MediaTek Helio P90’s APU 2.0 Quadruples AI Performance

MediaTek Helio P90

Mediatek has launched another of their Helio P-series processor. We’ve gotten used to getting incremental improvements when it comes with CPU and GPU performance, but now companies are able to deliver massive improvement for neural network accelerators, and MediaTek Helio P90 can deliver four times (4.6x) the A.I. performance over Helio P60/P70 thanks to its APU 2.0. MediaTek Helio P90 key features & specifications: CPU – 2x Arm Cortex-A75 processors @ 2.2GHz and 6x Arm Cortex-A55 processors @ 2.0GHz using DynamIQ technology GPU – Imagination PowerVR GM 9446 GPU @ 970 MHz NPU – MediaTek APU 2.0 fusion AI architecture with 1127 GMACs (2.25TOPs) MediaTek CorePilot for sustainable peak performance, longer battery life and lower operating temperature System Memory –  Up to 8GB of LPDDR4x memory @ 1866MHz Storage – UFS 2.1 Display – Full HD+ (2520×1080) resolution, 21:9 aspect ratio Camera Up to 48MP single camera or 24+16MP dual camera Triple-ISP design with 14-bit RAW and 10-bit YUV processing …

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ARM Cortex-A75 & Cortex-A55 Cores, and Mali-G72 GPU Details Revealed

We’ve already seen ARM Cortex A75 cores were coming thanks to leak showing Snapdragon 845 SoC will feature custom Cortex A75 cores, but we did not have many details. But since we live in a world where “to leak is glorious”, we already have some slides originally leaked through VideoCardz with the post now deleted, but Liliputing & TheAndroidSoul got some of the slides before deletion, so let’s see what we’ve got here. ARM Cortex A75 So ARM Cortex-A75 will be  about 20% faster than Cortex A73 for single thread operation, itself already 30% faster than Cortex A72. It will also be the first DynamIQ capable processor together with Cortex A55 with both cores potentially used in big.LITTLE configuration. Cortex A75 performance is only better for peak performance, and remain the same as Cortex-A73 for sustained performance. The chart above does not start at zero, so it appear as though there are massive performance increases, but looks at the number …

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Qualcomm Snapdragon 845 Octa-core Processor To Feature ARM Cortex A75 Cores (Reports)

According to reports from China, Qualcomm’s next application processor (or rather mobile platform) will be Snapdragon 845, and if accurate, the comparison table below between the Snapdragon processor and Hisilicon Kirin 970 SoC shows the former will be powered by some customized (魔改) version of yet-to-be announced ARM Cortex 75 cores. Snapdragon 845 octa-core processor will be manufactured using Samsung 10nm LPE processor, come with four custom Cortex A75 cores, four Cortex A53 cores, an Adreno 630 GPU, and an LTE X20 modem supporting LTE Cat 18 for up to 1.2 Gbps download speed. Other features like 802.11ad (High bandwidth, short range WiFi), UFS 2.1, and LPDDR4X were already found on earlier model. I’ve been unable to find further details about ARM Cortex A75 right now, and we have to wait until ARM Techcon 2017 before getting more details. Mobile phones powered by Snapdragon 845 are supposed to start shipping in Q1 2018. Via Wccftech Support CNX Software – Donate …

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