Single Board Computer News - Page 47 of 86 - CNX Software

February 10, 2021February 10, 2021 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Ready! Model 100 is a retro computer shell for Raspberry Pi, SBCs, Nano/Pico-ITX boards (Crowdfunding)

Ready Model 100 Raspberry Pi SBC Computer Shell

We recently wrote about Devterm, a modular, retro-looking portable computer that looks like a typewriter with an extra-wide display, and takes Raspberry Pi CM3-series modules, or other compatible modules made by Clockwork based on Rockchip RK3399 or Allwinner H6. If you’re into this kind of device, but would like to use your own Raspberry Pi, another SBC, an Intel NUC motherboard, a Nano/Pico-ITX board, or even your smartphone, Ready! Model 100 single board computer expansion system may be worth looking into. Ready! Model 100 key features and specifications: Compatibility – Accommodates any hardware using 5V or 12V power input including smartphones, or arm or x86 SBCs such as Raspberry Pi 4, and compact motherboard following NUC, 4×4, 5×5, or Nano/Pico ITX form factors. Storage – Space for SSD Display – 8.8-inch 1920×480 “3xVGA” HDMI Touchscreen Video Output – HDMI (if dual HDMI supported on SBC) Audio – 10W stereo speaker […]

February 10, 2021February 10, 2021 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Geniatech RK3568 Development Board to support Android 11 and Linux

RK3566 and RK3568 are the latest AIoT processors from Rockchip equipped with four Arm Cortex-A55 cores, a Mali-G52 GPU, and an impressive range of peripherals that make them suitable for all sorts of applications including AI edge computing and network video recorder (NVR). We already know Pine64 is working on Quartz64 SBC based on Rockchip RK3566, but I’ve just noticed Geniatech’s “RK3568 development board” that should offer even more features since the processor comes with extra I/Os compared to its little brother. Let’s have a look. Geniatech RK3568 development board specifications: SoC – Rockchip RK3568 quad-core Cortex-A55 processor up to 2.0 GHz with Arm Mali-G52 GPU supporting OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, 0.8 TOPS NPU for AI acceleration System Memory – Up to 4 GB LPDDR4 Storage – Up to 128 GB eMMC 5.1 flash, 1x SATA 3.0 port, MicroSD card slot, M.2 socket for NVMe SSD (See […]

February 5, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

PICO-PI-IMX7 NXP i.MX7 SBC offered for under $20 (Promo)

TechNexion PICO-Pi-IMX7 single board computer was introduced a few years ago with an NXP i.MX 7Solo or 7Dual Cortex-A7 Intel Edison compatible CPU module, in a form factor similar to Raspberry Pi 3, and supported by Android Things that was still a thing at the time… It looks like Arrow Electronics is trying to get rid of some stock, as the company is selling the Amazon version of the PICO-PI-IMX7 board for $19.58 including free shipping for ArrowPerks members, instead of the usual $120+ price tag. We had written about the PICO-iMX6 module and PICO-PI-iMX8 SBC previously, but never about the i.MX7 version, nor the PICO-PI-IMX7 board, so let’s have a closer look at what the board has to offer. PICO-Pi-IMX7 specifications: PICO-iMX7 system-on-module SoC – NXP i.MX 7Dual dual-core Cortex-A7 processor @ 1 GHz with Cortex-M4 real-time core System Memory – 512MB DDR3L Storage – 4GB eMMC flash Connectivity […]

February 1, 2021February 2, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

FOSDEM 2021 Online February 6-7 – Hardware, Embedded & IoT talks

FOSDEM is an open-source developer event that takes place on the first week-end of February every year in Brussels, Belgium. Every year except this year, as due to COVID-19 restrictions, FOSDEM 2021 will take place online like most events these days. The schedule has been up for some time, and today I’ll look at some of the interesting talks mostly from the Embedded, Mobile and Automotive “virtual devroom” but also other tracks. Saturday, February 6, 2021 13:00 – 14:00 – From Reset Vector to Kernel – Navigating the ARM Matryoshka Long gone are the times of executing the OS in-place from memory-mapped flash upon reset. A modern SoC now comes with complex mask ROM firmware, with driver, filesystem, protocol and crypto support for loading… yet another bootloader. In his talk, Ahmad follows this chain of bootloaders until the kernel is started, stopping along the way for RAM setup, peripherial initialization, […]

January 30, 2021September 15, 2021 by Jean-Luc Aufranc (CNXSoft) - 19 Comments

Snapdragon 888 Mobile Hardware Development Kit ships with 12GB RAM, 256GB UFS storage

Snapdragon 888 is the latest premium mobile SoC from Qualcomm with the octa-core processor combining one Cortex-X1 core, three Cortex-A78 cores, and four low-power Cortex-A55 cores, with Adreno 660 GPU and Snapdragon X60 5G modem. The processor will likely most be found in smartphones, but Qualcomm partnered with Lantronix to launch the Snapdragon 888 Mobile Hardware Development Kit designed for Android app developers, hardware vendors, and original equipment manufacturers (OEMs). Snapdragon 888 development board specifications: SoC – Qualcomm Snapdragon 888 (SM8350) octa-core Qualcomm Kryo 680 CPU with 1x Cortex-X1 core @ 2.84 GHz, 3x Cortex-A78 cores @ 2.42 GHz, and 4x Cortex-A55 cores @ 1.80 GHz, Adreno 660 GPU with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, DX12, and up to 8K 360 VR video playback, Hexagon 780 DSP System Memory – 12GB LPDDR5 PoP memory Storage – 256GB UFS 3.0 flash, 1x MicroSD/UFS card Display HDMI […]

January 26, 2021January 26, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Rockchip RV1109 SBC’s provide access control solutions with optional 4G LTE connectivity

We’ve been writing about Rockchip RV1109 and RV1126 AI camera SoC’s in recent days, as well as evaluation boards and modules, plus some complete solutions such as Firefly dual-lens AI camera modules. Shenzhen-based JWIPC, a company specifically in embedded PCs and motherboards, has designed three SBC’s powered by Rockchip RV1109 processor especially designed for access control, leverage the face detection capabilities of the Rockchip processor. The three access control boards are: R19S – Standard 100x72mm Pico-ITX board with industrial grade materials, support for wide temperature, hardware watchdog, and “rich peripheral interface”. R19F- Same as R19S, but with a mini PCIe socket for a 4G LTE module, plus a SIM card slot R19N – Similar to R19S with a narrower 100x60mm design JWIPC R19 boards share most of the same hardware key features and specifications: SoC – Rockchip RV1109 dual-core Arm Cortex-A7 @ 1.5 GHz, plus RISC-V MCU @ 400 MHz, […]

January 25, 2021January 25, 2021 by Sponsored Post - Comments Off

Edge computing boards with new Intel Atom x6000E processors (Elkhart Lake) – Sponsored

A highly reliable performance boost for the edge The new Intel Atom® x6000E Series, Intel Celeron®, and Pentium® N & J processors (code name Elkhart Lake) impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores. congatec is now making these processors available on the 2.5-inch Pico-ITX form factor, leveraging their industrial quality for the most reliable performance boost possible. With growing digitization and the IoT trend, even the smallest edge computers are expected to meet high-reliability requirements today. Start-ups, makers, and spin-offs from big industrial companies increasingly deploy them in massively distributed applications to implement their new business models and IoT-supported services. They all face a similar challenge: Their apps are approaching market-readiness but their hardware platforms, which often originate from the maker board scene, lack reliability since they were not designed for large series and harsh environments. Industrial edge […]

January 22, 2021June 22, 2022 by Abhishek Jadhav - No Comments

Zora P1 Amlogic A311D Development Board interfaces with Orbbec 3D Cameras

We have already seen the powerful Amlogic A311D powered Khadas VIM3 SBC, and Orbbec announced the Zora P1 development board for Orbbec 3D cameras, supporting robotics, gaming, smart homes, etc. Some of the other products showcased at the CES 2021 by Orbbec include its first 3D sensor with time-of-flight (TOF) technology, the latest Astra+ camera, and a real-time industrial 3D camera. “Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence, and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder, and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.” Orbbec’s Zora P1 Development Board Zora P1 is a processing board for developers and enthusiasts to integrate 3D imaging and associated computing tasks for demanding industrial applications. Orbbec has specially designed this long-lasting solution to work with its 3D […]