CNX Software - Embedded Systems News

January 10, 2022February 1, 2022 by Jean-Luc Aufranc (CNXSoft) - No Comments

Linux 5.16 Release – Main Changes, Arm, RISC-V and MIPS architectures

Linus Torvalds has just announced the release of Linux 5.16: Not a lot here since -rc8, which is not unexpected. We had that extra week due to the holidays, and it’s not like we had lots of last-minute things that needed to be sorted out. So this mainly contains some driver fixes (mainly networking and rdma), a cgroup credential use fix, a few core networking fixes, a couple of last-minute reverts, and some other random noise. The appended shortlog is so small that you might as well scroll through it. This obviously means that the merge window for 5.17 opens tomorrow, and I’m happy to say I already have several pending early pull requests. I wish I had even more, because this merge window is going to be somewhat painful due to unfortunate travel for family reasons. So I’ll be doing most of it on the road on a laptop […]

January 9, 2022January 22, 2022 by Jean-Luc Aufranc (CNXSoft) - 137 Comments

ROCK5 Model B RK3588 single board computer is up for pre-order for $79 and up

Some will say “finally!” After years of waiting for Rockchip RK3588 processor, ROCKPi Trading Limited/Radxa got some samples for their ROCK5 Model B single board computer and has started to take pre-orders with discounted prices starting at $79 through distributors. But let’s check out the specifications first, with the octa-core Cortex-A76/A55 Pico-ITX SBC shipping with up to 16GB RAM, M.2 NVMe storage, 2.5GbE, optional WiFi 6E, 8K video output via HDMI or USB-C ports, 4K HDMI input, and more. Radxa ROCK5 Model B (aka ROCK 5B) specifications: SoC – Rockchip RK3588 octa-core processor with four Cortex-A76 cores @ 2.4 GHz, four Cortex-A55 cores @ 1.8 GHz, an Arm Mali G610MC4 GPU, a 6TOPS NPU, 8K 10-bit decoder, 8K encoder System Memory – 4GB, 8GB, or 16GB LPDDR4x Storage M.2 2280 socket for NVMe SSD (PCIe 3.0 x4) up to 2,000 MB/s MicroSD card socket eMMC flash socket Video Output 2x […]

Graperain Samsung, Rockchip, and Qualcomm CPU modules, SBCs, and carrier boards

January 9, 2022 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Reolink Go Plus 4G review – Part 2: A Solar-powered 4G LTE security camera with person & vehicle detection

Last month, I received Reolink Go Plus 4G smart security camera with 4G LTE connectivity, vehicle/human detection support, and powered by a solar panel. In the first part of the review, I did an unboxing, added the camera to the Reolink Android app, and confirmed it worked with my DTAC SIM card. I’ve now installed the camera and had time to test more of its features, so I can report my experience with the security camera. Reolink Go Plus 4G camera and solar panel installation I wanted to use the camera near the gate that’s outside of (reliable) WiFi range. So I found a piece of hardwood to which I attached the mounts of the camera and solar panel… … and attached it to the wall. My current installation works for testing, but it’s not the most secure as the camera is quite visible and only placed a little over […]

January 8, 2022January 8, 2022 by Jean-Luc Aufranc (CNXSoft) - 12 Comments

TDP (Thermal Design Power) vs PBP (Processor Base Power) – Are there differences?

TDP (Thermal Design Power) metric has been used for years to help manufacturers design appropriate cooling solutions for Intel/AMD processors and give an idea of their power consumption. But I did not immediately catch up that TDP was gone from the recent Alder Lake IoT processors announcement, and Intel is now using PBP (Processor Base Power) instead, while somehow cTDP (configurable TDP) down/up numbers are still provided. Beyond the announcement, if we look into the Intel Ark database, older processors still show TDP, while it’s completely gone for new processors with the specs instead listing Processor Base Power (PBP), and for the ones with Turbo mode “Maximum Turbo Power” (MTP) is also included. But what do those mean exactly? Intel “explains”: TDP definition: Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. […]

January 7, 2022 by Sponsored Post - No Comments

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

January 7, 2022January 7, 2022 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Board with 25 RGB LEDs is offered with ESP32-C3 or ESP32-Pico-D4

In case you are in need of a tiny WiFI or Bluetooth-connected board with an RGB LED matrix, two have shown up on Banggood with basically the same 25 RGB LED design , except “C3FH4 RGB” board is based on ESP32-C3 RISC-V SoC, while the other, named “PICO D4 RGB“, features ESP32-Pico-D4 SiP (System-in-Package). The boards are cute and the main purpose is probably for decoration/ornament, but I’d imagine if you purchase a few they could also be used as an experimentation/education platform for mesh networking, using the ESP Mesh Development Framework (ESP-MDF) for instance. C3FH4 RGB / PICO D4 RGB board specifications: SoC/SiP C3FH4 RGB board – ESP32-C3FH4 SoC with RISC-V core @ 160 MHz, 4MB flash, 2.4GHz Wi-Fi, and Bluetooth 5 LE with Long-Range support PICO D4 RGB board – ESP32-PICO-D4 system-in-package with ESP32 dual-core Xtensa processor @ 240 MHz, 2.4GHz Wi-Fi and Bluetooth dual-mode, 4MB flash Ceramic […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025

January 7, 2022January 25, 2022 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Horizon X3 AI development board is powered by Sunrise 3 AI Edge Arm processor

Horizon X3 AI development board is powered by Horizon Robotics Sunrise 3 (aka X3) quad-core Cortex-A53 processor with a 5 TOPS NPU, and multiple camera support with the chip apparently designed for the automotive industry. [Update January 25, 2022: A third-party company, Finsbury Glover Hering, claiming to represent Horizon Robotics informed CNX Software the chip is not designed for the automotive market, and that Horizon’s AIoT business is actually limited to the domestic China market and not overseas.] The devkit is comprised of a Sunrise 3 system-on-module with 1GB LPDDR4 & 16GB EMMC memory, as well as a baseboard with Gigabit Ethernet and WiFi, HDMI up to 1080p60 and MIPI DSI interface, a camera interface, and a 40-pin header for expansion. Horizon X3 AI development board specifications: SoC – Horizon Robotics Sunrise 3 quad-core Cortex-A53 processor @ 1.2 GHz, one Cortex-R5 core, a 5 TOPS NPU (2x “Bernoulli” BPU) System […]

January 6, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

NXP IW612 Wi-Fi 6, Bluetooth 5.2, 802.15.4 tri-radio solution supports Matter

Matter, previously known as Project Chip, is a unified interface for Smart Home devices to improve interoperability between devices from different manufacturers and associated services like Google Assitant or Amazon Alexa. Matter can work over Thread, WiFi, Ethernet, BLE, etc… so it’s not limited by the physical layer. So far, we mostly heard about development related to Matter, and Espressif has published a series of posts about Matter to be for instance used by their upcoming ESP32-H2 wireless MCU, but I had not seen many other solutions, not commercial products. This is going to change in 2022, as Belkin announced it’s working on “redesigned smart plugs and lighting solutions” with support for Matter over Thread” that start selling this summer. Separately, NXP also announced the IW612 tri-radio solution with Matter support and dual-band WiFI 6, Bluetooth 5.2, and 802.15.4 radios. NXP IW612 IW612 key features and specifications: Dedicated, independent CPUs […]

Boardcon LGA3576 Rockchip RK3576 System-on-Module designed for AI and IoT applications