development kit

Posted on by Debashis Das - 4 Comments on ESP32-S3 AIoT Basic – A learning and prototyping kit with camera, audio, LCD, and sensors

ESP32-S3 AIoT Basic – A learning and prototyping kit with camera, audio, LCD, and sensors

ESP32 S3 AIoT Basic for beginners, classrooms, rapid prototy

The ESP32-S3 AIoT Basic is a low-cost, learning, and prototyping kit for the ESP32-S3. The board integrates common AIoT peripherals directly onto a single PCB, making the design part easy for beginners, classrooms, and rapid prototyping. Built around an ESP32-S3 board, the development platform integrates nine commonly used modules directly on the PCB, including a button, buzzer, LED indicator, light sensor, LCD, digital microphone, SD card slot, audio amplifier, and a camera. Most AI and IoT demos can be run without breadboards or jumper wires, while expansion is supported through standard pin headers and Grove connectors. The board supports 5V power via USB-C, and 6–12 V power input via Vin for driving additional devices. With various tutorials and sample projects, it is suitable for AIoT learning, STEM education, voice and vision demos, sensor-based projects, and quick proof-of-concept development. ESP32-S3 AIoT Basic Specifications: Main board – ESP32-S3 Core Board SoC – […]

Posted on by Debashis Das - 1 Comment on Calixto Systems SL1680 OPTIMA industrial SoM and EVK features Synaptics SL1680 Edge AI processor

Calixto Systems SL1680 OPTIMA industrial SoM and EVK features Synaptics SL1680 Edge AI processor

SL1680 OPTIMA SOM

Calixto Systems has recently introduced the SL1680 OPTIMA, an industrial SoM built around the Synaptics SL1680 quad-core Arm Cortex-A73 SoC with a 7.9+ TOPS secure NPU for Edge AI and advanced multimedia applications. They also announced an evaluation kit (EVK) for rapid product development. The SoM offers up to 4GB LPDDR4 RAM, up to 16GB eMMC flash, an onboard Gigabit Ethernet PHY, and a wide range of interfaces through compact Hirose connectors, including dual MIPI CSI camera inputs, MIPI DSI, HDMI 2.1 Tx/Rx, PCIe 2.0, USB 3.0/2.0, SDIO, RS485, CAN-FD, and various GPIOs. The EVK further expands connectivity with MikroBUS, display and camera interfaces, and industrial I/O, making the platform suitable for AI-enabled vision systems, smart HMIs, automation equipment, and other edge computing applications. SL1680 OPTIMA SoM specifications SoC – Synaptics SL1680 (Astra Series) CPU – Quad-core Arm Cortex-A73 processor @ 2.1 GHz GPU – Imagination PowerVR Series9XE GE9920 GPU with […]

Posted on by Debashis Das - No Comments on Radxa C200 Orin Developer Kit – An NVIDIA Jetson Orin NX 8GB devkit with three M.2 PCIe 4.0 slots

Radxa C200 Orin Developer Kit – An NVIDIA Jetson Orin NX 8GB devkit with three M.2 PCIe 4.0 slots

Radxa C200 Orin

The Radxa C200 is a compact developer kit built around the NVIDIA Jetson Orin NX 8GB module. It features three PCIe 4.0 NVMe slots and 117 TOPS AI “Super Mode” for high-speed storage expansion, fast-bootable SSDs, and data-intensive AI workloads. It supports 8GB LPDDR5 memory, two M.2 M-Key slots (PCIe 4.0 x2/x4) for NVMe storage or other expansion, and an M.2 E-key (PCIe 4.0 x1) slot for Wi-Fi/BT or other compatible modules. Ports include DisplayPort 1.2 video output, four USB 3.2 Gen2 Type-A ports, a USB Type-C port with recovery mode, Gigabit Ethernet, two MIPI CSI interfaces, and a 40-pin GPIO header. Additional features include CAN bus, PoE headers, RTC battery, and a PWM fan connector, extending system integration options. Radxa C200 Orin Developer Kit specifications: SoM – NVIDIA Jetson Orin NX 8GB module CPU – 6-core Arm Cortex-A78AE v8.2 64-bit CPU, 1.5MB L2 cache + 4MB L3 cache de […]

Posted on by Debashis Das - No Comments on Nordic nRF7002 EBII adds dual-band Wi-Fi 6 to nRF54L series development kits

Nordic nRF7002 EBII adds dual-band Wi-Fi 6 to nRF54L series development kits

nRF7002 EBII Wi Fi 6 Expansion Board

Nordic has introduced the nRF7002 EBII as an updated Wi-Fi 6 expansion board for its nRF54L series development kits. The earlier nRF7002 WiFi 6 board was a low-cost add-on for the Thingy:53, mainly for basic prototyping. The new EBII is designed for the newer nRF54L series of SoCs with dual-band Wi-Fi 6 support, power-profiling options, and more. Built around the nRF7002 Wi-Fi Companion IC, it supports Wi-Fi 6 features such as TWT, OFDMA, and BSS coloring for power efficiency and reduced interference. The EBII communicates with nRF54L15 and nRF54LM20 DKs through SPI/QSPI host interfaces, and includes headers for power profiling. Additionally, it features an onboard chip antenna, supports both STA and SoftAP modes, and maintains backward compatibility with 802.11a/b/g/n/ac. These features make it suitable for low-power multiprotocol IoT devices in smart homes, Matter, industrial sensing, wearables, and connected health applications. nRF7002 Expansion Board II specifications: Wi-Fi Companion IC – Nordic nRF7002 […]

Posted on by Debashis Das - No Comments on Amazing Hand – A 8-DOF 3D-printable open-source robotic hand for prototyping and research

Amazing Hand – A 8-DOF 3D-printable open-source robotic hand for prototyping and research

Amazing Hand Open Source Robotic Hand Developer Kit

Seeed Studio’s Amazing Hand is an open-source, 3D-printable robotic hand kit with eight degrees of freedom (8-DOF), designed for developers working on robotics control and hardware experimentation. It integrates all actuators directly in the hand itself, making it suitable for robotics projects, education, prototyping, and integration into systems like Reachy2 or custom robotic arms. The hand uses eight Feetech SCS0009 servos arranged in a parallel linkage, with all actuators housed in the palm to keep the unit compact and lightweight at around 400 grams. Each finger offers two-axis motion for flexion, extension, and limited abduction via differential servo control. Its structure is fully 3D-printable, combining rigid internal frames with flexible TPU shells for robotics prototyping, manipulation research, and custom hand design studies. Amazing Hand specifications Supported Controllers – Raspberry Pi, NVIDIA Jetson, and microcontrollers (MCUs) Degrees of Freedom – 8 Servo 8x Feetech SCS0009 bus servos (2 servos per finger […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC

Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC

Advantech SOM 6820

Advantech SOM-6820 is a COM Express Type 6 Compact Computer-on-Module powered by a Qualcomm Snapdragon X Elite SoC with up to twelve 64-bit Arm Oryon cores, instead of an x86 processor from Intel or AMD, more commonly found on COM Express modules. The COM also features up to 64GB LPDDR5 memory, two MIPI CSI camera connectors, an RTL8153B USB 3.0 Gigabit Ethernet controller, and a TPM 2.0 security chip. All I/Os are exposed through two standard 220-pin B2B connectors, including DisplayPort and LVDS/eDP interfaces for up to four 4K displays, up to four SATA III for storage, twelve USB 3.0/2.0 interfaces, multiple PCIe Gen4/3 interfaces, and more. With up to 45 TOPS of AI performance, the SOM-6820 is especially well-suited to medical imaging and machine vision applications as well as mission-critical systems and humanoid robots. Advancec SOM-6820 specifications: Snapdragon X Elite SoC variants (one or the other) X1E-00-1DE 12-core up […]

Posted on by Debashis Das - No Comments on Quectel QSM560DR industrial Qualcomm QCM6490/QCS6490 SBC supports Ubuntu, Android, and Windows

Quectel QSM560DR industrial Qualcomm QCM6490/QCS6490 SBC supports Ubuntu, Android, and Windows

Quectel QSM560DR Development Board

The Quectel QSM560DR is a Qualcomm QCM6490/QCS6490-based industrial Edge AI SBC with an octa-core processor, a 12 TOPS NPU, up to 8GB LPDDR4X RAM, and UFS storage. It offers 5G, WiFi 6E, Bluetooth 5.2, and GNSS, plus dual Gigabit Ethernet, four USB 3.0 ports, and HDMI and eDP display outputs. The board also includes three MIPI CSI camera connectors, a microSD card slot, GPIOs, RS232/RS485, CAN bus, audio output, and an M.2 connector for expansion. These features make it suitable for robotics, smart retail systems, industrial control panels, and other high-performance edge AI systems. Quectel QSM560DR specifications: SoC – Qualcomm QCS6490(WF variant) / QCM6490 (CN variant) CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs

Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs

Qualcomm Dragonwing IQ-X Windows industrial PC

The Qualcomm Dragonwing IQ-X family, comprised of the IQ-X7181 and IQ-X5181 SoCs, offers eight or twelve Oryon cores clocked at up to 3.4 GHz, an Adreno GPU, and up to 45 TOPS of AI performance for industrial PCs running Windows LTSC. Those are upgrades to the Dragonwing IQ9/IQ8/IQ6 SoCs introduced last year, offering faster cores, higher speed interfaces, and more. The IQ-X chips support up to 64GB LPDDR5x memory, UFS 4.0 and SD 3.0 storage, eDP and USB-C display interfaces, up to six cameras, PCIe Gen4 connectivity for optional Ethernet, WiFi 7, and 5G cellular connectivity, and feature eleven USB interfaces and 221 GPIOs. As industrial-grade parts, they are rated for -40°C to 105°C operation. Qualcomm DragonWing IQ-X7181 and IQ-X5181 specifications: CPU IQ-X5181 – Custom Qualcomm Oryon 8-core 64-bit Armv8 CPU clocked up to 3.4 GHz IQ-X7181 – Custom Qualcomm Oryon 12-core 64-bit Armv8 CPU clocked up to 3.4 GHz […]

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