matter News - Page 3 of 18 - CNX Software

April 1, 2026April 1, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Telink TL3228 – Low-power, low-latency dual-core RISC-V wireless MCU supports Bluetooth 6.0, 802.15.4, and 2.4 GHz proprietary

Telink has launched the TL322x wireless MCU family, starting with the TL3228, featuring a 192 MHz dual-core RISC-V MCU, and supporting Bluetooth 6.0, Matter, Thread, Zigbee, RF4CE, and proprietary 2.4GHz protocols for Smart Home, asset tracking, “8K” gaming accessories, and more The chip supports the recent Bluetooth features such as Channel Sounding, AoA/AoD, and LE Audio, as well as the company’s proprietary HDT technology delivering up to 6 Mbps data rate and ultra-low latency. Telink TL3228 specifications: Dual-core CPU 32-bit Andes D25F RISC-V core with FPU up to 192 MHz 32-bit Andes N22 RISC-V core Memory – 384 KB SRAM Storage – 2.5 MB of NVM (Flash + RRAM) Connectivity Bluetooth 6.0 Channel Sounding Mesh Networking Bluetooth LE AoA/AoD location services 802.15.4 radio for Zigbee, Thread, Matter, RF4CE 2.4GHz Proprietary 2.4GHz radio data rates – 1Mbps, 2Mbps, 4Mbps, 6Mbps; Bluetooth LE PHY: LE 2M, LE Coded Bluetooth LE Multiple Connections – 4x […]

March 29, 2026March 28, 2026 by Debashis Das - No Comments

M5Stack Stamp-P4 – A tiny ESP32-P4 USB-C board with optional Wi-Fi 6 and Bluetooth 5.4

Stamp P4 (Left) Stamp AddOn C6 For P4 (Right)

M5Stack has just introduced the Stamp-P4, a tiny USB-C development board built around the ESP32-P4 high-performance RISC-V MCU chip, featuring 16MB of Flash and 32MB of PSRAM, and optional Wi-Fi 6 and Bluetooth 5.4 support through the ESP32-C6-MINI-1-based Stamp-AddOn C6 module. Despite its small size (29.8 x 22.0 x 4.3mm), the Stamp-P4 offers a wide range of interfaces, including a MIPI-CSI camera connector, as well as a MIPI DSI display interface, RMII Ethernet, USB 2.0 HS, and up to 44x GPIOs via 1.27mm/2.00mm pitch castellated holes and a few through holes. M5Stack Stamp-P4 specifications: SoC – Espressif Systems ESP32-P4NRW32 CPU Dual-core RISC-V microcontroller @ 360 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz GPU – 2D Pixel Processing Accelerator (PPA) VPU – H.264 and JPEG codecs support Memory – 768 KB HP L2MEM, 32 KB LP SRAM, 8 KB TCM, 32MB […]

March 27, 2026March 27, 2026 by Debashis Das - No Comments

SparkFun Thing Plus – ESP32-C5 board offers dual-band WiFi 6, Adafruit Feather pinout, LiPo battery support

Espressif has recently released the ESP-IDF v6.0 framework with support for ESP32-C5 and ESP32-C61, so we can expect more ESP32-C5 boards. Following the launch of boards like DFRobot FireBeetle 2 and the Espressif DevKitC-1, SparkFun has now launched its Thing Plus – ESP32-C5, an Adafruit Feather-compatible board based on the ESP32-C5. The timing is no coincidence. Although the ESP32-C5 dual-band WiFi 6 SoC was announced back in 2022, hardware makers have been waiting for stable software support. With the release of ESP-IDF v6.0, the ESP32-C5 moves from “preview” to “stable” and adds key features, such as Safe Bootloader OTA updates. This enables the ROM bootloader to fall back to a recovery partition if an update fails, making it reliable enough for companies like SparkFun to launch hardware for remote deployments and Matter-compatible smart home applications. SparkFun Thing Plus – ESP32-C5 specifications: Wireless module – ESP32-C5-WROOM-1 SoC – Espressif Systems ESP32-C5 CPU Single-core […]

March 24, 2026May 22, 2026 by Jean-Luc Aufranc (CNXSoft) - 20 Comments

Upcoming ESP32-S31 dual-core RISC-V MCU offers Gigabit Ethernet, WiFi, Bluetooth, and 802.15.4 connectivity

It looks like Espressif Systems has a new powerful wireless microcontroller in the works, with the ESP32-S31 sharing some features of the ESP32-P4 and ESP32-S3 microcontrollers. The ESP32-S31 is a dual-core RISC-V MCU with one high-performance core with FPU and SIMD instructions, and one low-power RISC-V core, featuring 62 GPIOs, a Gigabit Ethernet MAC, WiFi, Bluetooth, and 802.15.4 (Thread/Zigbee/Matter) wireless connectivity, and more. ESP32-S31 preliminary specifications: MCU subsystem RISC-V HP (High-performance) RV32IMAFCP CPU @ 320 MHz with FPU, SIMD, etc. RISC-V LP (Low-power) MCU core Memory & Storage I/F 512 KB SRAM 32 KB RTC SRAM Support for external octal PSRAM and flash up to 64MB @ 250 MHz GPU – 2D Pixel Processing Accelerator (PPA) and VPU – (M)JPEG codec support Peripherals Display I/F – 8-bit to 24-bit Parallel LCD interface Camera I/F – 8-bit/16-bit DVP camera interface Audio – 2x I2S Networking Gigabit Ethernet 2.4 GHz WiFi 6 […]

March 10, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio

NXP i.MX 93W is the company’s first integrated wireless MPU System-in-Package (SiP) and combines a dual-core Cortex-A55 processor (NXP i.MX 93) with an iW610 WiFi 6, Bluetooth LE, and 802.15.4 tri-radio into a single chip. The 14.2 x 12 mm package also includes all the external radio components needed for wireless connectivity, replacing up to 60 discrete components on the PCB. NXP says it reduces the PCB area, simplifies PCB design and regulatory approval, and speeds up time-to-market. NXP i.MX 93W specifications: CPU Dual-Core Arm Cortex-A55 at up to 1.7 GHz Arm Cortex-M33 core at 250 MHz for real-time control GPU – 2D graphics accelerator AI accelerator – Arm Ethos-U65 microNPU Memory I/F – Up to 3.7GT/s 16-bit LPDDR4/LPDDR4X with inline ECC Storage I/F – 2x SD 3.0/SDIO 3.0/eMMC 5.1 Display Interfaces MIPI DSI up to 1080p60 LVDS up to 720p60 24-bit parallel RGB Camera Interface – 2-lane MIPI CSI up […]

February 26, 2026 by Debashis Das - 1 Comment

Arduino Matter Discovery Bundle educational kit combines Arduino Nano Matter with three Modulino modules

Arduino has just announced the Arduino Matter Discovery Bundle (AKX00081), an all-in-one development kit designed to help users learn, prototype, and build Matter-over-Thread smart home devices quickly. The kit is based on the Arduino Nano Matter development board and works with the Matter ecosystem, including compatible platforms such as Apple HomeKit, Google Home, Amazon Alexa, and Home Assistant. The bundle also includes a Nano Connector Carrier with Grove and Qwiic interfaces, a microSD slot, and various IO options. The kit features three Qwiic-based Modulino nodes, namely a Latch Relay, a Distance module for presence detection, and a Thermo module for temperature and humidity sensing. Arduino Matter Discovery Bundle specifications: Main board – Arduino Nano Matter MCU – SiLabs MGM240SD22VNA MCU core – 32-bit Arm Cortex-M33 with DSP (digital signal processing) instruction and FPU (floating-point unit) @ 78 MHz Storage/Memory – 1536 KB flash program memory, 256 KB RAM data memory […]

February 25, 2026February 25, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Telink ML9118A – A 32-bit RISC-V IoT module with Wi-Fi 6, Bluetooth 5.4, and 802.15.4 connectivity

Telink ML9118A is a wireless IoT module with Wi-Fi 6, Bluetooth 5.4, and 802.15.4 (Zigbee/Thread/Matter) connectivity designed for smart home, smart lighting, and smart remote control applications. The module also features a 32-bit RISC-V microcontroller clocked at 160 MHz with 576KB SRAM, 4MB flash, and various peripheral interfaces such as SDIO 3.0, 19x GPIOs, I2C, SPI, UART, as well as I2S for audio. Telink ML9118A module (ML9118A-GAIA-M0-PG12) specifications: MCU – 32-bit dual-core RISC-V MCU @ 160MHz Memory – 576KB SRAM Storage – 4MB embedded ﬂash Wireless 2.4 GHz Wi-Fi 6 IEEE 802.11 b/g/n/ax with support for DL/UL OFDMA, RX STBC, TWT, etc… Bluetooth 5.4 LE up to 2 Mbps bit rate 802.15.4 radio for Matter 1.3, Zigbee 3.0 compatible with ZHA and ZLL, Thread 2.4GHz proprietary – Supports Matter over Wi-Fi and Thread Tx Power – 15dBm @ Bluetooth LE mode Rx Sensitivity -88dBm @ 11B CCK 11Mbps -76dBm @ […]

February 16, 2026February 16, 2026 by Debashis Das - 1 Comment

LR2021 LoRa Plus board combines Semtech LR2021 and Nordic nRF54L15 for high-speed FLRC and LoRa connectivity

Last year, Semtech released the LR2021 LoRa Plus transceiver chip, designed to address the low data-rate issue associated with LoRa, but surprisingly, they didn’t release a development board for the chip. Now, almost a year later, Seeed Studio and Semtech have partnered to introduce the LR2021 LoRa Plus development kit targeting long-range high-speed LoRa and FLRC applications up to 2.6 Mbps. Not only does the board support LoRa Gen 4 technology, providing Sub-GHz, 2.4 GHz ISM, and S/L-band operation, but a XIAO nRF54L15 board also adds dual-core processing (Arm Cortex-M33 + RISC-V) and supports other short-range protocols, including NFC, Bluetooth LE 6.0, Matter, Thread, and 2.4 GHz proprietary protocols. The development board also features a 0.96-inch 128×64 OLED, three Grove connectors for expansion, a USB Type-C for power, SWD debugging, and two Sub-GHz and 2.4 GHz SMA connectors. It is compatible with Arduino Uno, STM32 Nucleo, and Nordic DK boards. […]