COM Express Type 6 module supports up to 64GB ECC RAM, 2.5GbE, 4 displays, and more

COM Express Type 6 module ECC RAM

Here’s another Tiger Lake UP3 COM Express module courtesy of AAEON with the COM-TGUC6 COM Express Compact Type 6 modules equipped with a choice of Celeron. Core i3/i5/i7 embedded processors from the 11th generation Tiger Lake family. The module supports up to 64 GB ECC RAM via two SO-DIMM sockets, 2.5 Gpbs Ethernet, up to four independent displays via LVDS, VGA, and 4K DDI interfaces, SATA storage, PCIe Gen 3 & Gen4, and more for industrial. medical, and military applications. COM-TGUC6 specifications: Tiger Lake UP3 SoC (one or the other) Intel Core i7-1185G7E/GRE quad-core/octa-thread processor @ 1.8/4.4 GHz with 12 MB cache, 96 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i7-1145G7E/GRE quad-core/octa-thread processor @ 1.5/4.1 GHz with 8 MB cache, 80 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i3-1115G4E/GRE dual-core/quad-thread processor @ 2.2/3.9 GHz with 6 MB cache, 48 EU […]

Compact H.265 4K video encoder is made for embedded, medical, and military applications

h.265 video encoder board

US-based Z3 Technology has announced the Z3-Q603-RPS, a compact H.265 video encoder system capable of supporting 4K and HD resolutions for embedded, medical, and even military camera applications through NDAA (National Defense Authorisation Act) compliance. The board runs Linux on Qualcomm QCS603 IoT processor for AI and computer vision applications, which we previously found in Microsoft’s Vision AI Developer Kit, supports Ethernet and WiFI 5 connectivity, as well as features such as PTZ (Pan Tilt Zoom). Z3-Q603-RPS H.264 & H.265 video encoder system is comprised of an application board and a module with the following specifications: SoC – Qualcomm QCS603 (aka Qualcomm Vision Intelligence 300 Platform) with four Armv8 cores (2x 1.6GHz Kryo 300 Gold cores, 2x 1.7GHz Qualcomm Kryo 300 Silver cores ), Snapdragon neural processing engine, Adreno 615 GPU at 780 MHz System Memory – TBD Storage – NAND flash (capacity TBD) , MicroSD card socket Video Output […]

Embedded development board features Microchip PolarFire RISC-V FPGA SoC

PolarFire RISC-V FPGA SoC development board

Microchip/MicroSemi first introduced PolarFire RISC-V FPGA SoC at the end of 2018, with the chip being like the RISC-V equivalent of Xilinx Zynq Ultrascale+ Arm & FPGA MPSoC. The following year, ARIES Embedded unveiled the ARIES M100PF system-on-module and evaluation board, before Microchip launched PolarFire SoC Icicle 64-bit RISC-V and FPGA development board, followed by the more compact PolarBerry SBC in 2020. There’s now at least a fourth platform based on PolarFire SoC with Aldec TySOM-M-MPFS250 embedded development board.   Aldec TySOM-M-MPFS250 specifications: SoC – Microchip PolarFire MPFS250T-FCG1152 SoC  with 4x SiFive U54 RV64GC application cores (similar to Cortex-A35 performance), 1x SiFive E51 RV64IMAC monitor core, FPGA fabric with 254K logic cells, 17.6 Mb RAM System Memory 2GB (16Gbit) 32-bit DDR4 for the FPGA 2GB (16Gbit) 36-bit RAM with ECC for the RISC-V cores (aka MSS = Microprocessor Subsystem) Storage – MicroSD card socket, eMMC flash, SPI flash, 64 Kbit […]

Zoom i.MX 8M Mini Development Kit supports power usage monitoring

Beacon EmbeddedWorks iMX8M Som & Devkit

NXP i.MX 8M Mini 14nm Cortex-A53/M4 processor has been around for a couple of years, and several SoM-based development kits are available including Variscite Symphony starter kit, HummingBoard Ripple SBC, or congatec conga-SEVAL007010 evaluation board. Beacon EmbeddedWorks’ Zoom i.MX 8M mini development kit is based on the company’s i.MX 8M Nano System on Module (SOM) and offers features not found on most other devkits or single board computers such as power usage monitoring and control through their Wattson power measurement application. Zoom i.MX 8M mini development kit key features & specifications: System-on-Module SoC – NXP i.MX 8M Mini processor with up to four Arm Cortex-A53 cores @ up to 1.8 GHz, an Arm Cortex-M4 real-time core at up to 400 MHz, Vivante 3D & 2D GPU’s System Memory – Up to 8GB of 32-bit wide LPDDR4 memory Storage – eMMC flash, QSPI NOR flash Networking Gigabit Ethernet PHY Wireless module […]

Commell LP-179 Pico-ITX motherboard ships with Intel Tiger Lake UP3 embedded processor

LP-179 Tiger Lake Pico-ITX motherboard

Intel first introduced Core i3/i5/i7 Tiger Lake UP3 processors with Intel Xe graphics in early September 2020, soon followed with embedded versions of Tiger Lake UP3 a couple of weeks later, and then Celeron 6305E, still for embedded & IoT applications, with support for features such as 2.5GbE and quad-display support. We’ve already seen some Tiger Lake UP3 motherboards with AAEON UP Xtreme i11 (122 x 120 mm) and IEI tKINO-ULT6 mini-ITX SBC, but if you’d like a more compact Tiger Lake solution, Commell LP-179 Pico-ITX motherboard may be an option with a choice of Core i7-1185G7E or Celeron 6305E processor. Commell LP-179 specifications: SoC (one or the other) Intel Core i7-1185G7E quad-core/octa-thread Tiger Lake UP3 embedded processor @ 1.8 GHz / 4.4 GHz (Turbo) with 12MB cache, 96EU Intel Iris Xe graphics; 12 to 28W TDP Intel Celeron 6305E dual-core Tiger Lake UP3 embedded processor @ 1.8 GHz (No […]

Kontron Introduces Tiger Lake 3U VPX Computer Blade and COM Express Type 6 Module

Tiger Lake 3U VPX Computer-Blade SBC COM Express

Intel launched several new embedded processors last month including the brand new Elkhart Lake family and some additional Tiger Lake UP3 processors designed for the IoT edge market. There’ve been several products announced with the new processors, but here are more with Kontron introducing two new Tiger Lake embedded hardware with COMe-cTL6 COM Express Compact Type 6 module and VX3060 3U VPX computer blade. As shown in the collage above, a 3.5-inch SBC is also in the works, but while we do not have the full details yet, the company expect the board to comes with SATA 3.0, M.2 socket, 2.5 GbE LAN, as well as four DP channels driving up to four independent 4Kp60 displays. VX3060 3U VPX computer blade Key features for both “3E” and “XG” variants: SoC – Intel quad-core Tiger Lake UP3 processor up to 2.5 GHz with up to 96EU Intel Iris Xe Graphics  – […]

Versalogic Grizzly Embedded Server Board is Powered by a 16-Core Intel Atom C3958 Processor

Versalogic Grizzly with Heat Pipe

Launched in 2016, Intel Atom Denverton processors are usually found in motherboards for low power servers hosted in data centers as well as in network appliances. But Versalogic Grizzly embedded server board fitted with the 16-core Atom C3958 Denverton processor aims specifically at embedded systems with applications ranging from smart-grid, and smart-city applications, to transportation, security, and defense operations. Versalogic Grizzly (VL-ESU-5070) key features and specifications: Processor – Intel C3958 16-core Denverton server-class processor @ 2.0 GHz System Memory – 4x SO-DIMM sockets for up to 128 GB DDR4 of ECC memory Storage – 2x SATA 3 ports, bootable mSATA socket, bootable M.2 NVMe SSD socket Networking – 2x 10GbE SFP+ ports (copper or fiber), 4x Gigabit Ethernet ports Video output – None, but optional VGA/LVDS mini PCIe card available Audio – No on-board audio, but optional VL-ADR-01 audio interface available USB – 2x USB 3.0 host ports Serial – […]

Versalogic Owl Small Form Factor Apollo Lake Embedded Computer Targets Military & Industrial Applications

VersaLogic Owl VL-EPU-4012 Embedded System Computer  In October 2019 we reported on the VersaLogic Harrier computer that was slightly bigger than a credit card. Just announced by the company is a new embedded computer system is being developed, the Owl. Basics of the VersaLogic Owl The intended uses are again industry and military-grade applications. The system uses ECC memory and the Embedded Processing Unit (EPU) format. The processing unit is an Intel Atom E39xx Platform,  5th Gen Apollo Lake processor with dual or quad-core options. Strength and Resilience The ECC memory is fixed to the board and can be up to 8 GB in size. This reduces the damage that can be caused by vibration and shock, making the system tough and resilient. Available Ports and Security Hardware-based security is through a TDM 2.0 chip. There are onboard power conditioning, mini-PCIe expansion sockets, analog inputs, standard USB 3.0 and 4x […]