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Posted on by Debashis Das - No Comments on Upgraded FGH200M Wi-Fi HaLow module features Morse Micro MM8108 SoC, handles up to 8,191 IoT devices

Upgraded FGH200M Wi-Fi HaLow module features Morse Micro MM8108 SoC, handles up to 8,191 IoT devices

Quectel Wi Fi HaLow FGH200M

Introduced at MWC 2026, Quectel FGH200M Wi-Fi HaLow module, based on Morse Micro MM8108 SoC, is an upgraded version of the previous MM6108-based FGH100M module designed for long-range, low-power IoT connectivity. It operates in the sub-1-GHz band (850–950 MHz), with a range of up to 1 km, and is designed for applications such as smart homes, industrial automation, smart agriculture, smart cities, building automation, warehouses, campuses, and large-area IoT networks. The module operates on 1/2/4/8 MHz channels, with a maximum physical data rate of 43.3 Mbps and a transmit power of 26 dBm, allowing a single access point to theoretically connect up to 8,191 IoT devices. It connects to the host through USB 2.0, SDIO 2.0, or SPI interfaces. The ultra-compact (11.0 × 10.0 × 2.0 mm) LGA package operates in industrial environments with a temperature range of –40°C to +85°C. Quectel FGH200M Specifications: SoC – Morse Micro MM8108 32-bit […]

Posted on by Debashis Das - No Comments on Quectel RM255C mid-tier 5G RedCap M.2 and LGA modules support LTE Cat 4 fallback, multi-constellation GNSS

Quectel RM255C mid-tier 5G RedCap M.2 and LGA modules support LTE Cat 4 fallback, multi-constellation GNSS

Quectel RG255C NA (Left) and RM255C GL (Right) mid tier 5G RedCap GPP release 17 modules

Quectel has just announced two new 5G RedCap modules, the RM255C-GL (Global, M.2) and RG255C-NA (North America, LGA), both of which are 3GPP Release 17-compliant 5G RedCap (Reduced Capability) modules designed to bridge the gap between LTE Cat 4/6 and full-featured 5G. Both the modules support 5G Sub-6GHz SA with LTE Cat 4 fallback, peak data rates of up to 223 Mbps downlink and 123 Mbps uplink, and backward compatibility with Rel-15/16 networks. Additionally, the modules support optional multi-constellation GNSS via Qualcomm IZat Gen 9VT technology along with various interfaces such as USB 2.0 and PCIe 2.0 (plus UART, SPI, I2C, SGMII, PCM on the RG255C-NA). Both support dual SIM, DFOTA, and embedded protocol stacks, and are suitable for industrial IoT, smart grids, video surveillance, mobile hotspots, wearables, and other medium-speed applications. Quectel RM255C-GL and RG255C-NA specifications: Connectivity 5G NR – 3GPP Release 17 RedCap (Reduced Capability) Sub-6 GHz Standalone (SA) […]

Posted on by Debashis Das - 3 Comments on Open Stack standalone 4G LTE IoT board runs RTOS on Quectel EC200U LTE module (Crowdfunding)

Open Stack standalone 4G LTE IoT board runs RTOS on Quectel EC200U LTE module (Crowdfunding)

Open Stack — Standalone 4G LTE IoT & Connectivity Module

Open Stack is a standalone 4G LTE IoT connectivity board designed to run RTOS-based C applications directly on the Quectel EC200U series LTE module, meaning you don’t need an external MCU like Arduino, ESP32, or Raspberry Pi. By removing the MCU, the board reduces power consumption, bill-of-materials (BOM) cost, and physical footprint. The board supports multi-band LTE with GSM fallback, GNSS, and Bluetooth 4.2, as well as IPv4/IPv6 client and server modes. It also includes a USB Type-C port, a Nano SIM card slot, LTE/GNSS/BLE antenna connectors, an OLED information display, status LEDs, control buttons, and a 40-pin Raspberry Pi HAT-compatible GPIO header. Networking support includes TCP/UDP, SSL/TLS, HTTP/HTTPS, MQTT, LwM2M, CoAP, FTP/FTPS, and PPP, making it suitable for asset tracking, industrial monitoring, BLE-to-LTE gateways, remote infrastructure, and always-connected IoT deployments without additional controller hardware. Open Stack specifications: Cellular Module – Quectel EC200U-CN series (EC200UCNAA-N05-SGNSA) module Cellular Connectivity: LTE FDD […]

Posted on by Debashis Das - No Comments on Quectel SRG091X and SRG093X NXP i.MX 9 industrial AIoT modules integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

Quectel SRG091X and SRG093X NXP i.MX 9 industrial AIoT modules integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios

Quectel SRG091X and SRG093X NXP i.MX Smart AIoT module

After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT modules based on NXP’s i.MX 9 series SoCs. The module integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 radios through the IW610G chipset, so it can simply be dropped into a PCB to create a fully compliant Matter Border Router without any RF design or coexistence concerns. While both modules share the same 46 x 41.5 mm form factor and wireless capabilities, they are different in terms of  CPU power as the SRG091X is an entry-level solution built around a single-core NXP i.MX 91 processor, while the SRG093X features dual-core NXP i.MX 93 SoC, which includes a Cortex-M33 real-time core and a neural processing unit (NPU) for edge AI workloads. The module supports LPDDR4/LPDDR4X memory, eMMC storage, and various I/O options, including dual Gigabit Ethernet, USB 2.0, CAN-FD, SPI, UART, I²C/I³C, ADC, […]

Posted on by Debashis Das - No Comments on Quectel SP895BD-AP AIoT module features Qualcomm Dragonwing Q-8750 SoC with 80 TOPS NPU

Quectel SP895BD-AP AIoT module features Qualcomm Dragonwing Q-8750 SoC with 80 TOPS NPU

Quectel SP895BD AP Smart IoT Module

Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the SP895BD-AP smart AIoT module based on the Dragonwing Q-8750. It is designed for high-performance IoT applications, including video conferencing, 8K computing power boards, and smart retail terminals, running on Android 15 or Linux. Earlier in November, we saw Qualcomm introduce the Dragonwing IQ-X series of SoCs for industrial PCs running Windows. The Q-8750 in the Quectel SP895BD-AP seems to be a variant of the high-end version, with an 8-core Oryon CPU (up to 2x 4.32 GHz + 6x 3.53 GHz) and an Adreno Series 8 GPU. It supports 8K video encoding and decoding with three ISPs for up to 3×48MP camera inputs, or a single camera input of 108MP. The module comes in a compact LGA package and supports standard interfaces like MIPI DSI/CSI, PCIe, USB, I2S, UART, I²C, […]

Posted on by Debashis Das - 3 Comments on Low-cost LG290P quad-band GNSS RTK breakout board supports RTC battery for faster TTFF

Low-cost LG290P quad-band GNSS RTK breakout board supports RTC battery for faster TTFF

Waveshare LG290P low cost quad band GNSS RTK module

Waveshare has launched a low-cost LG290P breakout board priced at about half the competing options. It supports L1/L2/L5/E6 quad-band GNSS with centimeter-level RTK positioning for robotics, surveying, precision agriculture, and other high-accuracy applications. The board supports GPS, BDS, Galileo, GLONASS, QZSS, and NavIC reception, along with SBAS systems such as WAAS, EGNOS, MSAS, BDSBAS, GAGAN, and SDCM. It offers RTK rover/base functionality with <5-second convergence, raw observation output, 10–20 Hz navigation rates, and strong anti-interference performance thanks to its integrated narrow-band jamming detection and cancellation. The module features a USB-C port for power and UART-to-USB communication, castellated pads for easy integration, an RTC battery connector for faster TTFF, and onboard status LEDs. Waveshare LG290P breakout board specifications: GNSS module – Quectel LG290P GNSS Frequency bands GPS – L1 C/A, L1C, L5, L2C GLONASS – L1, L2 Galileo – E1, E5a, E5b, E6 BDS – B1I, B1C, B2a, B2b, B2I, B3I QZSS […]

Posted on by Debashis Das - No Comments on Quectel QSM560DR industrial Qualcomm QCM6490/QCS6490 SBC supports Ubuntu, Android, and Windows

Quectel QSM560DR industrial Qualcomm QCM6490/QCS6490 SBC supports Ubuntu, Android, and Windows

Quectel QSM560DR Development Board

The Quectel QSM560DR is a Qualcomm QCM6490/QCS6490-based industrial Edge AI SBC with an octa-core processor, a 12 TOPS NPU, up to 8GB LPDDR4X RAM, and UFS storage. It offers 5G, WiFi 6E, Bluetooth 5.2, and GNSS, plus dual Gigabit Ethernet, four USB 3.0 ports, and HDMI and eDP display outputs. The board also includes three MIPI CSI camera connectors, a microSD card slot, GPIOs, RS232/RS485, CAN bus, audio output, and an M.2 connector for expansion. These features make it suitable for robotics, smart retail systems, industrial control panels, and other high-performance edge AI systems. Quectel QSM560DR specifications: SoC – Qualcomm QCS6490(WF variant) / QCM6490 (CN variant) CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES […]

Posted on by Debashis Das - No Comments on Quectel KCMCA6S industrial wM-bus modules target smart metering

Quectel KCMCA6S industrial wM-bus modules target smart metering

cnx KCMCA6S series sub GHz Wireless M Bus (WM Bus) modules

Quectel’s KCMCA6S is a series of industrial wireless M-Bus (wM-Bus) modules built around Silicon Labs’ EFR32FG23 chipset. The modules operate in the 868 MHz, 169 MHz, and 433 MHz bands and support the EN13757-4 wM-Bus standard for smart metering and AMI (Advanced Metering Infrastructure) applications. The device features an Arm Cortex-M33 processor, 32 KB of SRAM, 256 KB of flash, and a Sub-GHz transceiver. It supports multiple wM-Bus modes (T, C, S, R, N, F), with dynamic multi-mode switching, flexible frequency configuration, and low-power operation alongside multi-layer security mechanisms. Interfaces include USART, SWD, and GPIOs, with optional EUSART, I²C, and ADC through pin multiplexing. Available in two variants (with or without SAW filter), the module comes in a compact 25.4 × 14.0 × 2.9 mm LCC package for water, electricity, gas, and heat metering systems. Quectel KCMCA6S specifications: MCU- Silicon Labs EFR32FG23 Core – Arm Cortex-M33 core, up to 78 […]