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Posted on by Debashis Das - 1 Comment on Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

Posted on by Debashis Das - No Comments on Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

MIO 5355 Qualcomm Dragonwing QCS6490 SBC

Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux. We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability. Advantech MIO-5355 specifications: SoC (one or the other) Qualcomm DragonWing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Geniatech introduces SMARC and OSM system-on-modules powered by NXP i.MX 95 SoC

Geniatech introduces SMARC and OSM system-on-modules powered by NXP i.MX 95 SoC

Geniatech NXP i.MX 95 SMARC OSM system-on-modules

  Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 Size L-compliant SOM-iMX95-OSM and the SMARC 2.1-compliant SOM-iMX95-SMARC. Both ship with up to 16GB LPDDR5 and up to 128GB eMMC flash, and are designed for markets such as smart retail, industrial automation, intelligent transportation, medical devices, and commercial IoT. Geniatech SOM-iMX95-SMARC SOM-iMX95-SMARC specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode JPEG Encoder, JPEG Decoder AI Accelerator – NXP eIQ Neutron 2 TOPS neural processing […]

Posted on by Debashis Das - 2 Comments on Radxa launches NX4 SoM with Rockchip RK3576(J) industrial SoC and NX4IO carrier board

Radxa launches NX4 SoM with Rockchip RK3576(J) industrial SoC and NX4IO carrier board

Radxa NX4 Rockchip RK3576(J) SoM

Radxa NX4 is a 260-pin SO-DIMM SoM built around the Rockchip RK3576(J) octa-core Cortex-A72/A53 industrial SoC with a 6 TOPS NPU for edge AI workloads. It supports up to 16GB LPDDR5 memory along with optional SPI flash, eMMC 5.1 (up to 256GB), or UFS 2.0 storage (up to 1TB). Radxa has also introduced the NX4 IO carrier board for the module with an HDMI video output, two 4-lane MIPI CSI camera interfaces, four USB 3.2 Type-A ports, one USB 3.2 Type-C port, Gigabit Ethernet with optional PoE, and an M.2 M-key 2280 slot for storage, along with various I/Os. Radxa NX4 SoM specifications: SoC – Rockchip RK3576J (industrial-grade version) CPU – Octa-core CPU with 4x Cortex-A72 cores at 2.2 GHz, 4x Cortex-A53 cores at 2.0 GHz GPU – Arm Mali-G52 MC3 GPU with support for OpenGL ES 1.1, 2.0, and 3.2, OpenCL 2.0, and Vulkan 1.2 NPU – 6 TOPS […]

Posted on by Debashis Das - 1 Comment on AMD Embedded+ mini-ITX Board features Ryzen AI Embedded P132 CPU, Versal AI Edge Gen2 VE3558 SoC FPGA

AMD Embedded+ mini-ITX Board features Ryzen AI Embedded P132 CPU, Versal AI Edge Gen2 VE3558 SoC FPGA

SAPPHIRE EDGE+ VPR 7P132, a Mini ITX AMD Embedded+

At CES 2026, Sapphire Technology introduced the EDGE+VPR-7P132, an “AMD Embedded+” Mini-ITX motherboard built around AMD’s newly announced Ryzen AI Embedded P100 series of SoCs, namely the hexa-core Ryzen P132 (V4526iX) CPU, and an AMD Versal AI Edge Gen 2 VE3558 SoC FPGA, which features octa-core Arm Cortex-A78AE + ten Cortex-R52 real-time cores beyond FPGA fabric. It’s the first AMD Ryzen AI Embedded motherboard we’ve seen. It represents a massive update from last year’s Edge+ VPR-5050 motherboard, which relied on Zen 2-based Ryzen Embedded V2000 series and first-generation Versal silicon. The new VPR-7P132 skips multiple generations, jumping straight to Zen 5 CPU cores and RDNA 3.5 graphics, with an upgraded Versal Gen 2 adaptive Edge AI SoC for real-time inference, along with faster LPDDR5 (4266MHz) memory and 40 Gbps USB4 connectivity. SapphireTech EDGE+ VPR-7P132-MB specifications: AMD Embedded+ Architecture Adaptive SoC Subsystem Adaptive SoC – AMD Versal AI Edge Gen 2 […]

Posted on by Debashis Das - No Comments on SECO’s COM Express Type 6 module features Intel Core Ultra Series 3 Panther Lake-H processor with up to 180 TOPS

SECO’s COM Express Type 6 module features Intel Core Ultra Series 3 Panther Lake-H processor with up to 180 TOPS

SECO SOM COMe BT6 PTL COM Express Type 6 module

We have just covered Vecow’s new TGS-2000 series of Edge AI computers built around Intel’s new Panther Lake-H SoCs, and now SECO has announced the SOM-COMe-BT6-PTL, a COM Express Type 6 Basic module which supports the higher-end 16-core Core Ultra X9 series processors and can deliver up to 180 TOPS of AI performance. The module follows the COM Express Release 3.1 Type 6 Basic form factor (125 × 95 mm), supports up to 128GB DDR5 memory via dual SO-DIMM slots, offers high-speed expansion through PCIe Gen4/Gen5, USB 4.0/Thunderbolt, and 2.5Gbps Ethernet, and provides multiple display interfaces including eDP, DP++, and HDMI. It is available with an optional industrial temperature range and is designed for rugged and mission-critical applications. SECO SOM-COMe-BT6-PTL Specifications: Panther Lake SoC (one or the other) Intel Core Ultra X9 388H – 16-core (4P + 8E + 4LPE) processor up to 1.6 GHz / 5.1 GHz (Turbo), 18MB cache, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on STM32MP21 Arm Cortex-A35/M33 MPU targets cost-effective applications in smart factories, homes, and cities

STM32MP21 Arm Cortex-A35/M33 MPU targets cost-effective applications in smart factories, homes, and cities

STM32MP215F-DK Discovery Kit

STMicroelectronics’ STM32MP21 microprocessor family combines a 1.5 GHz 64-bit Arm Cortex-A35 application core with a 300 MHz 32-bit Arm Cortex-M33 core for real-time processing. It is designed for “cost-aware” edge applications in smart factories, smart homes, and smart cities. The new STM32MP21 is a cost-optimized version of the earlier STM32MP23 and STM32MP25 that does without an AI accelerator (yes, those still exist!), GPU, H.264 decoder and encoder, or PCIe Gen2 / USB 3.0 interfaces. It still offers a MIPI CSI-2 camera interface, two Gigabit Ethernet interfaces with Time-Sensitive Networking (TSN), and strong security targeting SESIP Level 3 and PCI pre-certification. STM32MP21 specifications: CPU – Arm Cortex-A35 core running at up to 1.2 or 1.5 GHz with 128KB L2 cache Real-time MCU – Arm Cortex-M33 core with FPU/MPU running at up to 300 MHz GPU – None VPU – None AI accelerator – None Memory 456 KB SRAM 256KB AXI SYSRAM […]

Posted on by Debashis Das - 1 Comment on Calixto Systems SL1680 OPTIMA industrial SoM and EVK features Synaptics SL1680 Edge AI processor

Calixto Systems SL1680 OPTIMA industrial SoM and EVK features Synaptics SL1680 Edge AI processor

SL1680 OPTIMA SOM

Calixto Systems has recently introduced the SL1680 OPTIMA, an industrial SoM built around the Synaptics SL1680 quad-core Arm Cortex-A73 SoC with a 7.9+ TOPS secure NPU for Edge AI and advanced multimedia applications. They also announced an evaluation kit (EVK) for rapid product development. The SoM offers up to 4GB LPDDR4 RAM, up to 16GB eMMC flash, an onboard Gigabit Ethernet PHY, and a wide range of interfaces through compact Hirose connectors, including dual MIPI CSI camera inputs, MIPI DSI, HDMI 2.1 Tx/Rx, PCIe 2.0, USB 3.0/2.0, SDIO, RS485, CAN-FD, and various GPIOs. The EVK further expands connectivity with MikroBUS, display and camera interfaces, and industrial I/O, making the platform suitable for AI-enabled vision systems, smart HMIs, automation equipment, and other edge computing applications. SL1680 OPTIMA SoM specifications SoC – Synaptics SL1680 (Astra Series) CPU – Quad-core Arm Cortex-A73 processor @ 2.1 GHz GPU – Imagination PowerVR Series9XE GE9920 GPU with […]

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