industrial News - Page 2 of 126 - CNX Software

March 31, 2026April 1, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs

Toradex has launched two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, powered by NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications. The OSM iMX91 and OSM iMX93 variants comply with the OSM Size-S standard, featuring a 332-ball contact grid designed to be soldered to the carrier board. The Lino is a proprietary format that keeps the OSM Size-S dimensions but features two board-to-board (B2B) connectors offering more flexibility for potential replacement or future upgrades. Toradex Lino iMX91/iMX93 system-on-module Toradex Lino specifications: SoC (one or the other) NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, and color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Security – EdgeLock Secure Enclave NXP i.MX 91 CPU – Single-core Arm Cortex-A55 […]

March 31, 2026 by Debashis Das - No Comments

Rockchip RK3506J-based Forlinx FCU1501 fanless industrial IoT gateway offers dual Ethernet, plenty of I/Os and serial interfaces

Forlinx Technology has recently introduced the FCU1501, a rugged, fanless industrial embedded computer and IoT gateway built around the Rockchip RK3506J processor with a tri-core Cortex-A7 and a single Cortex-M0 core. The system is designed for high-reliability data acquisition and protocol conversion in harsh environments. The gateway comes in two variants (basic and extended), which have similar dimensions but differ mainly in interface density. Both models feature up to 512MB DDR3 RAM, 8GB eMMC flash, dual Fast Ethernet, dual-band Wi-Fi & Bluetooth 5.0, and 4G LTE Cat 1 support. Applications include automation, rail transit, and smart manufacturing. The system supports a wide industrial temperature range (-40°C to +85°C) and meets Level 3 EMC standards. Forlinx FCU1501 Specifications: SoC – Rockchip RK3506J CPU 3x Arm Cortex-A7 cores up to 1.5 GHz Arm Cortex-M0 real-time core GPU – 2D GPU only No VPU, no NPU System Memory – 256MB or 512MB DDR3 Storage 256MB NAND […]

March 27, 2026March 27, 2026 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Luckfox Lume – A compact Allwinner T153 SBC with dual GbE, PoE, GPIO header, and MIPI interfaces for industrial HMI applications

Luckfox Lume is a compact industrial SBC powered by an Allwinner T153 quad-core Cortex-A7 SoC with a low-power RISC-V core, and equipped with 128MB DDR3, 256MB SPI NAND flash, and dual Gigabit Ethernet The board also features a microSD card slot, a USB 2.0 Type-A port, a USB Type-C port, MIPI DSI and CSI connectors, and a 40-pin GPIO header suitable for a range of HMI applications. By default, the board is powered through USB-C, but a PoE model is also available. Luckfox Lume specifications: SoC – Allwinner T153 M3-QCX CPU 4x Arm Cortex-A7 cores @ up to 1.6GHz XuanTie E907 RISC-V core @ up to 600MHz GPU – 2D GPU only No VPU, no NPU System Memory – 128 MB built-in DDR3 (TBC) Storage 256 MB SPI NAND flash (Winbond 25N02KVZEIR) MicroSD card slot Display Interface – 4-lane MIPI DSI Camera Interface – 2-lane MIPI CSI Networking – 2x […]

March 27, 2026 by Debashis Das - 8 Comments

Microchip SAM9X75 Hybrid automotive MCU – Surprisingly ARM9 is still a thing in 2026

When Microchip launched the SAM9X60 in 2020, we were surprised to see a new SoC based on a legacy ARM926EJ-S core. But we were even more surprised to see Microchip doubling down with the SAM9X75, a hybrid automotive-qualified (AEC-Q100 Grade 2) System-in-Package (SiP) with the same classic ARM9 core and integrated DDR2 or DDR3L memory. The first part will be the SAM9X75D5M SiP with 512MB on-chip DDR2 RAM, but the company also designed the SAM9X75D1G with 1 Gbit DDR3L and the SAM9X75D2G featuring 2 Gbit DDR3L. The SAM9X75 hybrid ARM9 MCU targets developers who need an MCU-like development environment, while benefiting from higher processing and display capabilities of microprocessors for automotive and e-mobility HMI applications. Microchip SAM9X75D5M specifications: CPU subsystem Core – ARM926EJ-S running up to 800 MHz (significant increase from older 400-600MHz variants) 32 KB data cache, 32 KB instruction cache, and Memory Management Unit (MMU). Memory 512 Mbit […]

March 25, 2026 by Debashis Das - No Comments

Quixant IQON 3 and Air 3 AMD Ryzen Embedded 8000 systems target casino and arcade gaming

Quixant IQON 3 and IQON Air 3 Ryzen 8000 arcade casino mini PCs

Quixant IQON 3 and IQON Air 3 are two new Ryzen Embedded 8000-based industrial systems designed specifically for casinos, sports betting, and arcade gaming machines. Built around AMD Ryzen 5 and Ryzen 7 PRO R8000 Series SoCs, they support four independent 4K displays and feature game-specific hardware, including 4MB of battery-free MRAM for instant state saving, eleven physical intrusion-detection monitors, dedicated LED controllers, and casino-standard serial interfaces such as ccTalk, JCM ID003, and SAS. Both systems are very similar in hardware specifications, but the IQON 3 is a passively cooled, fanless system, whereas the IQON Air 3 comes with a cooling fan enabling a higher TDP (ranging from 15W to 54W) for graphics-intensive workloads. Quixant IQON 3 and IQON Air 3 specifications: SoC – AMD Ryzen 5 or 7 PRO R8000 Embedded Series SoCs with Zen 4 cores, AMD Radeon 7x0M graphics (RDNA 3), and AMD XDNA NPU System Memory […]

March 25, 2026March 25, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

RainbowLink-V2 compact USB-to-serial converter features 12V output, dual TTL, isolated RS-485 and RS-232 interfaces

DFRobot’s RainbowLink-V2 USB-to-serial converter features four independent channels, namely one isolated RS-485, one isolated RS-232, and two TTL interfaces usable simultaneously. The compact tool also converts 5V provided from the host’s USB interface to 12V/800mA, 5V/2A, and 3.3V/200mA outputs, eliminating the need for a separate power adapter. RainbowLink-V2 (TEL0190) specifications: USB – 1x USB Type-C port for power and adata Serial 2x TTL (3.3V) via headers 1x fully isolated RS485 channel via lever terminal 1x fully isolated RS232 channel via lever terminal Baud Rate – 2400 to 128000 bps Misc 3x Power LEDs for 3.3V, 5V, and 12V 4x Link LEDs for TTL 1/2, RS232, and RS485 12AWG – 22AWG wires supported on lever-type spring terminals Built-in short-circuit protection and overcurrent protection (but users are still recommended to avoid short-circuiting to prevent damage) Input voltage – 5V via USB-C port Output voltage 3.3V up to 200mA via header 5V up […]

March 25, 2026March 25, 2026 by Debashis Das - 2 Comments

LooperRobotics Insight 9 standalone spatial AI camera features D-Robotics RDK X5 SoC, supports ROS 2 (Crowdfunding)

LooperRobotics Insight 9 is an autonomous plug-and-play spatial AI camera designed for embodied intelligence, quadruped robots, and dynamic mobile platforms. Compared to typical USB depth cameras like Intel RealSense D435i or Luxonis OAK-D, which rely on a host PC for processing, the Insight 9 integrates a D-Robotics RDK X5 octa-core Cortex-A55 processor with a 10 TOPS AI accelerator, allowing it to run Visual SLAM (V-SLAM) and depth mapping entirely on-device. The camera features a “Tri-Eye Perception Matrix,” which includes an 8.4MP Sony Starvis IMX415 RGB sensor with an ultra-wide 188° field of view, and two SmartSens SG0132 global shutter sensors for stereoscopic depth. Encased in a passively cooled CNC aluminum chassis, it is also equipped with an automotive-grade Bosch BMI088 IMU capable of 24g high-G tracking, making it suitable for the heavy vibrations of legged locomotion. LooperRobotics Insight 9 specifications: SoC – D-Robotics RDK X5 octa-core Arm Cortex-A55 processor @ 1.5 GHz; […]

March 21, 2026March 21, 2026 by Debashis Das - 1 Comment

Radxa AICore DX-M1M M.2 2242 low-power AI module delivers 25 TOPS of edge AI performance for just 3W of power

Radxa AICore DX-M1M is a compact, low-power M.2 edge AI acceleration module built around the DeepX DX-M1M neural processing unit (NPU) and delivers up to 25 TOPS (INT8) of AI performance while consuming only 3W of power. Designed for industrial robot arms, autonomous mobile robots (AMR), edge servers, drones, and AIoT devices, the module delivers high-performance AI and ML capabilities without blowing the power budget. It relies on a PCIe Gen3 x2 interface and works with both x86 and Arm systems, including the Raspberry Pi 5 and Radxa ROCK SBCs. AICore DX-M1M specifications: AI Accelerator – DeepX DX-M1M neural processing unit (NPU) with up to 25 TOPS AI System Memory – 1GB LPDDR4X @ 4266 MT/s (on-chip, supports up to 8GB according to DeepX) Storage – 1Gbit QSPI NAND / NOR flash Host Interface – PCIe Gen 3.0 x4 (supports Gen 1/2/3 and x1/x2) via M.2 M + B Key connector […]