Arylic B50 – A Qualcomm QCC3040 based Bluetooth stereo amplifier with audio transmitter (Sponsored)

Arylic B50 Bluetooth Stereo Amplifier

Arylic B50 is a Bluetooth 5.2 stereo amplifier with an audio transmitter based on Qualcomm QCC3040 low-power Bluetooth Audio SoC that’s typically used in wireless earbuds. The all-in-one Bluetooth amplifier supports aptX HD audio transmission and reception, can handle two Bluetooth sources or two Bluetooth speakers or earbuds, and offers a wide range of interfaces including HDMI ARC, Phono in, RCA in, optical S/PDIF in, subwoofer out, and more. The system can also be connected to two wired speakers up to 50W @ 4 Ohms. Arylic B50 specifications: SoC – Qualcomm QCC3040 with 32-bit application processor @ 32 MHz, 32-bit system processor @ 32 MHz, Kalimba DSP @ 120 MHz, Bluetooth 5.2 and aptX HD support. Bluetooth Version 5.2 with up to 15m range Transmit – 2x Bluetooth Tx for up to 2 Bluetooth speakers or earbuds Receiver – 2x Bluetooth Rx for up to 2 Bluetooth transmitter devices Supported […]

Sub-$5 Cavli C16QS CAT1.bis cellular IoT module features Qualcomm QCX216 modem

Qualcomm QCX216 LTE IoT modem was announced at the end of last year as one of the first solutions supporting the new CAT1.bis standard enabling smaller, simpler, and cheaper modules with a single antenna design. This chip also integrates a WiFi scanner exclusively used for indoor positioning. Cavli Wireless C16QS CAT1.bis is one of the first cellular IoT modules based on the Qualcomm QCX216, and we now have a clearer idea of what “cheaper” means since the company says it will sell those for less than $5 to OEMs, although that price is likely in very high quantities, possibly 100k+ or one million pieces. Cavli C16QS specifications: Wireless IC – Qualcomm QCX216 with dual-core Cortex-M3 @ 204 MHz, cellular modem-RF Storage – 4 MB Cellular connectivity LTE CAT 1.bis based on 3GPP Release 14 Peak speeds – 10Mbps (DL), 5Mbps (UL) Bands EMEA: B1/B3/B5/B8/B20 North America : B2/B4/B12/B13/B66/B71 Integrated eSIM […]

Qualcomm Snapdragon Satellite enables two-way messaging using the Iridium network

You may soon be able to get true global coverage even in remote areas thanks to Qualcomm Snapdragon Satellite which will offer pole-to-pole coverage and two-way messaging for emergency use, SMS texting, and other messaging applications. Qualcomm made this possible through a partnership with Iridium to bring satellite-based connectivity to next-generation premium Android smartphones starting with devices based on Snapdragon 8 Gen 2 Mobile Platform, while emergency messaging support was done in collaboration with Garmin. You’ll just need to point your phone to the sky to send and/or receive messages, and the connection should take place within a few seconds. Note it can only be used for text, and the bandwitdh would not be sufficient for audio, pictures, and videos. The solution relies on Snapdragon 5G Modem-RF Systems such as the Snapdragon X70 modem to connect to the Iridium low-earth orbit satellite constellation using the L-band spectrum (1 to 2 […]

Qualcomm QCX216 LTE Cat1 bis IoT-optimized modem integrates WiFi-based terrestrial positioning

Qualcomm QCX216 is a new IoT-optimized LTE Cat1 bis modem with a data rate of up to 10 Mbps at ultra-low power and support for WiFi-based terrestrial positioning thanks to the company’s database of billions of geolocated beacons. LTE Cat1 bis is an update to LTE Cat1 that does not require software and hardware upgrades to the base stations, enables smaller, simpler, and cheaper designs with a single antenna, and delivers higher speeds than LTE Cat M1 typically used in IoT applications. Qualcomm QCX216 LTE IoT modem will be used in smart utility meters, trackers, e-mobility solutions, parking meters, home automation and security equipment, and other location-based solutions. Qualcomm QCX216 specifications: SoC – Qualcomm 216 LTE IoT modem with dual-core Cortex-M3 @ 204 MHz, cellular modem-RF Wireless Cellular Peak Download Speed: 10 Mbps Peak Upload Speed: 5 Mbps Cellular Technology: Rel.14 LTE, Global LTE Cat 1bis Multi SIM: Dual SIM/eSIM […]

Linux 6.1 LTS release – Main changes, Arm, RISC-V and MIPS architectures

Linus Torvalds announced the release of Linux 6.1, likely to be an LTS kernel, last Sunday: So here we are, a week late, but last week was nice and slow, and I’m much happier about the state of 6.1 than I was a couple of weeks ago when things didn’t seem to be slowing down. Of course, that means that now we have the merge window from hell, just before the holidays, with me having some pre-holiday travel coming up too. So while delaying things for a week was the right thing to do, it does make the timing for the 6.2 merge window awkward. That said, I’m happy to report that people seem to have taken that to heart, and I already have two dozen pull requests pending for tomorrow in my inbox. And hopefully I’ll get another batch overnight, so that I can try to really get as […]

Qualcomm Snapdragon 8 Gen 2 SoC gets upstream Linux support

Qualcomm unveiled the Snapdragon 8 Gen 2 mobile platform just a few days ago, but Linaro has just announced that Linux was already upstreamed to the premium mobile SoC featuring a 3.2 GHz Arm Cortex-X3 “Prime” core, four performance cores at up to 2.8 GHz, and three Efficiency cores clocked at up to 2.0 GHz. Most of the work was done by Linaro Engineers Abel Vesa and Neil Armstrong with initial support posted on November 16th on the Linux kernel mailing list, and with the set of patches released so far, it is even possible to boot a minimal AOSP image on a Snapdragon 8 Gen 2 development kit shown below which should be manufactured by Lantronix, if history is any guide. The following features are enabled in mainline Linux for the Qualcomm 8 Gen 2 processor, codenamed SM8550: Qualcomm Kryo CPUs with DVFS and Power Control support System – […]

$600 Windows Dev Kit 2023 is powered by Qualcomm Snapdragon 8cx Gen 3 processor

Microsoft has just introduced the Windows Dev Kit 2023, that’s basically a Windows 11 Arm mini PC powered by a Qualcomm Snapdragon 8cx Gen 3 processor designed for developers of Windows programs. Previously known as “Project Volterra”, the system comes with 32GB RAM, 512GB NVMe storage, mini DP video output, Ethernet, WiFi 6, and Bluetooth 5.1 connectivity, as well as five USB 3.2 Gen 2 ports, and more. Windows Dev Kit 2023 specifications: SoC – Qualcomm Snapdragon 8cx Gen 3 compute platform with CPU – 4x 3.0 GHz Prime cores, 4x 2.4 GHz Efficiency Cores GPU – Unnamed Adreno GPU with DirectX 12 (DX12) API support DSP – Qualcomm Hexagon Processor, Qualcomm Sensing Hub AI – Qualcomm Neural Processing Engine SDK support for AI (up to 29+ TOPS) System Memory – 32GB LPDDR4x RAM Storage – 512GB NVMe SSD Video Output – Mini DisplayPort (mini DP) with support for HBR2 […]

Android 13 is already working on Qualcomm Robotics RB3 and RB5 platforms

Qualcomm Robotics RB3 (aka DragonBoard 845c) and Robotics RB5 boards can already support Android 13, just a few days after the source code was pushed to AOSP (Android Open Source Project). Once upon a time (i.e. a few years ago), it would have taken weeks, and more likely months, to port the latest version of Android (AOSP) to a specific single board computer. But thanks to initiatives such as Project Treble, Android reference boards such as DragonBoard 845c (RB3), HiKey 960, Khadas VIM3, and Qualcomm Robotics Board RB5 can now get the latest version of Android up and running in a matter of days. Android 13 was released on August 15, and Linaro wrote about RB3 and RB5 support on August 18, and while Linaro engineers collaborated with Google engineers before the AOSP, it is still an impressive feat. Amit Pundir, Linaro Engineer, explains how this was made possible: Over […]