With the coronavirus outbreak on-going, many events are either canceled or moving online. Arrow Electronics has now announced what appears to be a completely new online event. Embedded To Go virtual technology exhibition for embedded systems will take place on April 1-3, 2020, and offer technical presentations, information on newly launched technology, and access to Arrow’s sales and engineering teams. The event will entirely free to attend, and you can register online today with a company’s email address. The event will start in about 10 days by so far the virtual “booth map”, “supplier guide” and “lecture area” are inaccessible. We only know what the event should consist of thanks to an article on EENew Embedded: Technical presentation webinars will be hosted by leading suppliers covering AI, IoT and Edge computing, precision measurement, high-performance computing, intelligent condition-based monitoring, and other technological subjects. Information will also be available in the form […]
FriendlyELEC SOM-RK3399V2 CPU Module Gets 4GB LPDDR4 RAM Upgrade
Last year, FriendlyELEC launched SOM-RK3399 system-on-module (SoM) powered by Rockchip RK3399 hexa-core processor combined with 2GB DDR3 memory, 16to 64GB flash, and a built-in WiFi 5 module. Contrary to most SoM’s on the market, SOM-RK3399 could work in standalone mode thanks to two USB-C ports, although it could also be integrated into a carrier board to create a complete development board with more ports and interfaces. The company has now introduced an update with SOM-RK3399V2 CPU module with 4GB LPDDR4 RAM, as well as a small change in the layout for the LED’s and buttons, but the rest of the features remain the same. The company also appears to have changed the way they handle cooling with SOM-RK3399V2 shipping with a heatsink, while SOM-RK3399 cooling was handled by a heatsink + cooling connected to the carrier board. SOM-RK3399V2 specifications: SoC – Rockchip RK3399 big.LITTLE hexa-core processor with 2x Cortex-A72 cores […]
Lantronix Snapdragon 865 Development Kit to Support Android 11
If you ever wanted to develop applications for the latest Qualcomm Snapdragon processor, Intrinsyc is always the first company to provide Snapdragon hardware development kits and we’ve covered many over the years including Open-Q 845 HDK and Open-Q 855 HDK. The company has recently been bought by Lantronix, a provider of solutions for the Internet of Things (IoT) and Out of Band Management (OOBM), and we covered one of their products – an RJ45 connector running Linux – over 6 years ago. Lantronix Snapdragon 865 Mobile Hardware Development Kit is the first devkit announced since the acquisition. The board is powered by the latest Snapdragon 865 (SM8250) processor combined with 6GB LPDDR5 RAM, 128GB UFS 3.0 storage. The development kit currently supports Android 10, but it will be one of the first hardware to officially run Android 11 just previewed by Google. Snapdragon 865 Mobile HDK specifications: SoC – Qualcomm […]
Variscite Introduces i.MX 8M Mini and Nano SoM’s, Symphony Carrier Board
NXP i.MX 8M Mini and i.MX 8M Nano are lower cost and lower power variants of NXP i.M 8M processors manufactured using a 14nm FinFET process, and cutting some features such as HDMI and embedded DisplayPort, or hardware video decoder. NXP i.MX 8M Mini has been announced for over two years, so we’ve already written about many boards and systems-on-module (SoM) including Boardcon EM-IMX8M-MINI SBC, TechNexion XORE LGA SoM, or Congatec conga-SMX8-Mini SMARC 2.0 module among others. NXP i.MX 8M Nano is more recent, and we only covered a few announcements so far namely iWave Systems iW-RainboW-G34M-SM SoM and Conga-SMX8-Nano SMARC 2.0 computer-on-module. There’s now at least a third company working on a “Nano” module with Variscite announcing VAR-SOM-MX8M-NANO SoM together with a “Mini” version called VAR-SOM-MX8M-MINI, and Symphony carrier board and development kits. VAR-SOM-MX8M-MINI & VAR-SOM-MX8M-NANO Modules Both modules are part of Variscite VAR-SOM Pin2Pin family, and share the […]
Trion T20 BGA256 FPGA Development Kit Supports “PulseRain Reindeer” RISC-V RV32IM soft CPU
A few months ago I wrote about FireAnt low-cost FPGA development board powered by Efinix Trion T8 FPGA, and it was the first time I personally heard about the company. Trion FPGA family range from the T4 with 3,888 logic elements up to the Trion T200 with 192,000 LE’s. A board more powerful than FireAnt, but not quite high-end, recently showed up on Digikey with Trion T20 BGA256 development kit going for $150. Trion T20 BGA256 Development Kit specifications: FPGA – Efinix Trion T20 FPGA with 19,728 LE’s, 1,044 Kbit embedded RAM, 36 18×18 multipliers, 7 PPL’s, up to 220 GPIO’s; 256-ball FBGA (13×13 mm) System Memory – 256 Mbit SDR SDRAM Storage – NOR flash USB – 1x Micro-USB port for programming Debug / Configuration – SPI and JTAG headers to facilitate configuration Expansion 3x I/O headers to connect to external devices LVDS TX header, LVDS RX & clock […]
RISC-V based PolarFire SoC FPGA and Devkit Coming in Q3 2020
Microsemi unveiled PolarFire FPGA + RISC-V SoC about one year ago, but at the time, development was done on a $3,000 platform with SiFive U54 powered HiFive Unleashed board combined with an FPGA add-on board from Microsemi. I’ve now been informed that Microchip has announced its Linux-capable PolarFire FPGA+RISC-V SoC would start shipping in Q3 2020 at the RISC-V summit and that a development kit will be sold for a few hundred dollars. PolarFire SoC FPGA PolarFire SoC FPGA key features and specifications: Mid-Range FPGA optimized for Low Power High-speed serial connectivity with built-in multi-gigabit/multi-protocol transceivers from 250 Mbps to 12.7 Gbps Up to 461k logic elements consisting of a 4-input Look-Up Table (LUT) with a fracture-able D-type flip-flop Up to 31.6 Mb of RAM Power optimized transceivers Up to 1420 18 × 18 multiply-accumulate blocks with hardened pre-adders Integrated dual PCIe for up to ×4 Gen 2 Endpoint […]
Lenovo Enters the SBC Market with Leez LP710 RK3399 Board
It’s always interesting to look into mainline Linux changelog either to find out about new software features, but also new hardware platform. And earlier today, I wrote about Linux 5.4 release, I noticed comments about “Leez RK3399 P710 SBC“. After searching a bit, it turns out it’s a single board computer by Lenovo, which the company apparently showcased at World Mobile Congress in Spain last February. Leez is apparently a team part of Lenovo. Lenovo Leez P710 board specifications: SoC – Rockchip RK3399 hexa-core processor with 2x Cortex-A72 cores @ up to 2.0 GHz, 4x Cortex-A53 cores, and an Arm Mali-T860MP4 GPU System Memory – 2 or 4GB LPDDR4 Storage – 16GB eMMC flash, MicroSD card slot Video Output – HDMI 2.0a up to 4K @ 60 Hz, 4-lane MIPI DSI, DisplayPort via USB-C port Audio – Audio jack + digital audio output via HDMI Camera I/F -2x 4-Lane MIPI-CSI […]
Nordic Semi nRF5340 Dual Arm Cortex-M33 SoC Supports Bluetooth 5.1/Mesh, NFC, Thread & Zigbee
After introducing nRF52833 WiSoC with Bluetooth 5.1 direction-finding support last month, Nordic Semiconductors has now launched another multi-protocol wireless SoC with nRF5340 featuring two Arm Cortex-M33 cores and supporting Bluetooth 5.1, Bluetooth Mesh, NFC, Thread & Zigbee. One of the Cortex-M33 is an application core incorporating 1 MB Flash and 512 KB RAM, as well as Arm CryptoCell-312, Arm TrustZone technology, and Secure Key Storage for the highest level of security, and the other Cortex-M33 core is used for networking functions. The company also announced nRF5340 PDK to get started with the new WiSoC. nRF5340 Dual-Core Multiprotocol SoC Key features and specifications: CPU Application core – Arm Cortex-M33 @ 128/64 MHz with 1 MB Flash + 512 KB RAM, 8 KB 2-way set associative cache; CoreMark: 510/255; CoreMark/mA: 65/76 Network core – Arm Cortex-M33 @ 64 MHz with 256 KB Flash + 64 KB RAM, 2 KB instruction cache; CoreMark: […]