MikroElektronika Launches Fusion for ARM & EasyPic MCU Development Boards

fusion for arm

During Embedded World 2020 (EW2020), some companies withdraw their presence, while some were at the event. MikroElektronika presented several new boards and among them Fusion for ARM v8 and EasyPic v8 development boards. While we already wrote about Fusion fo TIVA, we haven’t covered any EasyPic board yet. Development boards from MikroElektronika allow rapid prototyping in the most efficient and effortless way. Fusion for ARM v8 Fusion for ARM v8 belongs to the Fusion family of development boards. It has integrated the world’s first embedded debugger/programmer over WiFi, while the CODEGRIP WiFi license is available as an add-on feature. The board is designed to be used in almost every environment retaining full debugging and programming access. The CODEGRIP currently supports more than 1600 microcontrollers from different vendors. The Fusion board integrates a new MCU card standard. It is a low profile standard where sockets consist of two connectors (male/female) which prevents the wrong insertion. The MCU card has standardized dimensions …

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SECO Unveils 3.5″ Ryzen Embedded SBC, Docker-Compatible EDGEHOG OS Linux Distribution

3.5-inch Ryzen Embedded SBC

After IBase IB918, here’s another 3.5″ Ryzen Embedded SBC courtesy of SECO SBC-C90 equipped with a choice of Ryzen Embedded V1000 or R1000-series processor, dual Gigabit Ethernet, and four DisplayPort++ ports. Separately from the hardware announcement, SECO has launched a Yocto-based, Docker-compatible Linux distribution called EDGEHOG OS and supporting containers, OTA updates, and remote management. SECO SBC-C90 SBC Specifications: SoC (one or the other) AMD Ryzen Embedded V1000 family: Ryzen Embedded V1807B quad-core/octa-thread @ 3.35GHz (3.8 Boost) with AMD Radeon Vega 11 Graphics; TDP 35-54W Ryzen Embedded V1756B quad-core/octa-thread @ 3.25GHz (3.6 Boost) with AMD Radeon Vega 8 Graphics; TDP 35-54W Ryzen Embedded V1605B quad-core/octa-thread @ 2.0GHz (3.6 Boost) with AMD Radeon Vega 8 Graphics; TDP 12-25W Ryzen Embedded V1202B dual-core/quad-thread @ 2.3GHz (3.2 Boost) with AMD Radeon Vega 3 graphics; TDP 12-25W AMD Ryzen Embedded R1000 family: Ryzen Embedded R1606G dual-core/dual-thread @ 2.6GHz (3.5 Boost) with AMD Radeon Vega 3 GPU; TDP 12-25W Ryzen Embedded R1505G dual-core/dual-thread @ 3.25GHz …

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PicoCore MX8MN is a Tiny NXP i.MX 8M Nano Computer-on-Module

The PicoCore MX8MN Nano carries the NXP i.MX 8M Nano F&S Elektronik Systeme has announced the development of the smallest i.MX 8M based CoM yet: the PicoCore MX8MN Nano. Previously we had reported on the Congatec Conga-SMX8 Nano which was a fairly small CoM compliant with SMARC 2.0 standard. The PicoCore MX8MN is based on the NXP i.MX 8M Nano CPU with 1 to 4 Arm Cortex-A53 cores and a Cortex-M7 real-time core. The Nano is set to carry up to 8GB RAM and 32 GB eMMC, with optional WiFI/BT and support for -40º C to 85º C temperature ranges. Similar to Predecessor The PicoCore MX8MN Nano is very similar in structure to the PicoCore MX8MM Mini CoM, but with a different i.MX 8M Mini processor featuring the same Arm Cortex-A53 cores, but the Cortex M4 real-time core is changed to a more powerful Cortex-M7 core in the MX8MN Nano. The MX8MN Nano has no photo on the product page …

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Toradex Launches New Verdin Arm SoM Family Starting with iMX8M Mini/Nano Modules

Verdin iMX8M Mini / Nano

So far, Toradex had two Arm-based system-on-module families with the smaller, lower-power Colibri and more powerful Apalis modules. The Colibri form factor was first defined in 2005, and the company is still maintaining it, but since then new interfaces have emerged, so Toradex has now designed a new low-power module family called Verdin. Toradex Verdin modules offer more I/Os with a 260-pin edge connector, include a battery-ready design with a wide input voltage range (3.3 to 5V), low power 1.8V IOs, the ability to easily extend power management to carrier board peripherals, and off-the-shelf thermal solutions. The modules are also tested for EMC, shock and vibration tolerance, and “Toradex Direct Breakout” is said to simplify signal routing on carrier boards as high speed, impedance critical signals are routed from the source IC to the edge connector on the Verdin module in such a ways to limit complexity on the carrier board. Verdin iMX8M Mini/Nano Modules The first Verdin SoM’s are …

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Antmicro GEM ASIC Leverages zGlue Technology to Quickly Bring Custom Arm/RISC-V SoC’s to Market

Antmicro GEM1 zGlue Chip

Introduced in 2018, ZiP (zGlue Integration Platform) chip-stacking technology aims to produce chips similar to Systems-in-Package (SiP) but at much lower costs and lead times. We first found it in a Bluetooth tracker featuring ZGLZ1BA custom chip manufactured with zGlue technology and integrating an Arm Cortex-M0 MCU, flash memory and sensors into a single package. But now the technology is back in the news with Antmicro announcing GEM chiplet-based ASIC last December. At the time of the announced the company’s GEM1 chip featured two Lattice iCE40 FPGAs with a MIPI CSI-2 switch, and they had started working on GEM2 chip combining a hard RISC-V processor and Lattice iCE40 FPGA. Those are so-called demonstrators chip as Antmicro customers will be able to easily and quickly design their own 6×9 mm chip(s) with RISC-V and/or ARM CPUs, FPGAs, sensors, radios and other functional elements to meet the requirements of their specific applications. The company will provide support for open-source operating systems such …

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MWC 2020 Cancelled, Several Companies Withdraw from Embedded World 2020 due to COVID-19

MWC 2020 Canceled

We’ve already covered the impact of the coronavirus on shipping and manufacturing from China, and it now looks like it may take longer than expected before things go back to normal. The WHO has now an official name for the disease: COVID-19 (COrona VIrus Disease 2019), and the impacts of the virus go far beyond China, and two large events usually taking place in February will either be canceled or scaled back. After several companies decided to pull out of the event, GSMA decided to completely cancel Mobile World Congress 2020 (aka MWC 2020): Since the first edition of Mobile World Congress in Barcelona in 2006, the GSMA has convened the industry, governments, ministers, policymakers, operators and industry leaders across the broader ecosystem. With due regard to the safe and healthy environment in Barcelona and the host country today, the GSMA has cancelled MWC Barcelona 2020 because the global concern regarding the coronavirus outbreak, travel concern and other circumstances, make …

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