automotive News - CNX Software - Embedded Systems News

April 16, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Intel Core Ultra X7 358H-powered open robotics development system targets humanoid robots and autonomous vehicles

AAEON CEXD-INTRBL is an “open robotics development system” powered by a 16-core, 180 TOPS Intel Core Ultra X7 Processor 358H (Panther Lake) SoC and designed for the development of AI-enhanced humanoid robots and autonomous vehicle platforms. The Edge AI computer features four 2.5GbE ports with support for IEEE1588 PTP (Precision Time Protocol), two FAKRA connectors for up to eight GMSL2 cameras, four USB 3.2 Type-C ports, two USB 2.0 ports, a CAN Bus connector, and a 40-pin HAT connector with 22 GPIOs. AAEON CEXD-INTRBL specifications: SoC – Intel Core Ultra X7 358H CPU – 16-core (4P + 8E + 4LPE) Panther Lake processor @ up to 4.8 GHz Cache – 18 MB Smart Cache GPU – 12-core Intel Arc B390 GPU @ up to 2.5 GHz (122 TOPS) AI accelerator – 50 TOPS; CPU + GPU + NPU combined: 180 TOPS PBP – 25 Watts System Memory – Up to […]

April 16, 2026April 16, 2026 by Debashis Das - No Comments

IP65-rated TWOWIN T808P-G Edge AI computer features 8x GMSL2 cameras, aviation-grade M12/M16 connectors

TWOWIN Technology has introduced the TW-T808P-G, a rugged, fan-cooled, IP65 edge AI computer built around the NVIDIA Jetson Orin NX system-on-module (SoM). Designed specifically for autonomous driving, unmanned delivery vehicles, and smart inspection scenarios, the system provides up to 157 TOPS of AI performance and features various connectivity options for real-time processing in industrial and smart infrastructure environments. Housed in an aluminum alloy enclosure, the device features aviation-grade M12 and M16 connectors for Gigabit Ethernet (PoE), RS232/RS485 serial communication, and power. Other features include two FAKRA connectors for up to eight GMSL2 cameras, USB 3.0, CAN Bus, GPIO, HDMI, and M.2 NVMe storage. It also supports optional Wi-Fi, 4G/5G, and RTK GPS for centimeter-level positioning. With a wide 9–36V input, a zero-power standby design using automotive ACC (ignition) control, and an operating range of -40°C to +70°C, the system is designed for applications such as security monitoring, smart gas stations, […]

April 8, 2026April 7, 2026 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

AMD EPYC Embedded 8004 eATX motherboard supports up to 576GB DDR5 memory for Edge AI applications

IBASE MBB1002 eATX motherboard 576GB DDR5 RAM

IBASE Technology MBB1002 eATX (Extended ATX) motherboard is powered by AMD EPYC Embedded 8004 series processors and takes up to 576GB DDR5-4800 ECC memory for next-generation edge AI and data-intensive applications in manufacturing, transportation, and edge computing infrastructure. The “embedded” motherboard features five PCIe Gen5 x16 slots for integrating various GPUs and AI accelerators, dual 10GbE networking, NVMe and SATA storage, and USB 3.2 ports with PDPC (Peripheral Device Power Control). IBASE MBB1002 specifications: SoC – AMD EPYC Embedded 8004 series processor with up to 64x Zen4 cores (128 threads) via AMD SP6 LGA 4844 socket System Memory – Up to 576GB DDR5-4800 via 6x RDIMM slots with ECC; note: 576 GB = 6 x 96GB Storage 4x SATA III ports NVMe SSD via M.2 Key-M 2280 (PCIe Gen.5) socket NVMe SSD(s) via 2x MCIO (Mini Cool Edge IO) x4 sockets Networking – 2x 10GbE RJ45 ports via Intel XC710-AT2 […]

March 27, 2026 by Debashis Das - 8 Comments

Microchip SAM9X75 Hybrid automotive MCU – Surprisingly ARM9 is still a thing in 2026

When Microchip launched the SAM9X60 in 2020, we were surprised to see a new SoC based on a legacy ARM926EJ-S core. But we were even more surprised to see Microchip doubling down with the SAM9X75, a hybrid automotive-qualified (AEC-Q100 Grade 2) System-in-Package (SiP) with the same classic ARM9 core and integrated DDR2 or DDR3L memory. The first part will be the SAM9X75D5M SiP with 512MB on-chip DDR2 RAM, but the company also designed the SAM9X75D1G with 1 Gbit DDR3L and the SAM9X75D2G featuring 2 Gbit DDR3L. The SAM9X75 hybrid ARM9 MCU targets developers who need an MCU-like development environment, while benefiting from higher processing and display capabilities of microprocessors for automotive and e-mobility HMI applications. Microchip SAM9X75D5M specifications: CPU subsystem Core – ARM926EJ-S running up to 800 MHz (significant increase from older 400-600MHz variants) 32 KB data cache, 32 KB instruction cache, and Memory Management Unit (MMU). Memory 512 Mbit […]

March 20, 2026 by Debashis Das - No Comments

u-blox JODY-W6 – NXP IW623/AW693 tri-band Wi-Fi 6E and Bluetooth 5.4 LE audio modules

u blox JODY W6 tri band Wi Fi 6E module for industrial IoT

u-blox has expanded its JODY family of modules with the NXP IW623/AW693-based JODY-W6 series that adds tri-band Wi-Fi 6E and Bluetooth 5.4 (including LE Audio) in a single package. There are seven product variants across five main series models, mainly based on NXP’s IW623 chipset for professional use and the AW692/AW693 for automotive use. The modules are optimized for the parallel operation of Wi-Fi and Bluetooth and target high-throughput, low-latency, and secure connectivity use cases such as industrial automation, healthcare systems, smart buildings, network infrastructure, and in-vehicle infotainment and telematics systems. It has a 15.6 × 19.8 mm LGA form factor, and it’s designed for easy migration within the JODY family. u-blox JODY-W6 specifications Wireless SoC NXP IW623 (Professional grade – JODY-W672, JODY-W673 ) NXP AW692 / AW693 (Automotive grade 2 – JODY-W682, JODY-W683, JODY-W663 ) Connectivity Wi-Fi Standards – Wi-Fi 6E IEEE 802.11a/b/g/n/ac/ax Frequencies – 2.4 GHz (1-13), 5 […]

March 13, 2026March 13, 2026 by Debashis Das - No Comments

ST ST64UWB Cortex-M85 ultra-wideband SoC supports IEEE 802.15.4z and 802.15.4ab UWB standards, radar sensing

STMicroelectronics ST64UWB UWB solution for Automotive Consumer and Industrial Applications

STMicroelectronics ST64UWB Arm Cortex-M85 ultra-wideband (UWB) SoC family supports both the current IEEE 802.15.4z and the upcoming IEEE 802.15.4ab UWB standards for longer-range, more reliable positioning and secure proximity-based interactions. It mainly targets digital car keys, hands-free access, and smart-device detection. The family includes the ST64UWB-A100 (automotive entry), ST64UWB-A500 (automotive premium), and ST64UWB-C100 (industrial/smart home), all built on an 18 nm FD-SOI process that improves the RF link budget by ~3 dB, yielding roughly 50% additional range beyond what IEEE 802.15.4ab alone provides. The automotive-focused A-series offers ASIL-A(B) safety support, while the ST64UWB-C100 targets consumer and commercial applications. ST64UWB family specifications: MCU Core 32-bit Arm Cortex-M85 CPU with DP-FPU, MVE, and ETM Frequency Up to 100 MHz (ST64UWB-C100, ST64UWB-A100) Up to 256 MHz (ST64UWB-A500) Memory/Storage Integrated PCM Memory SRAM and Back-up SRAM Wireless Connectivity Ultra-wideband (UWB) Radio IEEE 802.15.4z-2020 and IEEE 802.15.4ab support UWB channels 5, 6, 8, 9, 10, […]

March 12, 2026 by Debashis Das - 8 Comments

MediaTek unveils 50 TOPS Genio Pro 5100 Cortex-X925/X4/A720 SoC, 7.2 TOPS Genio 420 Cortex-A78/A55 SoC for AIoT applications

MediaTek Genio Pro 5100 and Genio 420 IoT SoCs

After launching the Genio 360/360P hexa/octa-core SoCs last month, MediaTek has now expanded the lineup with the Genio Pro 5100 and Genio 420 AIoT SoCs at Embedded World 2026. The Genio Pro 5100 is a 3nm SoC with an “all big-core” architecture and a 50+ TOPS NPU for Edge AI applications. The Genio 420, on the other hand, is a cost-efficient 6nm platform designed for smart home, retail, and industrial IoT devices. MediaTek Genio Pro 5100 The Genio Pro 5100 integrates one Cortex-X925, three Cortex-X4, and four Cortex-A720 cores, as well as an Arm Immortalis-G925 GPU, and supports LPDDR5X memory up to 8533 Mbps. It can handle up to three 4K displays, up to 16 cameras via virtual channels, and 8K30 video encode/decode, and offers interfaces such as PCIe Gen4, USB 3.2 Gen2, USB 2.0, and dual 2.5GbE MAC. Genio Pro 5100 (MT8894) specifications: CPU – 8-core Arm v9.2 processor […]

March 12, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Qualcomm X105 6G-ready 5G modem to deliver 14.8 Gbps download and 4.2 Gbps upload peak data speeds

Qualcomm X105 is the world’s first 3GPP Release 19-ready modem-RF system supporting 5G connectivity up to 14.8 Gbps download and 4.2 Gbps upload peak data speeds, and enabling 6G development and testing. Other Qualcomm X105 highlights include a 6nm RF transceiver with 30% lower power consumption and 15% smaller board footprint compared to the Qualcomm X85 5G modem, support for quad-band GNSS, an integrated NR-NTN for video, data and voice over satellite, and a fifth-generation AI processor leveraging agentic AI to detect, classify, and optimize data traffic for mobile gaming, video calling, and social media. Qualcomm X105 Modem-RF system specifications: Peak speeds Download – 14.8 Gbps (FR1 + FR2), 13.1 Gbps (FR1) Upload – 4.2 Gbps Downlink Carrier Aggregation: 6F+T CA (500MHz) with 1024 QAM TDD/FDD with 1024 QAM Turbo DSDA enhancements, including Multi-SIM CA support (up to 60% higher throughput) 3rd-gen 6Rx for smartphones and FWA CPEs (with 10% […]