NVIDIA Jetson Nano based AI camera devkit enables rapid computer vision prototyping

AI Camera Devkit

ADLINK “AI Camera Dev Kit” is a pocket-sized NVIDIA Jetson Nano devkit with an 8MP image sensor, industrial digital inputs & outputs, and designed for rapid AI vision prototyping. The kit also features a Gigabit Ethernet port, a USB-C port for power, data, and video output up to 1080p30, a microSD card with Linux (Ubuntu 18.04), and a micro USB port to flash the firmware. As we’ll see further below it also comes with drivers and software to quickly get started with AI-accelerated computer vision applications. AI Camera Dev Kit specifications: System-on-Module –  NVIDIA Jetson Nano with CPU – Quad-core Arm Cortex-A57 processor GPU – NVIDIA Maxwell architecture with 128 NVIDIA cores System Memory – 4 GB 64-bit LPDDR4 Storage – 16 GB eMMC Storage – MicroSD card socket ADLINK NEON-series camera module Sony IMX179 color sensor with rolling shutter Resolution – 8MP (3280 x 2464) Frame Rate (fps) – […]

Ai-Thinker Hi-series WiFi modules support HarmonyOS (Sponsored)

Ai-Thinker Hi-series WiFi modules feature Hisilicon Hi3861/Hi3861L 32-bit RISC-V microcontroller with 2.4GHz 802.11b/g/n WiFi 4 and support for HarmonyOS for IoT projects. The new Hi-12F module even got certification for HarmonyOS “S identification” meaning the Hi-12F module supports HarmonyOS Connect for the Smart Home which used to be called “Works With HUAWEI HiLink” or “Powered by HarmonyOS”. Some of the highlights for Ai-Thinker Hi-series WiFi module include: Integrated high-performance 32-bit RISC-V microprocessor (Hi3861V100/Hi3861LV100) with 352KB SRAM, 288KB ROM, and 2MB Flash IEEE 802.11 b/g/n WiFi 4 up to 72.2Mbps @ HT20 MCS7 with STA and AP modes (Up to 6 clients in AP mode). Baseband and RF circuits with power amplifier PA, low noise amplifier LNA, RF balun, antenna switch, power supply management Multiple Security Capabilities with a built-in eFUSE, support for secure storage, and hardware ID Rich peripheral interfaces with  UART, SPI, I2C, GPIO, ADC, PWM, I2S, SDIO, etc… […]

Renesas introduces RZ/Five Linux-capable 64-bit RISC-V microprocessor family

Renesas has launched its first RISC-V processor family with the RZ/Five general-purpose microprocessors based on an Andes AX45MP 64-Bit RISC-V CPU core, and with long-term Linux support via the industrial-grade CIP Linux that offers maintenance for over 10 years. The RISC-V processor is pin-to-pin compatible with the Arm Cortex-A55/M33–based RZ/G2UL processor family, and while being a general-purpose family, the RZ/Five chips are specifically well-suited to IoT endpoint devices such as gateways for solar inverters or home security systems. Renesas RZ/Five key features and specifications: CPU – Single-core 64-bit RISC-V AX45MP core @ up to 1.0 GHz Internal Memory – 128KB SRAM with ECC Memory I/F – 16-bit DDR4-1600 or DDR3L-1333 memory interfaces with in-line ECC; up to 4GB RAM Storage I/F – 2x SD/eMMC interfaces, SPI flash interface Networking – 2x Gigabit Ethernet MAC USB – 2x USB 2.0 Audio – 4-channel serial sound interface (SSI) Serial – 2x CAN/CAN-FD […]

Espressif introduces ESP32-S3-BOX AI development kit for online and offline voice applications

Espressif Systems has very recently introduced the ESP32-S3-BOX AI voice devkit designed for the development of applications with offline and online voice assistants, and whose design I find similar to the M5Stack Core2 devkit, but the applications will be different. The ESP32-S3-BOX features the latest ESP32-S3 processor with WiFi and BLE connectivity, AI capabilities, as well as a 2.4-inch capacitive touchscreen display, a 2-mic microphone array, a speaker, and I/O connectors with everything housed in a plastic enclosure with a stand. ESP32-S3-BOX specifications: WiSoC – ESP32-S3 dual-core Tensilica LX7 up to 240 MHz with Wi-Fi & Bluetooth 5, AI instructions, 512KB SRAM Memory and Storage – 8MB octal PSRAM and 16MB QSPI flash Display – 2.4-inch capacitive touchscreen display with 320×240 resolution Audio – Dual microphone, speaker USB – 1x USB Type-C port for power and debugging (JTAG/serial) Expansion – 2x Pmod-compatible headers for up to 16x GPIOs Misc Power […]

NVIDIA Jetson AGX Orin 12-core Cortex-A78E module delivers up to 200 TOPS

The upcoming NVIDIA Jetson AGX Orin module packs some serious processing power with a 12-core Cortex-A78AE processor, 2048 CUDA cores, and 64 Tensor cores delivering up to 200 TOPS of AI performance, or 6 times more than its predecessor, the Jetson AGX Xavier module. Designed for robotics, autonomous machines, medical devices, the Jetson AGX Orin delivers the same performance as a GPU-enabled server, but in a much more compact 100 x 87mm form factor. The module can be operated in three power modes, namely 15W, 30W, or 50W depending on performance and power requirements, and a compact developer kit will also be made available. Jetson AGX Orin specifications: CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ 1 GHz DL Accelerator – 2x NVDLA v2.0 Vision Accelerator […]

WattUp 1W active energy harvesting developer kit enables at-a-distance wireless charging

Two years ago, we noted Energous’ WattUp hearables developer kit that would charge earbuds with the company’s WattUp near-field wireless charging technology. The company has now introduced the WattUP 1W active energy harvesting developer kit capable of charging multiple IoT devices with at-a-distance wireless charging. The kit is said to be “active” because there’s a 6-inch transmitter, let’s call it a power gateway, and several IoT devices that harvest energy from it. Traditional passive solutions will harvest ambient energy from the surrounding environment, and may not deliver enough power, and do so unpredictably. The developer kit comes with the transmitter, plus one or more receiver units, and relies on the following main chips: Transmitter Dialog Semiconductor DA14682 SmartBond Bluetooth 5.0 Cortex-M0 SoC Dialog Semiconductor DA4100 Wireless Power Transmitter SoC Dialog Semiconductor DA3210 1W Power Amplifier A discrete rectifier and a DA2210 WPT rectifier Receiver(s) Dialog Semiconductor DA14531 Cortex-M0+ BLE 5.1 […]

OpenCV AI Kit Lite – A compact 4K Tri-camera kit for computer vision applications (Crowdfunding)

The OpenCV AI Kit “OAK-D” now has a little brother with the OpenCV AI Kit Lite equipped with the same Intel Myriad X-based DepthAI solution with three cameras, but in a much compact form factor and a price slashed to as low as $79 and up. Like its predecessor, the OpenCV AI Kit leverage the Myriad X AI accelerator’s capabilities to provide a wide range of real-time computer vision applications, and can be programmed with C++ or Python APIs, as well as graphical user interfaces. OpenCV AI Kit Lite (OAK-D Lite) specifications: Intel Myriad X-based DepthAI with 4 TOPS of AI performance Cameras (made by ArduCam) Color Camera IMX214 (PLCC) with 4208×3120 resolution,  1.348:1 aspect ratio 1/3.1 inch Lens size 81.3 degrees DFOV Focus range 8cm – ∞ Stereo Camera specifications: Omnivision OV07251-G04A-1E (COB) with  640 x 480 resolution, 1.333:1 aspect ratio 1/7.5 inch lens size DFOV: 85.6,HFOV: 72.9, VFOV: […]

ADLINK COM-HPC Ampere Altra 80-core Arm server module targets embedded applications

ADLINK has integrated Ampere Altra, an up to 80-core Armv8.2 server processor with up to 175W TDP, into a COM-HPC module designed for embedded applications, together with the AVA Developer Platform equipped with a 32-core processor and housed in an “ultra-silent liquid-cooled tower system”. Both the ADLINK COM-HPC Ampere Altra module and the developer kit are compliant with the just-announced Arm’s Scalable Open Architecture for Embedded Edge (SOAFEE), a “software initiative and reference implementation providing a cloud-native environment for embedded edge development”. ADLINK COM-HPC Ampere Altra COM-HPC Ampere Altra key features and specifications: SoC – Ampere Altra with 32x to 80x Armv8.2 Neoverse N1-based cores with up to 3.3 GHz frequency,  up to 128 lanes of high-speed PCIe Gen4 and 8×72 ECC protected DDR4 3200 memory; TDP: 60 to 175 Watts depending on the number of cores System Memory – Up to 768GB DDR4 with 6x individual memory channels Networking […]