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Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Credit card-sized industrial Allwinner T113-i SBC operates in the -40 to 85°C temperature range

Credit card-sized industrial Allwinner T113-i SBC operates in the -40 to 85°C temperature range

Allwinner T113-i SBC

Ebyte ECB30-P4T13IA5ME8G-I is a credit card-sized industrial-grade SBC powered by an Allwinner T113-i Cortex-A7 SoC with 512MB DDR3 RAM and 8GB flash, all part of the company’s ECK30-T13IA5ME8G-I  castellated system-on-module. The single board computer is also equipped with a microSD card slot, a gigabit Ethernet port, four USB 2.0 ports, a 3.5mm audio jack, a WiFi 4 module, and the usual 40-pin GPIO header that’s more or less compatible with the one found on Raspberry Pi SBCs. What’s different is the lack of HDMI output, and the board features an MIPI DSI connector instead. Ebyte ECB30-P4T13IA5ME8G-I specifications: System-on-Module – Ebyte ECK30-T13IA1GE8G-I SoC – Allwinner T113-i CPU Dual-core Arm Cortex-A7 clocked at up to 1.2 GHz 64-bit XuanTie C906 RISC-V real-time core DSP – HiFi4 VPU Video decoder – H.265 up to 4K @ 30 FPS, H.264 up to 4K @ 24 FPS, MPEG-1/2/4, JPEG, Xvid, Sorenson Spark up to 1080p60 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on VIA AI Transforma Model 1 – 3.5-inch fanless SBC features MediaTek Genio 700 AIoT SoC for Edge AI applications

VIA AI Transforma Model 1 – 3.5-inch fanless SBC features MediaTek Genio 700 AIoT SoC for Edge AI applications

VIA AI Transforma

VIA AI Transforma Model 1 is an edge AI platform powered by a MediaTek Genio 700 (MT8390) SoC with 4 TOPS of AI performance designed for industrial automation, smart cities, and more. The 3.5-inch fanless SBC is equipped with 8GB RAM and 16GB eMMC flash, and offers three display interfaces (HDMI, DP, MIPI DSI), a 4-lane MIPI CSI camera interface, gigabit Ethernet networking, M.2 sockets for wireless and cellular connectivity, several USB ports,  a 40-pin GPIO header, and more. VIA AI Transforma Model 1 specifications: SoC – MediaTek Genio 700 (MT8390) CPU – Octa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz, 6x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC3 GPU with support for OpenGL ES 1.1/2.0/3.2, OpenCL ES 2.2, and Vulkan 1.0/1.1 APIs VPU Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp75, AV1, VP9, HEVC, H.264 codecs supported […]

Posted on by Debashis Das - No Comments on Intel Atom x7000RE fanless industrial box PC offers 10-year life cycle for factory automation

Intel Atom x7000RE fanless industrial box PC offers 10-year life cycle for factory automation

AAEON BOXER 6617 ASL Rugged Box PC

AAEON BOXER-6617-ASL is a rugged and compact fanless industrial box PC built around the Intel Atom x7000RE series of SoCs. It is designed for harsh industrial environments and has a wide operating temperature range (-20°C to 70°C) and a guaranteed 10-year product lifecycle making it a reliable long-term solution for factory automation and other embedded applications. The rugged embedded system supports up to 32GB DDR5 memory, dual HDMI, dual 2.5GbE LAN ports, and extensive I/O including six serial ports, USB 3.2 and 2.0, DIO, and audio. Storage options include M.2 NVMe and 2.5″ SATA, with additional expansion through M.2 E-Key (Wi-Fi) and B-Key (5G/LTE) sockets. It also has a wide 9V–36V power input range, circuit protection, and strong shock/vibration resistance. The computer also features six RS-232/422/485 serial ports and DIO via DB9 connectors AAEON BOXER-6617-ASL Specifications: Amston Lake Series SoC options (one or the other) Intel Atom x7835RE octa-core processor […]

Posted on by Debashis Das - No Comments on Panasonic PAN B511-1C Bluetooth 6.0 and 802.15.4 module features castellated holes and LGA footprint

Panasonic PAN B511-1C Bluetooth 6.0 and 802.15.4 module features castellated holes and LGA footprint

Panasonic PAN B511 1C Bluetooth 6.0 and 802.15.4 module

Panasonic industry has recently introduced the PAN B511-1C Bluetooth 6.0 and 802.15.4 module based on the Nordic Semi nRF54L15 SoC and designed for ultra-low-power wireless communication. The compact module integrates a chip antenna, 32MBit flash memory, two Crystals, and the Nordic nRF54L51 which provides a 128 MHz Arm Cortex-M33 microcontroller with Bluetooth 6.0 (LE), Thread, Zigbee, and Matter, along with multiple peripherals such as SPI, UART, I2S, PWM, and ADC. The PAN B511-1C also implements security features to support secure boot, secure firmware updates, cryptographic acceleration, and tamper detection, making it suitable for a range of IoT, industrial automation, smart home, medical (wearables), and battery-powered applications. PAN B511-1C module specification: SoC – Nordic Semiconductor nRF54L15 MCU cores Arm Cortex-M33 with Arm TrustZone @ 128MHz RISC-V coprocessor for software-defined peripheral Memory – 256KB SRAM Storage – 1.5MB non-volatile memory Wireless Bluetooth 6.0 Data rates – 2Mbps, 1Mbps, 500kbps, 125kbps Features AoA / […]

Posted on by Debashis Das - No Comments on IMDT V2N Renesas RZ/V2N SoM powers Edge AI SBC with HDMI, MIPI DSI, dual GbE, WiFi 4, and more

IMDT V2N Renesas RZ/V2N SoM powers Edge AI SBC with HDMI, MIPI DSI, dual GbE, WiFi 4, and more

IMDT V2N low power AI SBC

IMD Technologies has recently introduced the IMDT V2N SoM based on the newly launched Renesas RZ/V2N low-power AI MPU and its SBC carrier board designed for robotics, smart cities, industrial automation, and IoT applications. The SoM ships with 8GB RAM and 32GB eMMC flash, and supports various interfaces through B2B connectors including two 4-lane MIPI CSI-2 interfaces, a MIPI DSI display interface, and more. The SBC supports MIPI DSI or HDMI video output, dual GbE, WiFi 4 and Bluetooth 5.2,  as well as expansion capabilities through M.2 sockets. IMDT V2N SBC specifications: IMDT V2N SoM SoC – Renesas RZ/V2N Application Processor – Quad-core Arm Cortex-A55 @ 1.8 GHz (0.9V) / 1.1 GHz (0.8V) L1 cache – 32KB I-cache (with parity) + 32KB D-cache (with ECC) per core L3 cache – 1MB (with ECC, max frequency 1.26 GHz) Neon, FPU, MMU, and cryptographic extension (for security models) Armv8-A architecture System Manager […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Kontron 3.5″-SBC-AML/ADN 3.5-inch Amston Lake/Alder Lake-N single board computer offers three DisplayPort video outputs

Kontron 3.5″-SBC-AML/ADN 3.5-inch Amston Lake/Alder Lake-N single board computer offers three DisplayPort video outputs

Kontron 3.5"-SBC-AML/ADN single board computer

Kontron 3.5″-SBC-AML/ADN is a 3.5-inch single board computer powered by either Intel Amston Lake (Industrial grade) or Alder Lake-N (commercial grade) processor and designed for applications such as automation, healthcare, smart city, and smart retail. It builds upon the smaller Kontron 2.5”-SBC-AML/ADN Pico-ITX SBC with many of the same features, but replaces eMMC flash storage with an M.2 SATA/NVMe socket and a SATA connector, features DDR5 SO-DIMM memory instead of soldered-on LPDDR5, and the larger PCB size allows it to gain an extra DisplayPort connector, a USB 2.0 Type-A port, additional serial ports, and a board-to-board (B2B) connector for expansion. It also supports a wider 9 to 36V DC range. Kontron 3.5″-SBC-AML/ADN specifications: SoC Standard Intel Atom x7211RE dual-core processor up to 3.2GHz with 6MB cache, 16EU Intel UHD graphics; TDP: 6W Intel Atom x7433RE quad-core processor up to 3.4GHz with 6MB cache, 32EU Intel UHD graphics; TDP: 9W Intel […]

Posted on by Debashis Das - No Comments on SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

Posted on by Debashis Das - 1 Comment on AAEON BOXER-8654AI-KIT – NVIDIA Jetson Orin NX-based Edge AI kit features four gigabit Ethernet ports with PoE support

AAEON BOXER-8654AI-KIT – NVIDIA Jetson Orin NX-based Edge AI kit features four gigabit Ethernet ports with PoE support

AAEON BOXER-8654AI-KIT Edge AI kit

The AAEON BOXER-8654AI-KIT Edge AI kit is a compact development kit built around the NVIDIA Jetson Orin NX modules with four gigabit Ethernet ports (with optional PoE) and an Out-of-Band (OOB) management header, and designed for applications like smart cities, IoT ecosystems, edge AI, and others. The multi-functional carrier board also offers six USB 3.2 Gen 2 ports, HDMI video output, two MIPI CSI, two DB-9 ports for RS-232/422/485 and CAN Bus, and a 40-pin NVIDIA Jetson-compatible GPIO header for I2C, SPI, and UART interfaces. Expansion options include M.2 E and B-key slots for Wi-Fi and 5G modules (with onboard SIM), an M.2 M-Key slot for NVMe SSDs, and a SATA connector. AAEON BOXER-8654AI-KIT specifications SoM – NVIDIA Jetson Orin NX module CPU 8GB Version – 6-core Arm Cortex-A78AE v8.2 64-bit CPU, 1.5MB L2 cache + 4MB L3 cache 16GB Version – 8-core Arm Cortex-A78AE v8.2 64-bit CPU, 2MB L2 […]

UP 7000 x86 SBC