conga-HPC/cRLS Raptor Lake COM-HPC Client module supports up to 128GB DDR5 RAM

Congatec conga HPC/cRLS COM HPC Client Size C Raptor Lake CPU

Congatec conga-HPC/cRLS is a COM-HPC Client Size C computer-on-module based on a 13th gen Intel Raptor Lake processor with support for up to 128GB DDR5 memory through four SO-DIMM sockets. The COM-HPC module also provides up to three DDI display interfaces, two 2.5GbE networking interfaces with TSN support, two SATA storage interfaces, and a range of PCIe Gen 3, 4, and 5 interfaces through the two 400-pin connectors defined in the COM-HPC standard. conga-HPC/cRLS specifications: Raptor Lake-S SoC (one or the other) Intel Core i3-13100E with 4x P-cores @ 3.3GHz / 4.4GHz, 12 MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i5-13400E with 6x P-cores @ 2.4GHz / 4.6GHz, 4x E-cores @ 1.5GHz / 3.3GHz, 20MB cache, Intel UHD Graphics 730; PBP: 65W Intel Core i7-13700E with 8x P-cores @ 1.9GHz / 5.1GHz, 8x E-cores @ 1.3GHz / 3.9GHz, 30MB cache, Intel UHD Graphics 770; PBP: 65W Intel […]

COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors

ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up […]

Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces

PICMG has announced that the COM-HPC Mini form factor’s pinout and dimensions definitions were finalized, with the tiny credit card-sized modules able to handle PCIe Gen4 and Gen5 interfaces, of course, depending on whether the selected CPU supports those. The COM-HPC “High-Performance Computing” form factor was created a few years ago due to the lack of interfaces on the COM Express form factor with “only” 440-pins and potential issues to handle PCIe Gen 4 clock speeds and throughputs. So far, we had COM-HPC Client Type modules from 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules with either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 60 mm) credit card-sized form factor to the COM-HPC standard. The way they cut the size of the COM-HPC Size A form factor by half was […]

conga-HPC/uATX is a micro-ATX board for COM-HPC Client Type modules

congatec has just introduced the conga-HPC/uATX micro-ATX carrier board designed for COM-HPC Client modules size A, B, and C. The board is vendor independent since it is based on the COM-HPC and micro-ATX standards and designed for embedded long-term availability of at least seven years. That means the micro-ATX carrier board works congatec solutions such as the high-end conga-HPC/cALS COM-HPC Client Size C module with up to a 16-core Intel Core i9 Alder Lake-S processor or the more power-efficient conga-HPC/cALP COM-HPC Client Size A modules with Intel Celeron 7305E processor, as well as similar solutions from ADLINK Technology, Advantech, Portwell, and other vendors. conga-HPC-/uATX carrier board specifications: Compatible with COM-HPC Client Type Modules (Size A: 95 x 120mm, Size B: 120 x 120mm, and Size C: 160 x 120mm) with CPU and memory sockets Video Output 3x DP++ with 8.1 Gbps Re-driver 1x eDP (optional for LVDS) Audio HDA codec […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

ADLINK COM-HPC Ampere Altra 80-core Arm server module targets embedded applications

ADLINK has integrated Ampere Altra, an up to 80-core Armv8.2 server processor with up to 175W TDP, into a COM-HPC module designed for embedded applications, together with the AVA Developer Platform equipped with a 32-core processor and housed in an “ultra-silent liquid-cooled tower system”. Both the ADLINK COM-HPC Ampere Altra module and the developer kit are compliant with the just-announced Arm’s Scalable Open Architecture for Embedded Edge (SOAFEE), a “software initiative and reference implementation providing a cloud-native environment for embedded edge development”. ADLINK COM-HPC Ampere Altra COM-HPC Ampere Altra key features and specifications: SoC – Ampere Altra with 32x to 80x Armv8.2 Neoverse N1-based cores with up to 3.3 GHz frequency,  up to 128 lanes of high-speed PCIe Gen4 and 8×72 ECC protected DDR4 3200 memory; TDP: 60 to 175 Watts depending on the number of cores System Memory – Up to 768GB DDR4 with 6x individual memory channels Networking […]