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May 8, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Microchip launches LAN878x and LAN888x Single Pair Ethernet (SPE) transceivers with MACSec, TSN, and FuSA

Microchip LAN878x LAN888x Single Pair Ethernet SPE PHY transceivers

Microchip’s LAN878x 100BASE-T1 and LAN888x 1000BASE-T1 Single Pair Ethernet (SPE) PHY transceivers are designed for secure, scalable, and deterministic Ethernet connectivity for automotive, avionics, robotics, and industrial systems. We first noticed Microchip SPE solutions in 2023 with the LAN8650/LAN8651 10BASE-T1S and LAN8770 100BASE-T1 transceivers, and they’ve launched other families since then, such as the LAN887x industrial Single Pair Gigabit Ethernet transceivers. The just-announced LAN878x/LAN88x parts introduce MACsec support, as well as Time Sensitive Networking (TSN) and FuSa (Functional Safety). Microchip LAN878x and LAN888x key features and specifications: Standard and port speed LAN878x – IEEE 802.3bw, 100BASE-T1 LAN888x – IEEE 802.3bp, 1000BASE-T1 MACsec compliant to IEEE 802.1AE-2018 (M Version Only) Time Sensitive Networking (TSN) support Host interface (one or the other, depending on SKU) SGMII (Serial Gigabit Media Independent Interface) RGMII (Reduced Gigabit Media Independent Interface) OPEN Alliance TC10 support / wake-up support IEEE 802.1AS-2020, 802.1AS-2011 ASIL B Functional Safety Ready with […]

May 5, 2026May 5, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Congatec conga-TC300 COM Express module features up to Intel Core 7 350 Wildcat Lake processor

Intel Wildcat Lake COM Express Compact module

congatec conga-TC300 is an entry-level edge AI COM Express Type-6 Compact module powered by 15W Intel Core Series 3 “Wildcat Lake” SoCs up to the Core 7 350 hexa-core processor. The module supports up to 64GB DDR5 SO-DIMM memory and features optional on-board UFS 3.1 storage, an Intel i226 2.5GbE controller, and two standard 220-pin board-to-board connectors exposing I/Os such as SATA, DDI and LVDS or eDP display interfaces, USB4, USB 3.2, USB 2.0, PCIe Gen4/Gen3, and more. congatec conga-TC300 specifications: Wildcat Lake SoC (one or the other) Intel Core 3 305 6-core CPU – 2x P-cores @ 1.5/4.3 GHz (Turbo) + 4x LPE-cores @ 1.4/3.3 GHz (Turbo) GPU – 1-core Intel Xe3 Graphics @ 2.3 GHz (9 TOPS) NPU – N/A Intel Core 5 320 6-core CPU – 2x P-cores @ 1.5/4.6 GHz (Turbo) + 4x LPE-cores @ 1.4/3.4 GHz (Turbo) GPU – 2-core Intel Xe3 Graphics @ 2.5 […]

April 23, 2026April 23, 2026 by Debashis Das - 2 Comments

Microchip PIC16F132 and PIC18-Q35 low-power 8-bit MCUs feature CPLD-like Configurable Logic Blocks (CLB)

PIC16F13276 and PIC18 Q35 families of Configurable Logic Block MCUs

Microchip Technology has introduced the PIC16F132 and PIC18-Q35 8-bit families of MCUs, as an upgrade over the PIC16F13145, which combine traditional embedded control with integrated Configurable Logic Blocks (CLB), to bring CPLD-like programmable logic directly onto the microcontroller die. The main difference between the two families is in logic density, where the PIC16F132x includes 32 Basic Logic Elements (BLEs), and the PIC18-Q35 offers 128 BLEs. Alongside the CLB, these MCUs also integrate security and voltage management features. Programming and Debugging Interface Disable (PDID) provides anti-tamper protection against unauthorized firmware access, and Multi-Voltage I/O (MVIO) allows direct communication across different voltage domains without external level shifters. The company also mentions that by executing logic functions on dedicated hardware rather than in software, the CLB architecture reduces CPU load and power consumption while ensuring deterministic behavior. This makes the devices well-suited for timing-critical applications such as motor control, industrial automation, consumer electronics, […]

April 16, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Intel Core Ultra X7 358H-powered open robotics development system targets humanoid robots and autonomous vehicles

AAEON CEXD-INTRBL is an “open robotics development system” powered by a 16-core, 180 TOPS Intel Core Ultra X7 Processor 358H (Panther Lake) SoC and designed for the development of AI-enhanced humanoid robots and autonomous vehicle platforms. The Edge AI computer features four 2.5GbE ports with support for IEEE1588 PTP (Precision Time Protocol), two FAKRA connectors for up to eight GMSL2 cameras, four USB 3.2 Type-C ports, two USB 2.0 ports, a CAN Bus connector, and a 40-pin HAT connector with 22 GPIOs. AAEON CEXD-INTRBL specifications: SoC – Intel Core Ultra X7 358H CPU – 16-core (4P + 8E + 4LPE) Panther Lake processor @ up to 4.8 GHz Cache – 18 MB Smart Cache GPU – 12-core Intel Arc B390 GPU @ up to 2.5 GHz (122 TOPS) AI accelerator – 50 TOPS; CPU + GPU + NPU combined: 180 TOPS PBP – 25 Watts System Memory – Up to […]

April 16, 2026April 16, 2026 by Debashis Das - No Comments

IP65-rated TWOWIN T808P-G Edge AI computer features 8x GMSL2 cameras, aviation-grade M12/M16 connectors

TWOWIN Technology has introduced the TW-T808P-G, a rugged, fan-cooled, IP65 edge AI computer built around the NVIDIA Jetson Orin NX system-on-module (SoM). Designed specifically for autonomous driving, unmanned delivery vehicles, and smart inspection scenarios, the system provides up to 157 TOPS of AI performance and features various connectivity options for real-time processing in industrial and smart infrastructure environments. Housed in an aluminum alloy enclosure, the device features aviation-grade M12 and M16 connectors for Gigabit Ethernet (PoE), RS232/RS485 serial communication, and power. Other features include two FAKRA connectors for up to eight GMSL2 cameras, USB 3.0, CAN Bus, GPIO, HDMI, and M.2 NVMe storage. It also supports optional Wi-Fi, 4G/5G, and RTK GPS for centimeter-level positioning. With a wide 9–36V input, a zero-power standby design using automotive ACC (ignition) control, and an operating range of -40°C to +70°C, the system is designed for applications such as security monitoring, smart gas stations, […]

April 8, 2026April 7, 2026 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

AMD EPYC Embedded 8004 eATX motherboard supports up to 576GB DDR5 memory for Edge AI applications

IBASE MBB1002 eATX motherboard 576GB DDR5 RAM

IBASE Technology MBB1002 eATX (Extended ATX) motherboard is powered by AMD EPYC Embedded 8004 series processors and takes up to 576GB DDR5-4800 ECC memory for next-generation edge AI and data-intensive applications in manufacturing, transportation, and edge computing infrastructure. The “embedded” motherboard features five PCIe Gen5 x16 slots for integrating various GPUs and AI accelerators, dual 10GbE networking, NVMe and SATA storage, and USB 3.2 ports with PDPC (Peripheral Device Power Control). IBASE MBB1002 specifications: SoC – AMD EPYC Embedded 8004 series processor with up to 64x Zen4 cores (128 threads) via AMD SP6 LGA 4844 socket System Memory – Up to 576GB DDR5-4800 via 6x RDIMM slots with ECC; note: 576 GB = 6 x 96GB Storage 4x SATA III ports NVMe SSD via M.2 Key-M 2280 (PCIe Gen.5) socket NVMe SSD(s) via 2x MCIO (Mini Cool Edge IO) x4 sockets Networking – 2x 10GbE RJ45 ports via Intel XC710-AT2 […]

March 27, 2026 by Debashis Das - 8 Comments

Microchip SAM9X75 Hybrid automotive MCU – Surprisingly ARM9 is still a thing in 2026

When Microchip launched the SAM9X60 in 2020, we were surprised to see a new SoC based on a legacy ARM926EJ-S core. But we were even more surprised to see Microchip doubling down with the SAM9X75, a hybrid automotive-qualified (AEC-Q100 Grade 2) System-in-Package (SiP) with the same classic ARM9 core and integrated DDR2 or DDR3L memory. The first part will be the SAM9X75D5M SiP with 512MB on-chip DDR2 RAM, but the company also designed the SAM9X75D1G with 1 Gbit DDR3L and the SAM9X75D2G featuring 2 Gbit DDR3L. The SAM9X75 hybrid ARM9 MCU targets developers who need an MCU-like development environment, while benefiting from higher processing and display capabilities of microprocessors for automotive and e-mobility HMI applications. Microchip SAM9X75D5M specifications: CPU subsystem Core – ARM926EJ-S running up to 800 MHz (significant increase from older 400-600MHz variants) 32 KB data cache, 32 KB instruction cache, and Memory Management Unit (MMU). Memory 512 Mbit […]

March 20, 2026 by Debashis Das - No Comments

u-blox JODY-W6 – NXP IW623/AW693 tri-band Wi-Fi 6E and Bluetooth 5.4 LE audio modules

u blox JODY W6 tri band Wi Fi 6E module for industrial IoT

u-blox has expanded its JODY family of modules with the NXP IW623/AW693-based JODY-W6 series that adds tri-band Wi-Fi 6E and Bluetooth 5.4 (including LE Audio) in a single package. There are seven product variants across five main series models, mainly based on NXP’s IW623 chipset for professional use and the AW692/AW693 for automotive use. The modules are optimized for the parallel operation of Wi-Fi and Bluetooth and target high-throughput, low-latency, and secure connectivity use cases such as industrial automation, healthcare systems, smart buildings, network infrastructure, and in-vehicle infotainment and telematics systems. It has a 15.6 × 19.8 mm LGA form factor, and it’s designed for easy migration within the JODY family. u-blox JODY-W6 specifications Wireless SoC NXP IW623 (Professional grade – JODY-W672, JODY-W673 ) NXP AW692 / AW693 (Automotive grade 2 – JODY-W682, JODY-W683, JODY-W663 ) Connectivity Wi-Fi Standards – Wi-Fi 6E IEEE 802.11a/b/g/n/ac/ax Frequencies – 2.4 GHz (1-13), 5 […]