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November 14, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs

Qualcomm Dragonwing IQ-X Windows industrial PC

The Qualcomm Dragonwing IQ-X family, comprised of the IQ-X7181 and IQ-X5181 SoCs, offers eight or twelve Oryon cores clocked at up to 3.4 GHz, an Adreno GPU, and up to 45 TOPS of AI performance for industrial PCs running Windows LTSC. Those are upgrades to the Dragonwing IQ9/IQ8/IQ6 SoCs introduced last year, offering faster cores, higher speed interfaces, and more. The IQ-X chips support up to 64GB LPDDR5x memory, UFS 4.0 and SD 3.0 storage, eDP and USB-C display interfaces, up to six cameras, PCIe Gen4 connectivity for optional Ethernet, WiFi 7, and 5G cellular connectivity, and feature eleven USB interfaces and 221 GPIOs. As industrial-grade parts, they are rated for -40°C to 105°C operation. Qualcomm DragonWing IQ-X7181 and IQ-X5181 specifications: CPU IQ-X5181 – Custom Qualcomm Oryon 8-core 64-bit Armv8 CPU clocked up to 3.4 GHz IQ-X7181 – Custom Qualcomm Oryon 12-core 64-bit Armv8 CPU clocked up to 3.4 GHz […]

November 13, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Kyocera triple lens AI depth camera enable recognition of thin and semi-transparent objects, wires

Kyocera has unveiled a triple lens AI depth camera capable of recognizing semi-transparent, thin, and fine line-shaped objects that are difficult to detect with the human eye and traditional stereo cameras. The camera can accurately measure the distance to and size of objects which are between 0.3 and 1mm thick, and is expected to be useful in robots for manufacturing, medical applications, and Smart Agriculture. Preliminary specifications: Sensors Left-center, center-right, and left-right cameras Focus distance – About 10 cm Proprietary AI combining multiple parallax data sets from the sensors Ideal for Thin, irregularly shaped linear objects, such as harnesses or ultra-fine wires as small as 0.3mm Reflective objects like metal Translucent objects like plastic Dimensions – 40 x 30 x 28mm It is an evolution of the company’s dual-lens AI depth camera that was already capable of high-precision distance measurement with 100μm resolution at a 10cm range, but struggled a […]

November 12, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

RA8P1 Titan board features 1 GHz Cortex-M85 MCU for AIoT applications, RT-Thread development

So far, if you wanted to evaluate Renesas RA8P1 Cortex-M85 MCU clocked at 1 GHz, you had to spend close to $200 to get the EK-RA8P1 evaluation kit, but the RT-Thread RA8P1 Titan board allows you to do that for about $50. Mostly designed for RT-Thread real-time OS development and evaluation, the RA8P1 Titan board comes with 32MB HyperRAM, 64MB HyperFlash, display and camera interfaces, two Gigabit Ethernet ports with Time Sensitive Networking support, WiFi 4 and Bluetooth 4.1, a USB 2.0 Type-C port, CAN Bus, Serial, and RS485 interfaces, a 40-pin Raspberry Pi GPIO header, a built-in debugger, and flexible power options with 5V via USB-C or 9V-24V via an XT60 connector. RA8P1 Titan board specifications: SoC – Renesas RA8P1 (R7KA8P1) MCU cores Arm Cortex-M85 clocked at 1 GHz with Helium MVE (M-Profile Vector Extension) with 32KB I/D caches; 7300+ CoreMarks Arm Cortex-M33 clocked at 250 MHz with 32KB […]

November 10, 2025November 10, 2025 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

CRA-ready Grinn Genioboard Edge AI SBC features MediaTek Genio 510 or 700 System-on-module

GenioBoard SBC MediaTek Genio 510 700 SoM

Grinn has launched a credit card-sized SBC powered by its MediaTek Genio 510 or Genio 700 Cortex-A78/A55 SoM, and designed for Edge AI applications with support for the Thistle Security Platform via an on-board Infineon OPTIGA Trust M hardware security module to enable compliance with the EU’s Cybersecurity Resilience Act (CRA). With a form factor similar to the Raspberry Pi 3 model B, the Genioboard features 4GB RAM, 16GB eMMC flash, a Gigabit Ethernet port, four USB 3.0/2.0 ports, HDMI and DisplayPort video outputs, two MIPI CSI camera connectors, a 40-pin GPIO header, a USB-C debuig port, USB-C PD power, and on the bottom side, two M.2 sockets for AI accelerators and wireless modules. Genioboard specifications: System-on-Module – Grinn GenioSOM-510 or Grinn GenioSOM-700 SoC MediaTek Genio 510 (MT8370) hexa-core Arm Cortex-A78/A55 processor up to 2.2 GHz, Arm Mali-G57 MC2 GPU, 4Kp60 video decoding, 4Kp30 video encoding, up to 3.2 TOPS […]

November 6, 2025November 6, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

CamThink NeoEyes NE301 – An ultra-low-power, STM32N6-based Edge AI camera

CamThink NeoEyes NE301 is an ultra-low-power Edge AI camera built around the STM32N6 Arm Cortex-M55 MCU with Neural-ART NPU that “offers significantly enhanced features and performance” compared to the company’s earlier ESP32-S3-based NeoEyes NE101. The camera ships with a 4MP MIPI CSI camera sensor by default, but USB camera sensors are also supported. It also features 64MB PSRAM, 128MB hyperflash, WiFi 6 and Bluetooth 5.4 wireless connectivity, optional support for a 4G LTE module (global or US), audio wafers, USB-C and UART debug, a 16-pin GPIO header, and support for either USB, battery, or PoE power. CamThink NeoEyes 301 specifications: MCU – STMicro STM32N6 MCU Core – Arm 32-bit Cortex-M55 CPU @ up to 800MHz with Arm Helium and Arm MVE GPU – Neo-Chrom 2.5D GPU, Chrom-ART Accelerator (DMA2D) NPU – ST Neural-ART accelerator @ 1 GHz, up to 600 GOPS; 3 TOPS/W enabling fanless operation BPU – Hardware-accelerated H.264 […]

November 1, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Review of Intel-based UP AI development kits – Part 1: Unboxing and first boot to Ubuntu Pro 24.04

AAEON sent me three Intel-based UP AI development kits for review, namely the credit card-sized, Intel N150-based UP TWL, the Intel N150-based UP Squared Pro TWL with M.2 expansion slots and a Hailo-8L module, and the more powerful UP Xtreme ARL equipped with a 14-core Intel Core Ultra 5 225H processor. They offer entry-level, mid-range, and high-end x86-based alternatives to the AAEON NV8600-Nano AI developer kit I reviewed last August, equipped with an NVIDIA Jetson Orin Nano 8GB. All three models ship with Ubuntu Pro 24.04 and support the UP AI Toolkit and Network Optix’ Nx Meta IP video management platform. I’ll review all three models independently, but in this first part, I’ll go through the hardware and quickly try one of the boards. Unboxing Those are development kits that ship with not only the board, but also the same USB VGA camera provided with the NV8600-Nano kit, power supplies, […]

October 31, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

HUSKYLENS 2 – A 6 TOPS LLM and AI vision camera with self-learning capabilities

DFRobot HUSKYLENS 2 is an LLM and AI vision camera powered by a Kendryte K230 dual-core RISC-V SoC with a 6 TOPS AI accelerator and designed to be easy-to-use for makers, educators, competition teams, and AI enthusiasts. It provides an upgrade to the HUSKYLENS AI camera introduced in 2019 with the Kendryte K210 SoC. It features 1GB of LPDDR4, an 8GB eMMC flash, a microSD card slot, a 2MP camera sensor, a 4-pin Gravity expansion connector, and a USB-C port for power and programming. The company says the HUSKYLEN 2 comes preloaded with over 20 AI models, including object tracking, hand recognition, and instance segmentation, but users can also train and deploy their own AI models using features like the self-learning classifier. HUSLYLENSE 2 specifications: SoC – Kendryte K230 CPU 64-bit RISC-V processor @ 1.6GHz with RVV 1.0 support 64-bit RISC-V processor @ 800MHz AI accelerator – Up to 6 […]

October 29, 2025October 28, 2025 by Debashis Das - 6 Comments

TerraMaster launches Intel N150 NAS systems with 5GbE networking, AI photo recognition

TerraMaster F4 425 Plus and F2 425 Plus Intel N150 Hybrid NAS

TerraMaster F4-425 Plus (4-bay) and F2-425 Plus (2-bay) hybrid AI NAS systems are upgrades to the earlier Intel N95-based F4-424 and F2-424 NAS systems with an Intel N150 processor, dual 5GbE ports (up from 2.5GbE), and up to three M.2 SSD slots for up to 144TB of hybrid storage. Both models feature DDR5 memory (up to 16GB), 4K/8K video transcoding, and support TerraMaster’s TRAID technology for improved performance and data redundancy. They also offer USB expansion options and quiet cooling, making them NAS solutions suitable for home and business use. TerraMaster F4-425 Plus and F2-425 Plus specifications: SoC – Intel Processor N150 CPU – Quad-core “Twin Lake” processor @ up to 3.6 GHz (Turbo) with 6MB cache GPU – 24EU Intel UHD graphics @ 1000 MHz Hardware transcoding F4-425 Plus – H.264, H.265, MPEG-4, VC-1 up to 8K@60fps F4-425 Plus – H.264, H.265, MPEG-4, VC-1 up to 4K@60fps TDP – 6W to […]