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Posted on by Debashis Das - No Comments on AMD Versal Premium Gen 2 MoP adaptive SoC integrates 32GB LPDDR5X to shrink board footprint by 60%

AMD Versal Premium Gen 2 MoP adaptive SoC integrates 32GB LPDDR5X to shrink board footprint by 60%

 Versal Premium Gen 2 Memory on Package (MoP) adaptive SoCs

AMD has announced the Versal Premium Gen 2 Memory-on-Package (MoP) adaptive SoCs, adding an integrated memory option to the Premium Gen 2 family, a topic we covered back in November 2024. While the core silicon (dual-core Cortex-A72 + dual-core Cortex-R5F + high-end FPGA fabric) remains the same, the new devices (2VP3422, 2VP3522, and 2VP3622) integrate up to 32 GB of LPDDR5X memory directly inside the package. This removes the need for external high-speed memory on the board and reduces PCB area by up to 60%. This also eliminates high-speed memory routing on the carrier board, increasing the maximum memory bandwidth to 288 GB/s. AMD Versal Premium Gen2 MoP specifications: CPU cores Dual-core Arm Cortex-A72 application core, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC Memory on Package 32 GB of LPDDR5X DRAM […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

ADLINK COM-HPC-mPTL COM-HPC Mini computer-on-module features up to 180 TOPS Intel Core Ultra Series 3 CPU

COM-HPC Mini module based on Intel Core Ultra Series 3 Panther Lake

ADLINK COM-HPC-mPTL is a COM-HPC R1.3 Mini computer-on-module powered by the Intel Core Ultra Processor Series 3 “Panther Lake” family, up to the 180 TOPS 16-core Core Ultra X7 358H processor. The module supports up to 64GB LPDDR5x and optional NVMe SSD BGA storage, and features two 2.5GbE controllers, optional MIPI CSI camera connectors,  and a 40-pin  debug connector. All I/Os are exposed through a standard 400-pin high-density board-to-board connector, including four display interfaces (HDMI, DP, USB4, eDP), and up to 16x PCIe Gen4/Gen5 lanes. COM-HPC-mPTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 325 8-core (4P+0E+4LPE) processor up to 2.1 GHz / 4.5 GHz (Turbo) with 12MB cache, 4-core Xe3 graphics (40 TOPS), 47 TOPS NPU; PBP: 25W Intel Core Ultra 7 356H 16-core (4P+8E+4LPE) processor up to 1.9 GHz / 4.7 GHz (Turbo) with 18MB cache, 4-core […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules

Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules

Gateworks Catalina GW6200 SBC

Last March, Gateworks introduced the Catalina SBC family, starting with the GW9200 board, based on NXP i.MX 95 SoC for industrial Edge AI applications, and featuring Flexible Socket Adapter (FSA) sockets to accommodate either mini PCIe or M.2 module adapters, depending on requirements. We missed the original announcement, but the new SBC family was brought to our attention when Ezurio announced the acquisition of Gateworks last week. The GW9200 board comprises a system-on-module with the NXP i.MX 95 chip, 4GB LPDDR5 and 8GB eMMC flash by default, as well as a carrier board with 10GbE and GbE RJ45 ports, a MIPI DSI/CSI display/camera interface, two FSA sockets for M.2 or mini PCIe expansion, and a range of I/Os. Ezurio/Gateworks Catalina GW9200 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Altera Agilex 9 Direct RF-Series AGRW039 SoC FPGA targets high-performance RF systems

Altera Agilex 9 Direct RF-Series AGRW039 SoC FPGA targets high-performance RF systems

Agilex 9 FGPA Direct RF-Series

Altera’s wideband Agilex 9 Direct RF-Series AGRW039 SoC FPGA is designed for high-performance Radio Frequency (RF) systems in aerospace, defense, and advanced communications systems. It is the fourth device in Altera’s Agilex 9 Direct RF-Series, and compared to the previous generation AGRW027, the new AGRW039 delivers about 45% more logic resources, 45% more DSP resources, and 43% more block RAM. It also integrates a 64Gsps wideband RF, a hard quad-core Cortex-A53 processor, and supports DDR5 and LPDDR5 memory. Agilex 9 Direct RF AGRW039 SoC FPGA key features and specifications: Hardware CPU – Quad-core Arm Cortex-A53 processor @ up to 1.41 GHz FPGA fabric 3.9M logic elements (LEs) 1.3M adaptive logic modules (ALMs) 18,960 M20K memory Blocks 370 Mb M20K memory Size 65,280 MLAB memory count 40 Mb MLAB memory size 24,600 18×19 multipliers 12,300 DSP/AI blocks Single Precision – 18.4 TFLOPS Memory I/F – DDR5, LPDDR5, DDR4 Peripherals PS – […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Renesas RZ/V2H Robotics Development Kit handles AI vision, motor control, and power management with a single board

Renesas RZ/V2H Robotics Development Kit handles AI vision, motor control, and power management with a single board

Renesas RZ/V2H Robotic Development Kit

Renesas WS125-V2HRDKREFZ is a Robotics Development Kit (RDK) powered by Renesas RZ/V2H Arm Cortex-A55/R8/M33 microprocessor and designed for high‑performance AI vision applications leveraging the MPU’s built-in 80 TOPS (sparse) AI accelerator. The kit ships with 16GB LPDDR4, 64MB QSPI flash, a 64GB microSD card, and appears to be partially inspired by the Raspberry Pi 5 with a 40-pin Raspberry Pi GPIO header, a 16-pin PCIe Gen3 FFC connector, two MIPI CSI connectors, and a micro HDMI port. Other features include a Gigabit Ethernet port, two USB 3.2 ports, two CAN-FD interfaces, and a 12-24V DC input voltage range. Renesas WS125-V2HRDKREFZ specifications: SoC – Renesas RZ/V2H CPU/MCU cores 4x Arm Cortex-A55 cores up to 1.8 GHz 2x Cortex-R8 real-time cores up to 800 MHz Arm Cortex-M33 microcontroller core up to 200 MHz for system management GPU – Arm Mali-G31 GPU NPU – DRP-AI3 dynamically reconfigurable processor delivering up to 8 TOPS (INT8) or […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Intel Core Series 3 “Wildcat Lake” processor family launched for entry-level laptops and Edge AI systems

Intel Core Series 3 “Wildcat Lake” processor family launched for entry-level laptops and Edge AI systems

Intel Core Series 3 launch

After several leaks, the Intel Core Series 3 “Wildcat Lake” entry-level processor family is now official. Intel describes it as the first “hybrid AI-ready Core Series processor”.  As expected, the “Computer & CPU tile” comes with up to six cores (2x P cores + 4x LPE cores), up to 2-core Intel Xe 3 graphics, up to 40 TOPS of combined AI performance, and LPDDR5x/DDR5 memory interfaces. The “Platform controller tile” integrates six PCIe Gen4 lanes, two Thunderbolt 4 interfaces, two USB 3.2 and eight USB 2.0 interfaces, as well as WiFi 7 and Bluetooth 6.0 connectivity. The Computer & GPU tile is manufactured using an Intel 18A process, while the Platform controller tile is manufactured with another “External” process (TSMC?). Single-channel memory is confirmed, and it looks like eMMC flash will be replaced with UFS 3.0 memory for edge systems with soldered-on memory, although many systems will make use of […]

Posted on by Debashis Das - No Comments on IP65-rated TWOWIN T808P-G Edge AI computer features 8x GMSL2 cameras, aviation-grade M12/M16 connectors

IP65-rated TWOWIN T808P-G Edge AI computer features 8x GMSL2 cameras, aviation-grade M12/M16 connectors

TWOWIN T808P G AI Edge Computer

TWOWIN Technology has introduced the TW-T808P-G, a rugged, fan-cooled, IP65 edge AI computer built around the NVIDIA Jetson Orin NX system-on-module (SoM). Designed specifically for autonomous driving, unmanned delivery vehicles, and smart inspection scenarios, the system provides up to 157 TOPS of AI performance and features various connectivity options for real-time processing in industrial and smart infrastructure environments. Housed in an aluminum alloy enclosure, the device features aviation-grade M12 and M16 connectors for Gigabit Ethernet (PoE), RS232/RS485 serial communication, and power. Other features include two FAKRA connectors for up to eight GMSL2 cameras, USB 3.0, CAN Bus, GPIO, HDMI, and M.2 NVMe storage. It also supports optional Wi-Fi, 4G/5G, and RTK GPS for centimeter-level positioning. With a wide 9–36V input, a zero-power standby design using automotive ACC (ignition) control, and an operating range of -40°C to +70°C, the system is designed for applications such as security monitoring, smart gas stations, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on LimeSDR Micro M.2 2280 SDR card pairs NXP LA9310 baseband processor with LMS7002M RF transceiver (Crowdfunding)

LimeSDR Micro M.2 2280 SDR card pairs NXP LA9310 baseband processor with LMS7002M RF transceiver (Crowdfunding)

LimeSDR Micro

The LimeSDR Micro M.2 2280 software-defined radio (SDR) card combines an NXP LA9310 baseband processor and a Lime Microsystems LMS7002M transceiver, and targets integration into portable or embedded solutions with a spare M.2 PCIe Gen3 x1 socket. The module is offered in a 1T2R configuration by default, but can be expanded to 1T4R via an FPC connector, supports a 30 MHz to 3.8 GHz frequency range, and up to 100 MHz bandwidth. Target applications include 4G LTE/5G, future RAN research, custom user equipment/modems, drone communications, IoT, satellite communications, and custom waveform generation. LimeSDR Micro M.2 SDR card specifications: SoC – NXP LA9310 programmable baseband processor Vector Signal Processing Accelerator (VSPA) Gen 2 up to 80 GFLOPs Control Processor – Arm Cortex-M4 at up to 307 MHz Storage – 512 Kbit EEPROM memory for NXP LA9310 initial configuration RF Lime Microsystems LMS7002M RF transceiver Channels – 1T2R expandable to 1T4R via […]