMSLII cameras, and 12 PoE ports for computer vision applications. It also includes two PCIe Gen4 x8 slots, one M.2 Key M/B/E expansion slot for storage, 5G/4G LTE cellular, and Wi-Fi connectivity. ASRock Industrial DSC-NV003-WT specifications: System-on-Module (one or the other) NVIDIA Jetson AGX Orin Industrial (JAOi) SoC – Ampere GPU + Arm Cortex-A78AE CPU System Memory – 64GB 256-bit LPDDR5 (+ECC) Storage – 64GB eMMC 5.1 flash NVIDIA Jetson AGX Orin 64GB (JAO 64GB) SoC – Ampere GPU + Arm Cortex-A78AE CPU System Memory – 64GB 256-bit LPDDR5 Storage – […]

ASRock iEP-7040E fanless industrial IoT controllers feature Intel Core Ultra Arrow Lake-H CPU, 36V DI/DO

iEP 7040E Series

ASRock has recently released the iEP-7040E series which are Arrow Lake-H industrial IoT controllers powered by Intel Core Ultra “Arrow Lake-H” SoCs with Intel Arc graphics and Intel AI Boost. They feature a fanless design, 9V to 36V or 19V to 36V DC input, three Gigabit Ethernet ports, and two optional Intel GbE ports with PoE. Depending on the variant, the iEP-7040E supports 4x DI/4x DO or 8x DI/8x DO (with 36V isolation), up to 96GB DDR5 5600MHz with In-Band ECC (IBECC), and Intel In-Band Manageability with TPM 2.0. Expansion options include an M.2 B-Key socket and Nano SIM card slot for cellular, an M.2 E-Key socket for WiFi/BT, and an M.2 2280 M-key socket for storage. I/O options include HDMI 2.0b, VGA, three USB 3.2 Gen2 ports, one USB 2.0 port, three RS232/422/485, audio I/O, and multiple power options with OVP, UVP, OCP, and 80V surge protection. Certified for […]

ASROCK Industrial launches NUC(S) Ultra 200 (Intel Arrow Lake-H) and 4X4 AI300 (AMD Ryzen 300 AI) motherboards and BOX PCs

ASROCK Industrial NUC Ultra 200 BOX PC Motherboard

Following new SoC announcements by Intel and AMD at CES 2025, ASRock Industrial has launched the NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series powered by Intel Core Ultra 200H Arrow Lake-H processors with of to 99 TOPS of AI inferencing power, and the 4X4 BOX AI300 Series and 4X4 AI300 Motherboard Series based on  AMD Ryzen AI 300 processors with up to 50 TOPS of NPU performance. ASROCK NUC(S) Ultra 200 BOX PCs & NUC ULTRA 200 motherboards NUC(S) Ultra 200 specifications: Arrow Lake-H/U SoC (one or the other) Intel Core Ultra 7 255H (6P+8E) processor up to 5.1 GHz with 24MB cache, Intel Arc 140T GPU (74 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 Watts Intel Core Ultra 5 225H (4P+8E) processor up to 4.9 GHz with 18MB cache, Intel Arc 130T GPU (63 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 […]

ASRock DSF-A6000 embedded box PC offers AMD Ryzen Embedded R2314, 2.5GbE, and quad 4K display support

ASRock DSF A6000 embedded box PC

ASRock DSF-A6000 embedded box PC is built around the AMD Ryzen Embedded R2314 processor with support for up to 64GB of dual-channel DDR4 memory, three RJ45 ports (two 1GbE LAN, and one 2.5GbE LAN with optional PoE+) for connectivity. For storage, it features an M.2 M-Key slot for NVMe SSD and I/O options include USB 3.2 Gen2 and RS232. In terms of display capabilities, this PC supports up to four 4K displays simultaneously via HDMI 2.0b. Additionally, it supports out-of-band management through an optional MPU-OOB card and features EDID emulation for seamless display setup across various technologies. Previously we have written about similar embedded box PCs like the Distec BoxPC Pro, the AAEON ARES-500AI embedded box PC, the BOXER-8256AI NVIDIA Jetson Xavier NX fanless embedded box PC, and many more feel free to check those out if you are interested in the topic. ASRock DSF-A6000 embedded box PC specifications: SoC […]

ASRock IMB-A8000 industrial Ryzen Embedded 8000 mini-ITX motherboard takes up to 96GB DDR5 RAM

ASRockI MB A8000 Mini ITX Industrial Motherboard

ASRock Industrial recently launched the IMB-A8000, an industrial and embedded motherboard in a mini-ITX form factor. As an embedded motherboard, it is powered by AMD Ryzen Embedded 8000 series APU which features 8 cores and 16 threads, built with 4nm technology, and including a 16 TOPS AI accelerator. The motherboard supports up to 96GB of dual-channel DDR5-5600MHz memory and includes one 2.5GbE LAN port and one GbE LAN port. With a wide temperature range of -20ºC to 70ºC this motherboard can be used in applications like manufacturing, robotics, machine vision, and more. Previously we have seen SolidRun introduce the Bedrock R8000 industrial PC built around the Ryzen Embedded 8000 APU family. Other than that we have written about other Ryzen Embedded mini-ITX motherboards/SBCs such as the Flex Logic InferX Hawk combining an AMD Ryzen Embedded R2314 SoC with AI accelerators, the DFI RNO171 with Ryzen Embedded V2000 family, or more […]

ASRock SBC-262M-WT 3.5-inch motherboard features up to Intel Atom X7433RE Amston Lake processor

Amston Lake 3.5-inch motherboard

ASRock Industrial SBC-262M-WT is a 3.5-inch SBC motherboard powered by the latest Intel Atom x7433RE quad-core Amston Lake embedded processor with support for up to 48GB DDR5-4800 memory, triple 4K display outputs, two Ethernet ports, including one with 2.5Gbps Ethernet and Intel TSN/TCC. The motherboard also takes SATA 3.0 and M.2 Key M NVMe storage, offers multiple USB interfaces, supports WiFi and/or  4G LTE or 5G cellular connectivity via M.2 modules and SIM card socket, and provides industrial features such as a wide -40 to 85°C operating temperature range and a wide 9V to 36V DC voltage input range that make it suitable for smart retail, smart cities, and embedded industrial environments. ASRock Industrial SBC-262M-WT 3.5-inch motherboard specifications: SoC – Intel Amston Lake Processors up to Atom X7433RE quad-core processor clocked up to 3.4GHz with Intel UHD Graphics; 9W TDP System Memory – Up to 48GB single-channel DDR5 4800 MHz […]

AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000

AMD has recently “announced” the Ryzen Embedded 8000 Series processors in a community post with the latest AMD embedded devices combining a 16 TOPS NPU based on the AMD XDNA architecture with CPU and GPU elements for a total of 39 TOPS designed for industrial artificial intelligence. The Ryzen Embedded 8000 CPUs will be found in machine vision, robotics, and industrial automation applications to enhance the quality control and inspection processes, enable real-time, route-planning decisions on-device for minimal latency, and predictive maintenance, and autonomous control of industrial processes. AMD Ryzen Embedded 8000 key features and shared specifications: CPU – Up to 8 “Zen 4” cores, 16 threads Cache L1 Instruction Cache – 32 KB, L1 Data Cache = 32 KB (per core) L2 Cache – Up to 8 MB (total) L3 Cache-  Up to 16 MB unified Graphics – RDNA 3 graphics with up to 6 WGPs (Work Group processors) […]

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