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September 27, 2024 by Sayantan Nandy - No Comments

AAEON SRG-CM4 IoT gateway features Raspberry Pi CM4 SoM for industrial applications

AAEON SRG-CM4 is an IoT gateway based on the Raspberry Pi Compute Module 4 (CM4) with 1GB to 8GB of RAM and 8GB to 32GB of eMMC storage, all powered by the Broadcom BCM2711 quad-core Cortex-A72 SoC. The gateway features a modular chassis, maintaining the compact size and industrial-grade features typical of AAEON’s edge gateway products, making it ideal for various embedded applications. In terms of connectivity, the SRG-CM4 offers two switchable serial ports supporting RS-232/422/485, with an optional isolated RS-485 port, CAN 2.0 A/B, and two isolated DI/DO. Additional interfaces include two Gigabit Ethernet RJ45 ports, two USB 2.0 ports, and an HDMI 1.4 video output. The device operates within a wide temperature range of -20°C to 70°C and supports a DC 9V to 36V power input, ensuring reliability in industrial environments. We previously covered the reComputer R1025-10, a Raspberry Pi CM4-based DIN Rail industrial gateway with optional wireless […]

September 27, 2024September 26, 2024 by Debashis Das - No Comments

ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

The ADLINK AVA-1000 T2G gateway is a rugged, EN50155-compliant T2G (Train-to-Ground) gateway designed for railway and industrial environments. Powered by a choice of NXP i.MX8M Plus Quad Cortex-A53 processor or an Intel Processor N50 Alder Lake-N processor. The i.MX8M Plus model is equipped with up to 8GB LPDDR4 and a 64GB eMMC flash whereas the Alder Lake variant features up to 4GB LPDDR5 memory and a 32GB eMMC flash. In terms of connectivity, the gateway features three M12 GbE ports and supports a wide range of options including 5G, WiFi 6, and GNSS. The AVA-1000 T2G gateway’s fanless design, wide operating temperature range, and 24-110V DC input ensure reliable operation in industrial environments. Additionally, its compliance with EN50155 and other industrial standards makes it ideal for various industrial applications. AVA-1000 T2G gateway specifications System Processor (multiple options) NXP i.MX8M Plus quad-core Cortex-A53 processor @ up to 1.8 GHz with Cortex-M7 […]

September 25, 2024September 25, 2024 by Debashis Das - No Comments

Portwell PEB-2274 3.5-inch fanless Intel Atom x6425E SBC offers triple display support, dual GbE, three M.2 sockets, and more

Portwell has recently launched PEB-2274, a 3.5-inch fanless SBC built around Intel Atom x6425E Elkhart Lake SoC. Key features include up to 32GB DDR4 memory, two Gigabit Ethernet ports, three M.2 sockets for storage and expansion, and a wide 9V to 36V DC power input. Additionally, it has various display interfaces (HDMI, DP, LVDS), multiple serial ports, USB, and audio options. We have already covered several other 3.5-inch inch Elkhart Lake SBCs with dual Ethernet ports including the Avalue ECM-EHL 3.5-inch SBC, Congatec Conga-PA7 Pico-ITX board, the iBase IB836 3.5-inch SBC, and the AAEON GENE-EHL5 SBC. All these boards support dual Ethernet and some of them have support for triple ethernet ports. But what’s unique about the PEB-2274 is that it has dual GbE ethernet, triple display, and a design specifically for industrial applications. Portwell PEB-2274 specifications: SoC – Intel Atom x6425E quad-core processor @ 2.00 GHz / 3.00 GHz […]

September 11, 2024September 9, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

MSI MS-CF13 is a fanless mini-ITX motherboard powered by Intel N97, Core i3-N305, or Atom x7425E Alder Lake-N SoC

MSI MS-CF13 is a low-profile, low-power, fanless mini-ITX motherboard offered with a choice of Alder Lake-N processors namely Intel Processor N97, Intel Core i3-N305, or Intel Atom x7425E SoC. The motherboard supports up to 16GB DDR5 SO-DIMM memory and SATA III storage, features dual 2.5GbE, six internal COM ports, six USB interfaces, M.2 Key-B and Key-E sockets for wireless expansion, and supports up to three independent display through up to two DisplayPort, one HDMI, LVDS/eDP display interfaces, MSI MS-CF13 specifications: Alder Lake N-series SoC (one or the other) Intel Atom x7425E quad-core processor up to 3.4 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.00 GHz; TDP: 12W Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.20 GHz; TDP: 12W Intel Core i3-N305 octa-core processor up to 3.8 GHz with 6MB cache, 32EU Intel UHD Graphics @ 1.25 GHz; TDP: […]

September 10, 2024September 8, 2024 by Debashis Das - No Comments

AAEON introduces NXP i.MX 8M Plus Pico-ITX SBC and mini PC designed for Edge AI industrial applications

AAEON PICO-IMX8PL is a Pico-ITX SBC built around the NXP i.MX 8M Plus Edge AI processor which the company has also released in an enclosed form as the SRG-IMX8PL mini-PC. Both are designed for industrial AIoT/IoT applications. The SBC features various connectivity options including dual Gigabit Ethernet, Wi-Fi/Bluetooth, 4G LTE, CAN-FD, Audio, LVDS, and support for popular protocols like Modbus, MQTT, and OPCUA. Whereas the mini PC sacrifices some I/O interfaces and the LVDS display output to enable wall or DIN rail mounting. Both products have wide operating temperature ranges, fanless designs, and compact form factors making them ideal for deployment in harsh industrial environments. All these features make this device useful for industrial automation, transportation, and digital signage. AAEON PICO-IMX8PL Pico-ITX SBC and RG-IMX8PL mini-PC specifications SoC – NXP i.MX 8M Plus AI SoC CPU Quad-core Arm Cortex-A53 processor @ up to 1.6 GHz Arm Cortex-M7 real-time core @ 800 […]

September 2, 2024 by Sayantan Nandy - No Comments

Vecow EVS-3000 AI computing systems combine 14th Gen Intel Core CPUs and MXM Graphics for Edge AI applications

Vecow has introduced the EVS-3000 series, a new line of AI computing systems powered by Intel Core i9/i7/i5/i3 (14th Gen) processors with embedded MXM graphics. These systems deliver high computing power, come with multiple PCIe slots for expansion, and support remote monitoring making them ideal for edge AI applications such as autonomous robotics, public security, and machine vision. The EVS-3000 series includes both fan and fanless models: EVS-3100, EVS-3200, EVS-3300, EVS-3400 without fans, and EVS-3100(F), EVS-3200(F), EVS-3300(F), EVS-3400(F) with fans. All systems are powered by Intel R680E chipsets and feature compact NVIDIA or AMD MXM graphics, with support for 2.5GbE LAN, Out-of-Band (OOB) management, and multiple PCIe Gen 4 slots. These systems deliver high performance for AI computing at the edge for applications such as machine vision and robotics. As you may know, we’ve previously covered several Vecow AI computing systems, including the TGS-1000 Series, SPC-9000 fanless embedded system, ECX-3200, […]

August 29, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

AAEON RICO-MX8P fanless Pico-ITX Plus SBC is powered by NXP i.MX 8M Plus AI processor

AAEON has launched another Pico-ITX Plus SBC with the RICO-MX8P single board computer powered by an NXP i.MX 8M Plus SoC with a 2.3 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and a 16GB eMMC flash. The fanless 100x80mm board offers a range of interfaces such as HDMI 2.0 video output, gigabit Ethernet, two USB 3.2 Gen 1 ports (one Type-C OTG, one Type-A), RS-232/422/485 DB9 connector, and a 40-pin FPC connector for optional daughter boards. All these features make the RICO-MX8P SBC suitable for digital signage, retail kiosks, and industrial control systems such as PLCs and telemetry. AAEON RICO-MX8P specifications: SoC – NXP i.MX 8M Plus AI SoC CPU Quad-core Arm Cortex-A53 processor @ up to 1.6 GHz Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC7000UL 3D GPU, Vivante GC520L 2D GPU VPU – 720p60 H.265/H.264 video decoder & encoder Optional AI accelerator […]

August 21, 2024August 21, 2024 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

xMEMS XMC-2400 is a 1mm-thin solid-state micro cooling fan-on-a-chip for ultrathin devices and SSDs

xMEMS XMC 2400 micro cooling fan on a chip

xMEMS Labs XMC-2400 is a vibration-free, solid-state micro cooling fan-on-a-chip that’s just 1mm thin and designed to cool the processor, other chips, and batteries on space-constraints devices such as smartphones, tablets, extended reality headsets, laptops, as well as SSDs. The XMC-2400 can deliver up to 39cc/sec airflow and up to 1,000Pa back pressure per instance while remaining inaudible and only consuming an estimated 30mW. It’s also rated IP58 for water and dust resistance. It leverages the manufacturing process the company has been using for its ultrathin MEMS speakers. xMEMS XMC-2400 specifications: Top-venting and side-venting packages for flexible integration in different system form-factors Bi-directional flow rate, adjustable up to 39cc/sec Inaudible; all mechanical operation is at ultrasonic frequencies Power consumption – 30mW (estimated) Dimensions – 9.26 x 7.6 x 1.08 mm Weight – 150 mg SMT-reflowable Ingress Protection – IP58 Two packages will be offered: XMC-2400-S – Side-Vented Package supports chip-stacking […]