development board News - CNX Software

June 9, 2025June 9, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Calixto Systems introduces i.MX93 VERSA SO-DIMM SoM and EVK with NXP i.MX 93 Edge AI SoC

India-based Calixto Systems has unveiled the i.MX93 VERSA SO-DIMM system-on-module (SoM) powered by an NXP i.MX 93 Arm Cortex-A55/M33 SoC with Ethos-U65 micro NPU for Edge AI applications, as well as an evaluation kit (EVK). The system-on-module features up to 2GB LPDDR4x RAM, 16GB eMMC flash, a gigabit Ethernet PHY, and exposes various I/Os through a 200-pin SO-DIMM edge connector, such as MIPI DSI, LVDS, and parallel RGB display interfaces, MIPI CSI and Parallel camera interfaces, dual GbE (on PHY on-module, one on carrier), and more. The i.MX93 VERSA module targets smart industrial automation, healthcare, retail, and connected edge systems with specific size, performance, and power efficiency requirements. i.MX93 VERSA specifications: SoC – NXP i.MX 93 CPU Up to 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ […]

June 5, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

ESP32-P4-MINI development board offers two 34-pin GPIO headers, ESP32-C6 wireless module

Another day, another ESP32-P4 RISC-V MCU board with the ESP32-P4-MINI equipped with an ESP32-C6 wireless module and exposing all I/Os through two 34-pin GPIO headers. The board also features two USB-C ports, one for data and one for debugging, MIPI DSI and MIPI CSI connectors to add a display and a camera, a microSD card slot for storage, and a few buttons and LEDs. It’s basically a board for engineers wanting to access all features of the ESP32-P4 without extra bells and whistles. ESP32-P4-MINI board specifications: SoC – Espressif Systems ESP32-P4 CPU Dual-core 32-bit RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz Memory 768 KB HP L2MEM (for dual-core CPU), 32 KB LP SRAM, 8 KB TCM (for LP MCU core) 32MB PSRAM Storage – 128 KB HP ROM, 16 KB LP […]

June 5, 2025June 5, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

STMicro STM32WBA5MMG is a tiny wireless module with Bluetooth LE 6.0, Zigbee 3.0, and OpenThread

STMicro’s STM32WBA5MMG is a tiny (12.5 x 8 mm), ultra-low-power 2.4 GHz wireless module based on the STM32WBA55UG wireless microcontroller with support for Bluetooth 6.0 LE, Zigbee 3.0, and OpenThread. The company further adds that designing a board for the module does not require any RF expertise, it provides a fully integrated Bill of Materials (BOM) with 32 MHz and 32 kHz crystals and integrated antenna matching or optional external antenna configurations, and its compatibility with 2-layer PCBs helps reduce costs. STM32WBA5MMG specifications: Wireless MCU – STMicro STM32WBA55UG Core – 32-bit Arm Cortex-M33 CPU with TrustZone®, MPU, DSP, and FPU Memory – 128 KB SRAM, including 64 KB with parity check Storage 1 MB flash memory with ECC, including 256 KB with 100 kcycles 512-byte (32 rows) OTP ART Accelerator – 8 KB instruction cache allowing 0-wait-state execution from flash memory (frequency up to 100 MHz, 150 DMIPS) Wireless Bluetooth […]

June 4, 2025June 4, 2025 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

This ESP32-P4 board is equipped with an ESP32-C5 dual-band WiFi 6 module

All ESP32-P4 boards and devkits we’ve covered so far rely on ESP32-C6 for wireless connectivity, but the Wireless Tag WT99P4C5-S1 differs in that it pairs the ESP32-P4 RISC-V SoC with an ESP32-C5 wireless module featuring dual-band WiFi 6, Bluetooth LE 5.0, and an 802.15.4 radio for Zigbee, Thread, and Matter connectivity. The board also features MIPI DSI and CSI connectors for a display and a camera, GPIO headers for the ESP32-P4 and ESP32-C5 modules, a microSD card slot, a Fast Ethernet port, a built-in microphone, a speaker connector, an RS485 terminal block, and a few USB ports for data and debugging. Wireless Tag WT99P4C5-S1 board specifications: Core module – Wireless Tag WT0132P4-A1 SoC – Espressif Systems ESP32-P4 CPU Dual-core 32-bit RISC-V HP (High-performance) CPU @ up to 400 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz with 8KB of zero-wait […]

May 30, 2025May 30, 2025 by Debashis Das - 1 Comment

Atum A3 Nano development board combines Agilex 3 FPGA and USB-Blaster III programmer (Crowdfunding)

Terasic’s Atum A3 Nano is a compact FPGA development board built around Altera’s largest Agilex 3 FPGA (A3CZ135BB18AE7S). The FPGA features 135K logic elements, embedded memory blocks (6.89 Mbit M20K, 1.4 Mbit MLAB), and 368 multipliers, making it suitable for demanding applications such as robotics, automotive systems, smart city infrastructure, consumer electronics, and advanced image processing. Measuring just 85 x 70 mm, the Atum A3 Nano board includes 64 MB SDRAM, Gigabit Ethernet, HDMI output, a microSD card slot, and an onboard USB-Blaster III programmer accessible via a USB Type-C port. Expansion options include a 40-pin GPIO header and two PMOD headers, and the board also features user I/Os like LEDs, buttons, and switches. Additionally, it supports add-ons such as displays, cameras, wireless modules, and motor control kits. Atum A3 Nano specifications: FPGA – Altera Agilex 3 A3CZ135BB18AE7S 135,110 logic elements 6.89 Mbit M20K, 1.4 Mbit MLAB 368 18×19 multipliers 4 I/O […]

May 29, 2025June 2, 2025 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

OBJEX Link S3LW ultra-low-power ESP32-S3 LoRaWAN board takes up to 100W power input

OBJEX Link S3LW is a small development board based on the ultra-low-power ELPM-S3LW module with ESP32-S3 MCU and LoRaWAN connectivity and the ability to take 100W input via USB-C or a 2-pin terminal block for driving motors, controlling RGB LED strips, and other high-power projects. It’s compliant with the USB PD standard, features two 28-pin headers and a STEMMA I2C connector for expansion, as well as a built-in CP2102/CP2104 USB to serial bridge for debugging, and a few buttons. The company also offers an OBJEX ELPM-S3 module and OBJEX Link S3 board with the same features, minus LoRa/LoRaWAN support. OBJEX Link S3LW specifications: Wireless module ELPM-S3LW v1.2 Wireless SoC – ESP32-S3FN8 CPU – Dual-core 32-bit Xtensa LX7 microcontroller with AI vector instructions up to 240MHz, RISC-V ULP co-processor Memory – 512KB SRAM Storage – 8MB flash Wireless – 2.4GHz WiFi 4 (802.11b/g/n), Bluetooth 5.0 BLE + Mesh LoRa support LoRa […]

May 29, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

NXP MCX W72x Cortex-M33 wireless SoC supports Bluetooth 6.0 with Channel Sounding, Zigbee, Thread and Matter

NXP MCX W72x series Cortex-M33 wireless SoCs support for Bluetooth 6.0 and an 802.15.4 radio for Zigbee, Thread, and Matter. The MCX W72x family also implements Bluetooth Channel Sounding for accurate distance measurements with the help of a Localization Compute Engine (LCE) to reduce latency. It’s the second MCU part of the MCX W wireless family following the MCX W71x MCU, and the new MCX W72x wireless microcontroller is offered with up to 264 KB SRAM, 2MB flash, features a dedicated Cortex-M33 core to handle Bluetooth and 802.15.4 radios, implements an EdgeLock Secure Enclave for security, and integrates plenty a range of I/Os in a 48-pin package. NXP MCX W72x key features and specifications: MCU cores and memory/storage Application core – Arm Cortex-M33 core up to 96 MHz with 2 MB program Flash with ECC, 264 kB SRAM with ECC and parity Networking core – Arm Cortex-M33 core with dedicated […]

May 28, 2025May 28, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

UP Squared TWL / Squared Pro TWL boards are powered by Intel Core 3 Processor N355, N250, or N150 Twin Lake CPU

AAEON has just introduced upgrades to its Alder Lake-N-powered UP Squared 7100 and UP Squared Pro 7000 SBCs with the UP Squared TWL and UP Squared Pro TWL development boards equipped with Twin Lake CPUs, either Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150. Both SBCs can operate in the -20°C to 70°C temperature range, support up to three independent displays, and offer M.2 expansion sockets for storage and wireless, a 40-pin GPIO header, RS232/RS485 interfaces, and three USB ports. However, the UP Squared TWL is a smaller 90×85.6mm SBC with dual gigabit Ethernet, and the UP Squared Pro TWL has a slightly larger design (101.6×101.6mm) with dual 2.5GbE, a SATA port, MIPI CSI camera support, and optional cellular connectivity. UP Squared TWL Specifications: Twin Lake SoC (one or the other) Intel Processor N150 quad-core processor @ up to 3.6 GHz (Turbo) with 6MB cache, 24EU […]