NVIDIA Jetson AGX Orin 32GB production module is now available

NVIDIA Jetson AGX Orin 32GB Module

NVIDIA Jetson AGX Orin 32GB production module is now in mass production and available, after the 12-core Cortex-A78E system-on-module was first announced in November 2021, and the Jetson AGX Orin developer kit was launched last March for close to $2,000. Capable of up to 200 TOPS of AI inference performance, or up to 6 times faster than the Jetson AGX, the NVIDIA Jetson AGX Orin 32GB can be used for AI, IoT, embedded, and robotics deployments, and NVIDIA says nearly three dozen partners are offering commercially available products based on the new module. Here’s a reminder of NVIDIA Jetson AGX Orin 32GB specifications: CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ 1 GHz DL Accelerator – 2x NVDLA v2.0 Vision Accelerator – PVA v2.0 (Programmable Vision […]

Compact3566 – A Rockchip RK3566 SBC that closely follows Raspberry Pi 3 form factor

We’ve very recently written about Geniatech XPI-3566 SBC powered by Rockchip RK3566 CPU that somewhat follows the Raspberry Pi 3 Model B form factor. Boardcon Compact3566 offers similar features, but it appears to keep exactly the same port assignment as the Raspberry Pi SBC, so it should be compatible with more accessories. The Compact3566 SBC ships with up to 8GB LPDDR4 and 128GB eMMC flash, features Gigabit Ethernet & WiFi 5, four USB 3.0/2.0 ports,  HDMI 2.0 output, MIPI DSI and CSI interfaces, the 40-pin GPIO header, as well as extra built-in features such as an M.2 socket for storage, RTC with battery, and a built-in microphone. Compact3566 specifications: SoC – Rockchip RK3566 quad-core Arm Cortex-A55 @ up to 1.8 GHz with ARM Mali-G52 2EE GPU with support for OpenGL ES 1.1/2.0/3.2. OpenCL 2.0. Vulkan 1.1, 0.8 TOPS NPU System Memory – 2GB, 4GB, or 8GB LPDDR4/LPDDR4X Storage 8GB, 16GB, […]

Business card-sized SBC ships with Intel Core Tiger Lake or AMD Ryzen V2000 processor

We’ve already written about the UP 4000 SBC as a more powerful x86 alternative to Raspberry Pi 4, but if it still does not cut it, AAEON de next-TGU8 or de next-V2K8 should as the business card-sized single board computers are equipped with respectively an Intel Tiger Lake processor up to a Core i7-1185G7E, or and AMD Ryzen Embedded V2000 SoC up to Ryzen Embedded V2516. But the comparison stops at the size, as both SBCs offer sets of features different from the usual Raspberry Pi form factor with notably up to 16GB RAM, SATA and NVMe storage, dual Ethernet (1x 2.5GbE, 1x Gigabit Ethernet), dual 4K display output via HDMI and eDP, some USB 3.2 ports, as well as serial and I/O interfaces via headers. de next-TGU8/V2K8 SBC specifications: SoC de next-TGU8 Intel Core i7-1185G7E quad-core/octa-thread processor @ 1.80GHz / 4.40GHz with Intel UHD graphics; TDP: 15W (TPD up: […]

ASRock Industrial iEPF-9010S/iEP-9010E Edge AIoT platforms feature Alder Lake S CPU, up to 128GB RAM

ASRock Industrial has released the iEPF-9010S and iEP-9010E high-end, rugged Edge AIoT platforms powered by 12th Gen Intel Alder Lake S processors, equipped with up to 128GB RAM, 4G LTE, 5G, Wi-Fi 6E, Bluetooth 5.2 connectivity, and real-time TSN/TCC networking. The I/O rich embedded computers are designed for highly demanding workloads and mission-critical industrial applications such as factory automation, machine automation, robotic control, AI-enabled AOI (automated optical inspection), autonomous vehicles, smart cities, and more. The ASRock iEPF-9010S Expandable AIoT Edge platforms come with the following specifications: SoC – Intel 12th Gen Core, Pentium or Celeron “Alder Lake S” hybrid processor with up to 16 cores and 24 threads, Intel Xe or UHD Graphics fitting in an LGA 1700 socket Chipset iEPF-9010S-EY4 model – Intel R680E iEPF-9012S-EY4 model – Intel H610 System Memory iEPF-9010S-EY4 model – 4x 260-pin SO-DIMM DDR4 3200MHz up to 128GB (32 GB per SO-DIMM) iEPF-9012S-EY4 model – […]

UP 4000 SBC is a Raspberry Pi lookalike with an Intel Apollo Lake processor

AAEON has unveiled the UP 4000 single board computer with a form factor and ports arrangement similar to Raspberry Pi 2/3, but powered by a choice of x86 processors, namely the Intel Atom E3900 series, Celeron N3350, or Pentium N4200 all parts of the Apollo Lake family. The first UP Board was introduced in 2015 as a device offering an x86 alternative to the Raspberry Pi 2 with an Intel Atom x5-Z8300/Z8350 “Cherry Trail” processor, but later “UP bridge the gap” boards from the company used larger “Squared” (85.6 x 90 mm) or “Xtreme” (122 x 120 mm) form factors. The UP 4000 SBC brings us back to the original business card form factor but with a boost in performance and various specifications improvements. UP 4000 vs UP Board specifications   AAEON says the new board is able to deliver 30% faster CPU performance and twice the 3D graphics performance […]

MaaXBoard 8ULP SBC leverages NXP i.MX 8ULP Cortex-A35/M33 SoC for Edge audio and HMI applications

Avnet MaaxBoard 8ULP will be one of the first single board computers (SBC) based on the new NXP i.MX 8ULP Cortex-A35/M33 processor designed for Edge audio and HMI applications, and featuring NXP’s EdgeLock for device-to-cloud security. The board will come with 2GB RAM, 32GB eMMC flash, a MIPI DSI display connector, a MIPI CSI camera connector, Fast Ethernet and WiFi 5 connectivity, a digital microphone, and a 3.5mm stereo audio jack, and provide expansion capabilities via a 40-pin header for Raspberry Pi HATs and a 16-pin Shuttle Click header for MikroE Click add-on boards. MaaXBoard 8ULP SBC specifications: SoC – NXP i.MX 8ULP processor with 2x Arm Cortex-A35 core @ 1.0 GHz, 1x Arm Cortex-M33 real-time core @ 216 MHz, 1x HiFi 4 audio DSP @ 600 MHz, 1x Fusion DSP @ 200 MHz for low-power voice and sensor hub processing, as well as 2D and 3D GPUs and 768 […]

Hybrid Time-of-Flight (ToF) 3D range image sensor offers up to 30-meter range

We’ve written about STMicro Time-of-Flight ranging sensors several times over the year, including the latest VL53L8 which offers a range of up to 4 meters. But if your application would benefit from a more extended range, Toppan and Brookman Technology have designed a three-dimensional range image sensor (3D sensor) capable of measuring distances from one to 30 meters. using a hybrid Time-of-Flight (ToF) method. That method, proposed by Professor Shoji Kawahito of Shizuoka University, is a new sensing technology combining the indirect ToF method of measuring distance by phase difference and the direct ToF methodology for measurement based on time differences. The hybrid method is said to be more tolerant to ambient light noise than the conventional indirect ToF method, especially outdoors. Highlights of the hybrid ToF sensor: Measurement of distances up to 30 meters, or over 5x further than conventional models Noise-canceling function to facilitate outdoor measurement. Each pixel […]

MediaTek Genio 1200 Linux system-on-module powers Cortex-A78/A55 AIoT development kit

ADLINK Technology has just unveiled the SMARC 2.1 compliant LEC-MTK-I12000 system-on-module (SoM) powered by MediaTek Genio 1200 octa-core Cortex-A78/A55 AIoT processor coupled with up to 8GB RAM and 256GB UFS storage, as well as the I-Pi SMARC 1200 development kit designed for robotics and AIoT applications. LEC-MTK-I1200 MediaTek Genio 1200 system-on-module LEC-MTK-I1200 SoM specifications: SoC – MediaTek Genio 1200 (MT8395) octa-core processor with 4x Cortex-A78 cores @ 2.2GHz, 4x Cortex-A55 cores @ 2.0GHz with penta-core Arm Mali-G57 GPU @ 880MHz with support for OpenGL ES 3.2/2.0/1.1, Vulkan 1.1/1.0, OpenCL 2.2, 4.8 TOPS NPU, HiFi 4 audio DSP, etc… System Memory – 4 or 8 GB LPDDR4X Storage – 32, 64, 128, or 256 GB UFS storage, compatible with UFS gear 2.1 Wireless – 802.11b/g/n/ac WiFi 5 2×2 MU-MIMO, Bluetooth 5.0 314-pin MXM connector with Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display HDMI 2.0b […]