Snapdragon X2 Plus 6-core and 10-core processors target low-power Windows Copilot+ PCs

Snapdragon X2 Plus

After announcing the high-end Snapdragon X2 Elite Extreme and X2 Elite processors last year, Qualcomm has now introduced the mid-range Snapdragon X2 Plus platform at CES 2026. While the Elite SKUs target premium laptops, the X2 Plus series is designed for affordable, mainstream Windows 11 Copilot+ PCs. The new lineup includes the X2P-64-100 (10-core) and the X2P-42-100 (6-core), both manufactured on a 3nm process. What’s interesting is that they share the same 80 TOPS AI accelerator, 9523 MT/s LPDDR5x memory support, Snapdragon X75 5G modem, and FastConnect 7800 WiFi 7 and Bluetooth 5.4 as the flagship Elite models. This means that the X2 Plus reduces CPU core counts and GPU frequencies to maximize battery life for thin-and-light Windows 11 Copilot+ laptops, but it does not compromise on I/O, media capabilities, or AI performance, as it features the same USB4, PCIe Gen5, and AV1 video support as the top-tier models. Snapdragon […]

ESP32-S3 development board features 4.2-inch Reflective LCD (RLCD), dual microphone array, onboard speaker

ESP32 S3 RLCD Development Board

Waveshare ESP32-S3-RLCD-4.2 is a 4.2-inch Reflective LCD (RLCD) development board built around ESP32-S3 wireless SoC for DIY projects, rapid prototyping, and smart display devices that need a paperlike experience with a higher refresh rate compared to e-paper displays. The ESP32-S3 provides 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, and the board also includes a dual microphone array with ES7210 ADC and ES8311 audio codec, as well as an onboard speaker for AI voice interaction. Other features include an SHTC3 temperature and humidity sensor, a PCF85063 RTC, a microSD card slot for storage, along with multiple GPIO, UART, and I²C expansion headers. Power, programming, and battery charging are done through the USB Type-C port connected to an optional 18650 battery. Applications include electronic calendars, desktop displays, voice-based devices, environmental monitoring, and low-power indoor or outdoor display systems. ESP32-S3-RLCD-4.2 specifications Core module – Espressif Systems ESP32-S3-WROOM-1-N16R8 SoC – ESP32-S3 CPU – Dual-core […]

NVIDIA Jetson T4000 Edge AI embedded system offers 5GbE networking, four PoE camera ports, DIO, CAN Bus, and more

AAEON BOXER-8742AI Fanless Edge AI System

AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the Jetson Thor T5000 module last August, but officially launched at CES 2026. The Jetson T4000 is a weaker variant, but it’s still extremely powerful with up to 1200 TFLOPS of AI computing power against 2070 TFLOPS for the T5000. The BOXER-8742AI features a 5GbE port, four Gigabit Ethernet RJ45 PoE ports suitable for IP cameras, DIO, RS232, RS485, and CAN Bus interfaces, four USB 3.2 Gen 2 ports, HDMI video output, and more. It’s suitable for high-performance edge AI applications such as smart factory automation, AMR, and AI-assisted roadside unit solutions. AAEON BOXER-8742AI specifications: System-on-Module – NVIDIA Jetson T4000 CPU – 12-core 64-bit Arm Neoverse-V3AE GPU – 1536-core NVIDIA Blackwell GPU with 64 Tensor Cores, 6-TPC MIG VPU Video Decode – 4x 8Kp30 (H.265), 10x 4Kp60 (H.265), 22x 4Kp30 […]

Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs target AI-enhanced drones, cameras, TVs and media hubs

Dragonwing Q-7790

Qualcomm has made a range of announcements at CES 2026, and notably introduced the Dragonwing Q‑7790 and Q‑8750 processors supporting on‑device AI for drones, smart cameras & industrial vision, AI TVs/media hubs, and video collaboration systems. The mid-range Dragonwing Q-7790 targets both consumer and industrial IoT devices, and offers up to 24 TOPS of on-device AI, 4K video outputs and camera inputs, and AV1 hardware video decode. The higher-end Dragonwing Q-8750 is designed for more advanced IoT applications, delivers up to 77 TOPS (dense) for real-time inference and up to 11B LLMs, handles 8K displays and 8K cameras, and supports up to 12 physical cameras for drones, media hubs, and multi-angle vision systems. Dragonwing Q-7790 Dragonwing Q-7790 (CQ7790M/CQ7790S) specifications: CPU – Octa-core Kryo processor up to 2.8 GHz 1x Gold+ core @ 2.8 GHz 4x Gold cores @ 2.4 GHz 3x Silver cores @ 1.8 GHz GPU – Qualcomm Adreno […]

Allwinner V861 dual-core 64-bit RISC-V AI Camera SiP features 128MB DDR3L, 4K H.265/H.264 video encoder

Allwinner V861 Block Diagram

Allwinner V861 is a new dual-core 32-bit/64-bit RISC-V C907 system-in-package (SiP) with 128MB on-chip DDR3L and designed for 4K AI camera applications with a 1 TOPS AI NPU. The chip also features a 32-bit RISC-V E907 low-power core, a 4Kp25 H.264/H.265 video encoder, a 1080p60 JPEG video decoder and encoder, MIPI CSI and parallel camera interfaces, audio codec with input and output interfaces, Fast Ethernet, USB 2.0, and a range of digital and analog I/Os. Allwinner V861M3-XXX specifications: CPU Dual-Core RISC-V XuanTie C907 (RV64GCBV/RV32GGCBV) clocked up to 1.4GHz with RVV 1.0 extensions Single-core RISC-V XuanTie E907 (RV32IMAFC) clocked up to 800MHz VPU Video Encoder H.264/H.265 up to  4K @ 25fps (M)JPEG up to 8192×8192 Video Decoder – (M)JPEG up to 1080p60 AI accelerator – 1 TOPS (INT8) NPU dubbed “AI-ISP 2.0” Memory 128MB DDR3/DDR3L (SiP) “SQPI” PSRAM interface Storage QSPI flash eMMC 4.41 SDIO 2.0/3.0 Display – SPI interface Camera […]

Cincoze MD-3000 is a scalable DIN-Rail computer with up to 14th Gen 24-core Intel Core i9-14900 CPU

Cincoze MD-3000 scalable DIN RAIL computer

Cincoze MD-3000 is a high-performance, scalable DIN-Rail computer powered by a 12th, 13th, or 14th Gen Intel processor and designed to be expanded with up to six modules through the company’s “Scalable Expansion Deck” (SED) connected to the computer’s PCIe x16 slot. Based on an up to a 14th Gen 24-core Intel Core i9-14900 Raptor Lake-S Refresh CPU, the MD-3000 supports up to 96GB DDR5 SO-DIMM memory with optional ECC, up to two M.2 NVMe SSDs, and a 2.5-inch SATA bay, and is equipped with two 4K-capable DisplayPort connectors, five Gigabit Ethernet ports, four USB 3.2 ports, an RS232/RS485 DB9 connector and more. It mainly targets vision-driven smart manufacturing applications. Cincoze MD-3000 specifications: SoC (One or the other) 14th Generation Intel Raptor Lake-S Refresh Series – 35W Intel Processor 300T dual-core CPU @ 3.4 GHz, up to 65W Intel Core i9-14900 24-core CPU @ 5.8 GHz; 20 SKUs available 13th […]

VisionFive 2 Lite SBC Review – Ubuntu 24.04 on a low-cost RISC-V SBC in 2026

VisionFive 2 Lite RISC-V SBC Ubuntu Review 2026

StarFive has sent me a sample of the VisionFive 2 Lite RISC-V SBC for review. It’s a low-cost credit card-sized board based on the StarFive JH7110S quad-core RISC-V SBC and designed to get started with Linux RISC-V on the cheap. When I first tested the earlier VisionFive 2 SBC with a StarFive JH7110 RISC-V SoC in February 2023, I didn’t call it a review, but rather a hands-on experience, since, at the time, many features still didn’t work properly. Almost three years have passed since then, so reviewing the VisionFive 2 Lite SBC with Ubuntu 24.04 will allow us to see how much progress has been made on the software side. If you are in a rush, you can jump to the what works, what doesn’t section. VisionFive 2 Lite unboxing I received the board in a plastic box with a cover reading “VisionFive 2 Lite Your Gateway to RISC-V”. […]

DFRobot HUSKYLENS 2 AI camera review – From built-in AI samples to training a custom model to detect elephants

Huskylens 2 Ai camera review

Hello, today I am going to review the HUSKYLENS 2, released in October 2025. It is the next generation of HUSKYLENS, an AI vision sensor equipped with a Kendryte K230 dual-core RISC-V SoC with a 6 TOPS AI accelerator and a 2.4-inch IPS touchscreen. The device runs machine vision algorithms fully on-device, providing fast and low-latency performance, and includes more than 15 built-in AI models. HUSKYLENS 2 also supports deploying custom-trained models, including integration with Large Language Models (LLMs) via a Model Context Protocol (MCP) service. In addition, it is compatible with various microcontrollers, such as Arduino and Raspberry Pi, through UART or I2C communication interfaces. HUSKYLENS 2 unboxing The manufacturer sent the HUSKYLENS 2 module and the Microscope Lens separately. Both parcels were shipped from Chengdu, China, and arrived at my office in Chanthaburi, Thailand, in about one week. The parcels were packed in standard cardboard boxes and arrived […]

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