GIGAIPC QBiX-ADNAN97-A1 industrial PC is a compact system, powered by the Intel Processor N97 quad-core Alder Lake-N processor. This industrial PC supports up to 16GB of DDR5 memory and features flexible storage options with an M.2 slot for SATA or NVMe drives. Additionally, the QBiX-ADNAN97-A1 supports dual independent displays via two HDMI ports, It also offers dual Gigabit Ethernet, multiple USB 3.2 Gen 2×1 ports, an M.2 E-Key for Wi-Fi/Bluetooth expansion, and a COM port for legacy device connectivity. Designed for reliable operation, this fanless system is ideal for various Industry 4.0 applications, including industrial automation, digital signage, and edge computing. QBiX-ADNAN97-A1 industrial PC specifications SoC – Intel Processor N97 quad-core Alder Lake-N processor @ up to 3.6 GHz with 6MB Cache, Intel UHD Graphics; 12W TDP System Memory – Up to 16GB DDR5 4800 MHz via SODIMM slot Storage – M.2 2280 M-Key socket for NVMe or SATA storage Display 2x HDMI 2.0 […]
Altera’s 7nm Agilex 3 SoC FPGA features Cortex-A55 cores, AI Tensor Block, DSP, 10 GbE, and more.
Altera, an independent subsidiary of Intel, has launched the Altera Agilex 3 SoC FPGA lineup built on Intel’s 7nm technology. According to Altera, these FPGAs prioritize cost and power efficiency while maintaining essential performance. Key features include an integrated dual-core Arm Cortex A55 processor, AI capabilities within the FPGA fabric (tensor blocks and AI-optimized DSP sections), enhanced security, 25K–135K logic elements, 12.5 Gbps transceivers, LPDDR4 support, and a 38% lower power consumption versus competing FPGAs. Built on the Hyperflex architecture, it offers nearly double the performance compared to previous-generation Cyclone V FPGAs. These features make this device useful for manufacturing, surveillance, medical, test and measurement, and edge computing applications. Altera’s Agilex 3 AI SoC FPGA specifications Device Variants B-Series – No definite information is available C-Series – A3C025, A3C050, A3C065, A3C100, A3C135 SoC FPGAs Hard Processing System (HPS) – Dual-core 64-bit Arm Cortex-A55 up to 800 MHz that supports secure […]
Intel RealSense Depth Module D421 offers a low-cost depth-sensing solution at just $80
Intel RealSense Depth Module D421 is an entry-level stereo depth module with a 0.2 to 3-meter recommended range, a global shutter to capture motion without artifacts, and a 75° × 50° field of view (FoV). Intel has made RealSense Depth cameras for years, including the popular RealSense D435i with 6 DoF tracking introduced in 2018 that currently sells for about $320. But not all projects need the most advanced features and/or are viable when needing to spend several hundred dollars on the camera itself. The RealSense Depth Module D421 is a much cheaper way to integrate depth-sensing into projects at a much lower price point. It’s fairly similar to the earlier D435 but lacks an RGB camera. Intel RealSense Depth Module D421 specifications: Based on the Intel D4 Vision Processor Image sensor technology – Global Shutter Recommended Range – 0.2 m to over 3 m (varies with lighting conditions) Depth […]
Jetway MF32 3.5-inch SBC is offered with Intel Core i5-1335UE or Intel Processor U300, four 2.5GbE, M.2 expansion
Jetway MF32 is a 3.5-inch single-board computer (SBC) offered with either an Intel 13th Gen Core i5-1335UE or an Intel Processor U300. It includes four Intel 2.5GbE LAN ports and optional dual PoE with a max output of 40W. The board supports up to 32GB of DDR5 memory, offers various M.2 expansion slots, and comes with a Nano SIM card slot. This board can be used in networking devices, edge computing, IoT projects, digital surveillance, etc… Jetway offers four variants of their MF32 SBC: The MF32-133E0 and MF32-133E2 models are equipped with the Intel Core i5-1335UE processor, while the MF32-300U0 and MF32-300U2 feature the Intel Processor U300. It’s important to note that the MF32-133E0 and MF32-300U0 do not include TPM 2.0 (dTPM) security features. Jetway is well known for its SBCs, and we’ve previously covered its products like the JMTX-ADN8, JNUC-ADN1 mini-ITX motherboard, and JF35-ADN1 3.5-inch motherboard, all featuring the […]
ECS ADLN-IE1S – A 3.5-inch Alder Lake-N industrial motherboard with solid capacitors and 15µ gold contact
ECS Industrial Computer has recently launched the ECS ADLN-IE1S 3.5-inch industrial motherboard built around the Intel Alder Lake-N SoC family. Other than that, the motherboard supports DDR5 memory, 2.5 Gbps Ethernet, and triple display capabilities via a dual HDMI port, and an LVDS port. It also features multiple expansion slots for SSDs and WiFi modules including various I/O options including USB 3.2, serial ports, GPIO, and more. The motherboard is designed for industrial applications, so it has a wide operating temperature range making it suitable for applications including automation, control systems, digital signage, and kiosks. Previously we have written about motherboards designed for industrial applications like the DFI RPS310, the ASRock NUC Ultra 100 motherboards, the Kontron K3931-N mITX, and many others. The main difference is that this new ESC ADLN-IE1S motherboard comes in a 3.5-inch form factor whereas the other comes in a MINI-ITX or MICRO-ATX form factor. ECS ADLN-IE1S […]
Vecow EVS-3000 AI computing systems combine 14th Gen Intel Core CPUs and MXM Graphics for Edge AI applications
Vecow has introduced the EVS-3000 series, a new line of AI computing systems powered by Intel Core i9/i7/i5/i3 (14th Gen) processors with embedded MXM graphics. These systems deliver high computing power, come with multiple PCIe slots for expansion, and support remote monitoring making them ideal for edge AI applications such as autonomous robotics, public security, and machine vision. The EVS-3000 series includes both fan and fanless models: EVS-3100, EVS-3200, EVS-3300, EVS-3400 without fans, and EVS-3100(F), EVS-3200(F), EVS-3300(F), EVS-3400(F) with fans. All systems are powered by Intel R680E chipsets and feature compact NVIDIA or AMD MXM graphics, with support for 2.5GbE LAN, Out-of-Band (OOB) management, and multiple PCIe Gen 4 slots. These systems deliver high performance for AI computing at the edge for applications such as machine vision and robotics. As you may know, we’ve previously covered several Vecow AI computing systems, including the TGS-1000 Series, SPC-9000 fanless embedded system, ECX-3200, […]
Vecow TGS-1000 – A fanless, stackable embedded computer with Intel Core Ultra Meteor Lake SoC
The Vecow TGS-1000 Series is an ultra-compact, fanless, stackable embedded computer that includes the TGS-1000 and TGS-1500 models, powered by the latest Intel Core Ultra Metero Lake processors with integrated CPU, GPU, and NPU. It supports up to 96GB DDR5 memory and stackable expansion options for networking, serial, wireless, and more. This series is optimized for edge AI applications, offering up to 14% increased CPU productivity and enhanced graphics capabilities. The TGS-1000 Series offers up to five independent displays through two HDMI and three DP ports. It features a variety of I/O connections, including up to 5 USB 3.0 ports (4x Type-A and 1x Type-C) and one 2.5GbE LAN supporting TSN, making it ideal for vision and automation applications. Its modular design allows flexible expansion for USB, isolated DIO, COM, LAN, or 4G/LTE, suitable for AI, smart retail, office communication, and gaming. The TG-1500 series adds support for MXM graphics […]
High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)
Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]