ryzen News - Page 3 of 17 - CNX Software

February 21, 2026March 5, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

CHUWI CoreBook Air Plus 16 review – Part 2: An AMD Ryzen 5 6600H-powered, mid-range laptop tested with Windows 11 Pro

CHUWI CoreBook Air Plus 16 laptop review Windows 11

I’ve already checked out the hardware of the CHUWI CoreBook Air Plus 16 laptop in the first part of the review, so today, I’ll report my experience using the AMD Ryzen 5 6600H laptop with the pre-installed Windows 11 Pro operating system. We’ll start with a software overview and a test of key features, followed by benchmarking, evaluation of WiFi 6 performance, and measurement of fan noise, power consumption, and battery life. Software Overview and Features Testing The CoreBook Air Plus 16 ships with Windows 11 Pro 64-bit 24H2 operating system, upgraded to the 25H2 version after running Windows updates. The System->About window confirms we have a CoreBook Air Plus laptop powered by a 3.3 GHz (base frequency) AMD Ryzen 5 6600H processor with Radeon graphics paired with 16GB of RAM and 447GB of storage. None of the mini PCs and laptops we’ve reviewed in the past come with Microsoft […]

February 19, 2026March 16, 2026 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Review of GEEKOM A5 Pro 2026 Edition (AMD Ryzen 5 7530U) mini PC – Part 1: specifications, unboxing, and teardown

GEEKOM A5 Pro 2026 Edition mini PC review

We’ve just received a sample of the GEEKOM A5 Pro 2026 Edition mid-range mini PC for review. It’s powered by an AMD Ryzen 5 7530U 6-core/12-thread processor clocked at up to 4.5GHz, and equipped with 16GB dual-channel DDR4-3200MHz SODIMM memory and a 1TB NVMe SSD. The Windows 11 Pro computer features two 4K-capable HDMI 2.0 ports, two USB-C ports with DisplayPort Alt mode, a 2.5GbE RJ45 jack, a Wi-Fi 6 and Bluetooth 5.2 module, a full-size SD card reader, and a few USB 32/2.0 Type-A ports. In the first part of the review, we’ll go through the specifications, an unboxing, and a teardown of the GEEKOM A5 Pro 2026 Edition mini PC, before booting it into Windows 11 Pro to make sure it’s working fine. In the next two parts of the review, we’ll then report our experience with Windows 11 Pro and an early Ubuntu 26.04 image with detailed […]

February 12, 2026March 5, 2026 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

CHUWI CoreBook Air Plus 16 laptop review – Part 1: Specs, unboxing, teardown, and first boot

It’s been a while since we’ve tested a laptop, but CHUWI sent us their latest CoreBook AirPlay 16 laptop for review. It’s powered by a mid-range AMD Ryzen 5 6600H hexa-core processor, paired with 16GB of LPDDR5 and a 512GB NVMe SSD, and features a 16-inch display with 1920 × 1200 resolution. I’ll start the CoreBook Air Plus 16 review by listing the specifications, going through an unboxing and a teardown to check out the hardware, and finally boot it to the pre-installed Windows 11 Pro. We’ll then test it in more detail with Windows 11 Pro and Ubuntu 24.04 or 26.04 (Snapshot 4) in the next parts of the review. CHUWI CoreBook Air Plus 16 specifications SoC – AMD Ryzen 5 6600H CPU – 6-core/12-thread Zen 3+ “Rembrandt” processor at up to 3.3 GHz / 4.5GHz (Turbo) GPU – AMD Radeon 660M clocked at up to 1,900 MHz with […]

January 28, 2026 by Debashis Das - No Comments

Congatec conga-TCRP1 COM Express Type 6 module features AMD Ryzen AI Embedded P100 SoC with 50 TOPS NPU

conga TCRP1 COM Express Compact (Type 6) module with AMD Ryzen AI Embedded P100 Series SoCs

Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 Series processors, which feature AMD’s latest Zen 5 architecture, RDNA 3.5 graphics, and an XDNA 2 NPU for 59 TOPS of combined AI performance, including up to 50 TOPS from the NPU. The module supports up to 96 GB of DDR5-5600 memory and is available in 4-core and 6-core variants with a configurable 15 W to 54 W TDP, allowing both passive and active cooling designs. It supports up to four independent displays, offers PCIe Gen4 and PEG x4 expansion, and includes 2.5 GbE, USB 3.2 Gen 2, and USB 2.0 ports, along with SATA or optional onboard NVMe storage options. Additional features include TPM 2.0, UEFI firmware, and hardware monitoring. The module is available in both commercial and industrial variants with operating temperatures down to -40 °C, which […]

January 19, 2026January 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Bedrock RAI300 fanless industrial PC is powered by an AMD Ryzen AI 9 HX 370 mobile AI SoC

SolidRun Bedrock RAI300 is the first industrial PC powered by a 12-core/24-thread AMD Ryzen AI 9 HX 370 mobile processor, typically used in premium consumer and commercial AI laptops. The fanless industrial computer supports up to 128GB DDR5 SO-DIMM memory to run AI models on the 50 TOPS NPU (80 TOPS combined) of the AMD processor, up to three M.2 NVMe 2280 PCIe Gen4 x4 storage devices, up to four display through HDMI 2.1 and DP 2.1 video outputs, and features up to four 2.5 Gbps Ethernet ports, a USB4 port, four USB 3.2 ports, and more. It’s available in two models: a thin “Tile” model and a thicker “60W model” to cater to different TDP configurations, ranging from 8W to 54W, and cooling options. Bedrock RAI300 specifications: SoC – AMD Ryzen AI 9 HX 370 “Strix Point” CPU – 12-core/24-thread processor with four Zen 5 cores up to 2.0/5.1 […]

January 11, 2026 by Debashis Das - 1 Comment

AMD Embedded+ mini-ITX Board features Ryzen AI Embedded P132 CPU, Versal AI Edge Gen2 VE3558 SoC FPGA

SAPPHIRE EDGE+ VPR 7P132, a Mini ITX AMD Embedded+

At CES 2026, Sapphire Technology introduced the EDGE+VPR-7P132, an “AMD Embedded+” Mini-ITX motherboard built around AMD’s newly announced Ryzen AI Embedded P100 series of SoCs, namely the hexa-core Ryzen P132 (V4526iX) CPU, and an AMD Versal AI Edge Gen 2 VE3558 SoC FPGA, which features octa-core Arm Cortex-A78AE + ten Cortex-R52 real-time cores beyond FPGA fabric. It’s the first AMD Ryzen AI Embedded motherboard we’ve seen. It represents a massive update from last year’s Edge+ VPR-5050 motherboard, which relied on Zen 2-based Ryzen Embedded V2000 series and first-generation Versal silicon. The new VPR-7P132 skips multiple generations, jumping straight to Zen 5 CPU cores and RDNA 3.5 graphics, with an upgraded Versal Gen 2 adaptive Edge AI SoC for real-time inference, along with faster LPDDR5 (4266MHz) memory and 40 Gbps USB4 connectivity. SapphireTech EDGE+ VPR-7P132-MB specifications: AMD Embedded+ Architecture Adaptive SoC Subsystem Adaptive SoC – AMD Versal AI Edge Gen 2 […]

December 10, 2025December 11, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

AMD Ryzen Embedded 8840U COM Express Type 6 Compact module takes up to 128GB DDR5

SolidRun Ryzen R8000 COM6 Compact Module

SolidRun has unveiled a new COM Express Type 6 Compact module powered by the AMD Ryzen Embedded 8840U Series with up to 39 TOPS of AI performance for industrial, medical, automation, and edge AI applications. The module supports up to 128GB DDR5 of memory via two SO-DIMM sockets, on-module M.2 NVME SSD storage, and features an Intel i226 2.5GbE controller. It exposes I/Os through standard board-to-board connectors, including 16-lane PCIe Gen4, four DisplayPort video outputs, eDP or LVDS display interface, two SATA, various USB ports, and more. Ryzen R8000 CoM6 specifications: SoC – AMD Ryzen Embedded 8840U CPU – 8-core/16-thread Zen4 processor up to 3.3 GHz / 5.1 GHz (Turbo) GPU – AMD Radeon 780M with 12x Compute Units @ 2700 MHz (RDNA3 graphics) AI 16 TOPS NPU (AMD XDNA) Total combined 39 TOPS of AI performance Memory – 2x SODIMM DDR5-5600 with/without ECC up to 128GB RAM Storage – […]

July 18, 2025July 18, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

cExpress-R8 COM Express Type 6 Compact module features up to Ryzen Embedded 8845HS SoC, supports up to 96GB DDR5

AMD Ryzen Embedded 8000 COM Express Type 6 Module

ADLINK cExpress-R8 is a COM Express Type 6 Compact CPU module powered by a choice of AMD Ryzen Embedded 8000 SoCs, up to the 8-core Ryzen Embedded 8845HS SKU with up to 39 TOPS of AI performance, support for up to 96GB of DDR5 (ECC or non-ECC) memory, and optional NVMe SSD BGA storage. The module also features an Intel i226 2.5GbE controller, a SEMA board controller, and a debug connector, and exposes all I/Os through two standard 220-pin COM Express board-to-board connectors with four SATA III, up to 16x PCIe Gen4 lanes, DDI, LVDS, and/or eDP interface for up to four displays, and more. cExpress-R8 specifications: Hawk Point SoC (one or the other) AMD Ryzen Embedded 8845HS octa-core processor up to 5.1GHz with 6 WG (WorkGroup) AMD Radeon RDNA 3 Graphics Core; TDP: 35-54W AMD Ryzen Embedded 8840U octa-core processor up to 5.1GHz with 6 WG AMD Radeon RDNA […]