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Posted on by Jean-Luc Aufranc (CNXSoft) - 7 Comments on Comet Q USB-C KVM device is made for smartphones, tablets, and laptops (Crowdfunding)

Comet Q USB-C KVM device is made for smartphones, tablets, and laptops (Crowdfunding)

GL.iNet Comet Q

GL.iNet Comet Q (GL-RMQ1) is a USB-C KVM device designed to remotely control smartphones, tablets, and laptops via a single USB Type-C cable and web browser. The hardware is based on a dual-core Arm processor paired with 512MB of RAM and a 512MB NAND flash, integrates a 1.8-inch touchscreen LCD for control and information display (e.g., IP address), a short USB-C cable to connect to the target, and a USB-C port for optionally charging the target while it is being controlled. Comet Q specifications: SoC – Unnamed dual-core Arm Cortex-A53 processor System Memory – 512MB LPDDR4 Storage – 512 MB NAND flash Display – 1.8-inch touchscreen color LCD Video Resolution and frame rate – 2K QHD @ 60 FPS Latency – About 80 ms Wireless Wi-Fi 6 IEEE 802.11 a/b/g/n/ac/ax 5 GHz: 286 Mbps 2.4 GHz: 286 Mbps Internal Wi-Fi antenna Interface USB Type-C port with power passthrough USB Type-C […]

Posted on by Debashis Das - No Comments on Loona Deskmate – An iPhone-powered AI desktop companion that doubles as a 165W GaN charging station (Crowdfunding)

Loona Deskmate – An iPhone-powered AI desktop companion that doubles as a 165W GaN charging station (Crowdfunding)

LOONA DeskMate An iPhone Powered AI Desk Robot

Loona Deskmate is a screen-aware AI desktop companion for iPhone designed to act as a hands-free co-worker that understands your workflow, responds conversationally, and executes tasks directly across your apps. Instead of packing an expensive internal SoC and display into the robot, the Deskmate relies on a docked iPhone to act as its “brain” and face, while the base serves as a 165W GaN desktop charging station. It features real-time voice interaction (~0.5s response time), screen awareness, and a 3-DOF motorized head for lifelike motion and responsive behavior. The system relies on a smartphone (iPhone 12+) for computing and uses its camera and sensors for visual and contextual input. The base integrates a 165W GaN power hub with multiple ports (3× USB-C + 1× USB-A), allowing it to function as a desk charging station. Overall, the hardware combines a robotic form factor with a practical docking and power solution designed […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on Linux 7.0 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 7.0 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 7.0

Linus Torvalds has just released Linux 7.0 on LKML: The last week of the release continued the same “lots of small fixes” trend, but it all really does seem pretty benign, so I’ve tagged the final 7.0 and pushed it out. I suspect it’s a lot of AI tool use that will keep finding corner cases for us for a while, so this may be the “new normal” at least for a while. Only time will tell. Anyway, this last week was a little bit of everything: networking (core and drivers), arch fixes, tooling and selftests, and various random fixes all over the place. Let’s keep testing, and obviously tomorrow the merge window for 7.1 opens. I already have four dozen pull requests pending – thank you to all the early people. Linus This follows the Linux 6.19 release about two months ago, which brought us PCIe link encryption and […]

Posted on by Debashis Das - 5 Comments on Sipeed T256s – A USB thermal camera with 256×192 LWIR sensor, 640×480 AI super resolution

Sipeed T256s – A USB thermal camera with 256×192 LWIR sensor, 640×480 AI super resolution

Thermal camera standalone mode PCB inspection

Sipeed T256s is a portable USB thermal camera equipped with a native 256×192 Long-Wave Infrared (LWIR) sensor and a built-in 2.4 TOPS NPU for hardware-level AI super-resolution (ISR) up to 640×480 resolution in real time, effectively suppressing image noise without external software. The UVC camera device supports standard output (Y16 raw and MJPEG) and features both male and female USB Type-C ports on opposite ends for connection to PCs and smartphones. It also includes a 1.69-inch touchscreen for standalone operation with live viewing, palette switching, hotspot tracking, and image capture. Other features include an optional macro lens (~5 cm focus) for inspecting small components, internal storage for snapshots, <50 mK thermal sensitivity, a 25 Hz frame rate, and a durable CNC aluminum enclosure for efficient heat dissipation. The device is designed for electronics R&D, industrial maintenance, and HVAC diagnostics. Sipeed T256s specifications: SoC – Axera AX620Q (updated, see comments section); […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 7 Comments on T-Display-P4 smartphone-like devkit features ESP32-P4 MCU, ESP32-C6 wireless SoC, and SX1262/LR2021 LoRa transceiver

T-Display-P4 smartphone-like devkit features ESP32-P4 MCU, ESP32-C6 wireless SoC, and SX1262/LR2021 LoRa transceiver

LILYGO T-Display-P4

LILYGO T-Display-P4 is a feature-rich ESP32-P4 + ESP32-C6 devkit, but with a smartphone-like design and support for GPS, Ethernet, and LoRaWAN through SX1262 or LR2021 LoRa transceiver, besides the usual WiFi 6, Bluetooth 5.x, and 802.15.4 wireless connectivity. The T-Display-P4 is offered with either a 4.05-inch IPS display and a 2MP front-facing camera or a 4.1-inch AMOLED with a 2MP rear camera. The devkit is equipped with 32MB PSRAM and 16MB NOR flash for the ESP32-P4, a microSD card slot, a built-in microphone and speaker, a 3.5mm audio jack, a few USB ports, and a 9-axis motion sensor, as well as a GPIO port and two Qwiic connectors for expansion. T-Display-P4 specifications: MCU – ESP32-P4 CPU Dual-core RISC-V microcontroller @ 360 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz GPU – 2D Pixel Processing Accelerator (PPA) VPU – H.264 and […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Qualcomm X105 6G-ready 5G modem to deliver 14.8 Gbps download and 4.2 Gbps upload peak data speeds

Qualcomm X105 6G-ready 5G modem to deliver 14.8 Gbps download and 4.2 Gbps upload peak data speeds

Qualcomm X105 5G Model RF

Qualcomm X105 is the world’s first 3GPP Release 19-ready modem-RF system supporting 5G connectivity up to 14.8 Gbps download and 4.2 Gbps upload peak data speeds, and enabling 6G development and testing. Other Qualcomm X105 highlights include a 6nm RF transceiver with 30% lower power consumption and 15% smaller board footprint compared to the Qualcomm X85 5G modem, support for quad-band GNSS, an integrated NR-NTN for video, data and voice over satellite, and a fifth-generation AI processor leveraging agentic AI to detect, classify, and optimize data traffic for mobile gaming, video calling, and social media. Qualcomm X105 Modem-RF system specifications: Peak speeds Download – 14.8 Gbps (FR1 + FR2), 13.1 Gbps (FR1) Upload – 4.2 Gbps Downlink Carrier Aggregation: 6F+T CA (500MHz) with 1024 QAM TDD/FDD with 1024 QAM Turbo DSDA enhancements, including Multi-SIM CA support (up to 60% higher throughput) 3rd-gen 6Rx for smartphones and FWA CPEs (with 10% […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Qualcomm Wi-Fi 8 solutions – FastConnect 8800 Mobile Client and Qualcomm Dragonwing Networking Platforms

Qualcomm Wi-Fi 8 solutions – FastConnect 8800 Mobile Client and Qualcomm Dragonwing Networking Platforms

Qualcomm FastConnect 8800 WiFi 8 client

Qualcomm has unveiled its Wi-Fi 8 (802.11bn) portfolio, which includes the FastConnect 8800 “Mobile Connectivity System”, also integrating Bluetooth 7 wireless technology, Ultra Wideband (UWB), and Thread,  and five Dragonwing Networking platforms for access points and routers. The Dragonwing NPro A8 Elite features a 5×5 Wi-Fi 8 radio system for high-performance enterprise access points and premium home routers, the Dragonwing FiberPro A8 Elite offers similar features but adds 10G fiber access (PON) for fiber-to-the-home gateways, the Dragonwing FWA Gen 5 Elite is designed for fixed wireless access using the Qualcomm X85 5G Modem-RF System, and the Qualcomm Dragonwing N8 and F8 platforms offer mainstream tier options for Ethernet and fiber broadband CPEs. Qualcomm FastConnect 8800 Wi-Fi 8 mobile client Qualcomm FastConnect 8800 (WCN885x) specifications: Wi-Fi 8 with advanced features like UWB, including  and RADAR Support for Snapdragon Sound™ Technology Suite, Bluetooth® High Data Throughput (HDT), and Qualcomm XPAN Proximity AI […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Lepton XDS dual-camera module combines 160 x 120 thermal imager with 5MP RGB camera

Lepton XDS dual-camera module combines 160 x 120 thermal imager with 5MP RGB camera

Teledyne FLIR XDS module

The Teledyne FLIR Lepton XDS dual-camera module combines a factory‑aligned radiometric 160 × 120 Lepton 3.5 thermal camera with a 5 MP visible camera. Its size, weight, and power (SWaP)‑optimized design makes it suitable for mobile devices, compact electronics, smart buildings, fire detection, occupancy analytics, and equipment‑condition‑monitoring applications. The company highlights that the Lepton XDS module is International Traffic in Arms Regulations (ITAR)-free, which reduces development risk and accelerates time‑to‑market, since it’s easier to export or integrate into products sold globally. Lepton XDS specifications: EO Camera Optics – EFL 1.57 mm, 98.2° HFOV, F/1/2.2 Sensor – 2592 x 1944 pixels (5 MP), 1.4 µm pitch Video – 640×480 @ 30Hz IR Camera Optics – 57° HFOV, f/1.1 Video – 8.7 Hz (commercial application exportable, since it’s below 9 FPS) Thermal Imaging Detector Lepton 3.5 160 x 120 pixels, 12 µm pitch Thermal Sensitivity – <50 mK (0.050 °C) Temperature Accuracy […]