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Posted on by Sponsored Post - No Comments on High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

COM-HPC Mini Academy

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on COM Express development kit ships with Intel Core i3-13300HE or Core i5-13600HE Raptor Lake-P processor

COM Express development kit ships with Intel Core i3-13300HE or Core i5-13600HE Raptor Lake-P processor

COM Express Raptor Lake development kit

ADLINK has launched an “IoT prototyping kit” based on the company’s Express-RLP COM Express Type 6 module with either an Intel Core i3-13300HE or Core i5-13600HE Raptor Lake-P processor. The module supports up to 64GB DDR5 and the ATX carrier board offers a wide range of interfaces such as 2.5GbE, two SATA ports, DisplayPort, LVDS (or EDP), and VGA video outputs, two USB4 ports, and more. COM Express Type 6 Raptor Lake-P devkit specifications: System-on-Module – ADLINK Express-RLP COM Express Type 6 computer-on-module Raptor Lake-P SoC Intel Core i5-13600HE 4P+8E cores/16 threads processor @ up to 2.7 GHz with 18MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i3-13300HE 4P+4E cores/12 threads processor @ up to 2.1 GHz with 12MB cache, Intel UHD graphics; TDP: 45W (cTDP: 35W) System Memory – Up to 64GB (2x 32GB) DDR5 via SO-DIMM sockets Dimensions – 125 x 95 mm (PICMG […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC 2.1 module features TI TDA4VM/DRA829J Jacinto 7 processor

conga-STDA4 SMARC Module TI Jacinto 7 TDA4VM DRA829J

congatec conga-STDA4 is a SMARC Computer-on-Module (CoM) based on Texas Instruments TDA4VM or DRA829J Jacinto 7 processor with two Cortex-A72 cores, six real-time Cortex-R5 cores for functional safety, accelerated vision and AI processing capabilities, and plenty of interfaces. The first Texas Instruments-powered CoM from the company is designed for industrial mobile machinery requiring near-field analytics, such as automated guided vehicles and autonomous mobile robots, construction and agricultural machinery, as well as any industrial or medical solutions requiring energy-efficient computer vision at the edge. conga-STDA4 specifications: SoC – Texas Instruments Jacinto 7 TDA4VM/DRA829J with Dual-core Arm Cortex-A72 up to 2.0 GHz 6x Arm Cortex-R5F cores @ 1.0 GHz up to 8 MB of on-chip L3 RAM 1x C7x DSP up to 80 GFLOPs 2x C66 DSPs up to 40 GFLOPs Up to 8 TOPS MMA AI accelerator PowerVR Rogue 8XE GE8430 3D GPU with support for OpenGL ES 3.1, OpenVX, OpenCL […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces

Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces

COM-HPC Mini

PICMG has announced that the COM-HPC Mini form factor’s pinout and dimensions definitions were finalized, with the tiny credit card-sized modules able to handle PCIe Gen4 and Gen5 interfaces, of course, depending on whether the selected CPU supports those. The COM-HPC “High-Performance Computing” form factor was created a few years ago due to the lack of interfaces on the COM Express form factor with “only” 440 pins and potential issues to handle PCIe Gen 4 clock speeds and throughputs. So far, we had COM-HPC Client Type modules from 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules with either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 70 mm) credit card-sized form factor to the COM-HPC standard. The way they cut the size of the COM-HPC Size A form factor by half […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 11 Comments on Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

QSeven_vs_SMARC

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on 25-45W Intel Tiger Lake-H Xeon, Core, and Celeron embedded processors coming soon

25-45W Intel Tiger Lake-H Xeon, Core, and Celeron embedded processors coming soon

Intel Tiger Lake-H module block diagram

While doing some research, I noticed an Intel Core i7-11850HE “Tiger Lake-H” processor on the OpenVino Toolkit website. Parts that end with “E” are usually processors designed for the embedded market. I had never heard about the Tiger Lake-H embedded family, so I looked for “i7-11850HE” processor, and it’s not in Intel Ark, or much anywhere else except on a page in Google Cache, about a COM-HPC module “with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® processors (formerly Tiger Lake-H) for FuSa application”. There we have a list of Xeon, Core, and Celeron 11th generation processors that I don’t think have ever been announced: Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 45/35W cTDP Intel Core vPRO i5-11500HE processor […]

Posted on by Sponsored Post - Comments Off on ANYbotics’ ANYmal C robot is a multi-module machine (Sponsored)

ANYbotics’ ANYmal C robot is a multi-module machine (Sponsored)

anymal c legged robot ml industrial inspection action

Rugged four-legged robot with three brains ANYbotics provides solutions for robot applications with the most advanced mobility and autonomy requirements in challenging terrains. The massive embedded computing performance for the key tasks – situational awareness, motion control and mission fulfillment – is delivered by three COM Express Computer-on-Modules from congatec. Due to the advancements in computer-based intelligence and sensor technology, previously stationary robots unaware of their environment are now evolving into smart autonomous mobile robots. This will not only help to relieve humans of potentially dangerous tasks but also to optimize repetitive tasks in real-life environments from an economic point of view. Such robots can autonomously fulfill many jobs that previously required human labor and significantly extend the list of feasible tasks. With such a perspective, it is not surprising that robot applications are a booming market. The overall global smart robot market is expected to grow with a CAGR […]

Posted on by Stephen Vicinanza - No Comments on PicoCore MX8MN is a Tiny NXP i.MX 8M Nano Computer-on-Module

PicoCore MX8MN is a Tiny NXP i.MX 8M Nano Computer-on-Module

The PicoCore MX8MN Nano carries the NXP i.MX 8M Nano F&S Elektronik Systeme has announced the development of the smallest i.MX 8M based CoM yet: the PicoCore MX8MN Nano. Previously we had reported on the Congatec Conga-SMX8 Nano which was a fairly small CoM compliant with SMARC 2.0 standard. The PicoCore MX8MN is based on the NXP i.MX 8M Nano CPU with 1 to 4 Arm Cortex-A53 cores and a Cortex-M7 real-time core. The Nano is set to carry up to 8GB RAM and 32 GB eMMC, with optional WiFI/BT and support for -40º C to 85º C temperature ranges. Similar to Predecessor The PicoCore MX8MN Nano is very similar in structure to the PicoCore MX8MM Mini CoM, but with a different i.MX 8M Mini processor featuring the same Arm Cortex-A53 cores, but the Cortex M4 real-time core is changed to a more powerful Cortex-M7 core in the MX8MN Nano. […]

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