Portwell PCOM-B887 and PCOM-B886 are two new COM-HPC client modules built around Intel Core Ultra 200S/200U/200H processors delivering high-performance computing and AI acceleration for industrial, edge, and AI-driven applications. The Portwell PCOM-B887 (Size C) module is built around the 200S Series, offers up to 36 TOPS, supports 192GB DDR5 memory, and features 42 PCIe lanes up to Gen5. The PCOM-B886 (Size B) module supports 200H/200U Series processors, which deliver up to 99 TOPS, support 96GB DDR5 memory, and include 24 PCIe lanes. Both modules feature various I/O options, including USB4, USB3.2 Gen2, and multiple display outputs. Portwell PCOM-B887 – COM-HPC Client Type Size C module The PCOM-B887 COM-HPC Client Type Size C module is powered by Intel Core Ultra 200S Series processors, which feature up to 36 TOPS of AI performance via an integrated neural processing unit (NPU). It supports up to 192GB of DDR5 memory at 4800MT/s with 42 […]
conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)
Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]
High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)
Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]
COM-HPC 1.2 specification released with COM-HPC Mini 95x70mm form factor
PICMG has announced the release of the COM-HPC 1.2 specification adding the COM-HPC Mini form factor that’s about the size of a credit card (90x75mm) or half the size of the next-smallest COM-HPC form factor but still provides access to high-speed interfaces such as PCIe Gen5, USB4, and 10GbE. The COM-HPC “High-Performance Computing” form factor was introduced a few years ago for more powerful CPUs (higher TDP) with support for PCIe Gen4 (the COM Express form factor can’t handle PCIe Gen 4 clock speeds and throughputs well), and until now four sizes were available with COM-HPC Client Type modules measuring 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules having either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 60 mm) credit card-sized form factor to the COM-HPC standard for applications such […]
Selecting Raptor Lake COM-HPC or COM Express modules for your application (Sponsored)
ADLINK Technology introduced the COM-HPC-cRLS (Raptor Lake-S) COM-HPC size C module and Express-RLP Raptor Lake-P COM Express Type 6 module at the beginning of the year, and while we covered the specifications for both in detail at the time of the announcement, we’ll compare the advantages and benefits of the two types of 13th generation Raptor Lake modules in this post and compare 12th gen Alder Lake-S and 13th Gen Raptor Lake-S processor performance to help potential buyers select the right one for their applications. Raptor Lake COM-HPC vs COM Express vs modules The table above provides a high-level comparison between the COM-HPC-cRLS (Raptor Lake-S) and the Express-RLP (Raptor Lake-P) modules. The Raptor Lake-S socketed processor family found in the COM-HPC provides more processing power, supports up to 128GB DDR5, and the COM-HPC standard adds support for PCIe Gen5 which is not possible with the COM Express standard. The Raptor […]
conga-HPC/cRLS Raptor Lake COM-HPC Client module supports up to 128GB DDR5 RAM
Congatec conga-HPC/cRLS is a COM-HPC Client Size C computer-on-module based on a 13th gen Intel Raptor Lake processor with support for up to 128GB DDR5 memory through four SO-DIMM sockets. The COM-HPC module also provides up to three DDI display interfaces, two 2.5GbE networking interfaces with TSN support, two SATA storage interfaces, and a range of PCIe Gen 3, 4, and 5 interfaces through the two 400-pin connectors defined in the COM-HPC standard. conga-HPC/cRLS specifications: Raptor Lake-S SoC (one or the other) Intel Core i3-13100E with 4x P-cores @ 3.3GHz / 4.4GHz, 12 MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i5-13400E with 6x P-cores @ 2.4GHz / 4.6GHz, 4x E-cores @ 1.5GHz / 3.3GHz, 20MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i7-13700E with 8x P-cores @ 1.9GHz / 5.1GHz, 8x E-cores @ 1.3GHz / 3.9GHz, 30MB cache, Intel UHD Graphics 770; PBP: 65W Intel […]
COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors
ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up […]
Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces
PICMG has announced that the COM-HPC Mini form factor’s pinout and dimensions definitions were finalized, with the tiny credit card-sized modules able to handle PCIe Gen4 and Gen5 interfaces, of course, depending on whether the selected CPU supports those. The COM-HPC “High-Performance Computing” form factor was created a few years ago due to the lack of interfaces on the COM Express form factor with “only” 440 pins and potential issues to handle PCIe Gen 4 clock speeds and throughputs. So far, we had COM-HPC Client Type modules from 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules with either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 70 mm) credit card-sized form factor to the COM-HPC standard. The way they cut the size of the COM-HPC Size A form factor by half […]