We’ve been writing about Rockchip RV1109 and RV1126 AI camera SoC’s in recent days, as well as evaluation boards and modules, plus some complete solutions such as Firefly dual-lens AI camera modules. Shenzhen-based JWIPC, a company specifically in embedded PCs and motherboards, has designed three SBC’s powered by Rockchip RV1109 processor especially designed for access control, leverage the face detection capabilities of the Rockchip processor. The three access control boards are: R19S – Standard 100x72mm Pico-ITX board with industrial grade materials, support for wide temperature, hardware watchdog, and “rich peripheral interface”. R19F- Same as R19S, but with a mini PCIe socket for a 4G LTE module, plus a SIM card slot R19N – Similar to R19S with a narrower 100x60mm design JWIPC R19 boards share most of the same hardware key features and specifications: SoC – Rockchip RV1109 dual-core Arm Cortex-A7 @ 1.5 GHz, plus RISC-V MCU @ 400 MHz, […]
Firefly dual-lens AI camera module comes with Rockchip RV1109 or RV1126 processor
We’ve very recently written about Rockchip RV1126 quad-core Cortex-A7 processor designed AI cameras thanks to a 2.0 TOPS AI accelerator together with its little dual-core brother: RV1109. We’ve also found some RV1109 and RV1126 evaluation boards, but prices were in the hundreds of dollars. It was then brought to our attention than the upcoming MAIX-III board would feature RV1126 at a more affordable cost, but it turns out there’s no need to wait as Firefly has just launched a dual-lens AI camera module based on either Rockchip RV1109 or RV1126 for under $100 with respectively CAM-C1109S2U and CAM-C1126S2U models. Both version of the modules have the same specifications except for the processor: SoC (one or the other) RV1109 SoC with CPU – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU – 1.2 TOPS with support for INT8/ INT16 VPU Encoder […]
Pipo W12 Arm Windows 10 Laptop finally launched for $422 and up
Pipo showcased a Snadragon 850 powered 2-in-1 laptop in fall 2019, and said it expected it to sell for around $400. But it appears it took quite longer than expected to launch the Arm Windows 10 laptop, and only now can we see PiPo W12 laptop sold on Aliexpress for around $422 and up plus shipping. The 2-in-1 laptop comes with a 12.3-inch touchscreen display, 4GB or 8GB RAM, 256GB storage, as well as WiFi 5, Bluetooth 5.0, and 4G LTE connectivity. Pipo W12 specifications have changed a little bit since the first announcement, notably the display resolution, and we’ve got a few more details: SoC – Qualcomm Snapdragon 850 octa-core Kryo 385 Arm cores clocked @ up to 2.96 GHz with Adreno 630 Visual Processing Subsystem, Hexagon 685 DSP System Memory – 4GB or 8GB DDR4 RAM Storage – 256GB flash storage, MicroSD card slot Display – 12.3″ IPS […]
Rockchip RV1126 AI Camera SoC features 2.0 TOPS NPU, promises 250ms fast boot
The Rockchip Developer Conference that took place at the end of November 2020 allowed us to learn more about RK3588, RK3566, and RK3568 64-bit Arm processors for AIoT applications. But the company also presented additional details about camera SoC’s, namely the dual-core RV1109 and quad-core RV1126, equipped with a 1.2 TOPS and 2.0 TOPS respectively, and both capable of delivering a 250ms fast boot. Rockchip RV1109 and RV1126 share many of the same specifications: CPU RV1109 – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz RV1126 – Quad-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU RV1109 – 1.2 TOPS with support for INT8/ INT16 RV1126 – 2.0 TOPS with support for INT8/ INT16 Memory – 32-bit DDR3/DDR3L/LPDDR2/LPDDR3/DDR4/LPDDR4 up to 4GB RAM Storage – eMMC 4.51, Serial SPI NOR Flash or NAND flash with fast booting support, […]
Zora P1 Amlogic A311D Development Board interfaces with Orbbec 3D Cameras
We have already seen the powerful Amlogic A311D powered Khadas VIM3 SBC, and Orbbec announced the Zora P1 development board for Orbbec 3D cameras, supporting robotics, gaming, smart homes, etc. Some of the other products showcased at the CES 2021 by Orbbec include its first 3D sensor with time-of-flight (TOF) technology, the latest Astra+ camera, and a real-time industrial 3D camera. “Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence, and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder, and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.” Orbbec’s Zora P1 Development Board Zora P1 is a processing board for developers and enthusiasts to integrate 3D imaging and associated computing tasks for demanding industrial applications. Orbbec has specially designed this long-lasting solution to work with its 3D […]
Renesas RZ/G2L MPUs Feature Cortex-A55 & Cortex-M33 Cores for AI Applications
Renesas Electronics Corporation announced RZ/G2L MPUs, allowing enhanced processing for an extensive variety of AI applications. The RZ/G2L group of 64-bit MPUs includes three new MPU models featuring Arm Cortex-A55, and an optional Cortex-M33 core. These are RZ/G2L, RZ/G2LC, and RZ/G2UL MPUs. The Cortex-A55 CPU core typically delivers approximately 20 percent improved processing performance compared with the previous Cortex-A53 core, and according to Renesas, is around six times faster in “essential processing for AI applications”. The company already has four mid to high-end design level MPUs including RZ/G2E, RZ/G2N, RZ/G2M, and RZ/G2H, with combinations of Cortex-A53 and Cortex-A57 cores. The new RZ/G2L group of three MPUs forms the entry-level design with Cortex-A55. Hence, the seven MPU models together provide scalability from entry-level to high-end design. Common Key Features in RZ/G2L, RZ/G2LC, and RZ/G2UL MPUs Up to 2x Cortex-A55 cores Cortex-M33 core Camera interface (MIPI-CSI) Display interface (Parallel-IF) USB 2.0 interface […]
ClusBerry 9500-CM4 – A Raspberry Pi CM4 cluster, industrial style
Raspberry Pi cluster boards / solutions pop-up from time to time. But so far, I think we’ve seen only one based on Raspberry Pi CM4 modules with the upcoming Turing Pi 2 mini-ITX cluster board supporting four of those. TECHBASE has now unveiled a different kind of Raspberry Pi CM4 cluster with ClusBerry 9500-CM4 integrating up to eight Raspberry Pi Computer Module 4 in a DIN-Rail housing for industrial applications. ClusBerry 9500-CM4 is designed to be customizable with a choice of Raspberry Pi CM4 based modules and I/O cards: Standard 9500-CM4 cluster module with Compute Module 4 and a selection of configuration that include: I/O Controller with DI, DO, AI, 1-Wire, RS-232/485 and CAN interfaces Communication Gateway with up to 2x Ethernet, serial ports, wireless connectivity: LTE-cat.M1, 4G, 5G, LoRa, ZigBee, Z-Wave, Wireless M-Bus AI Gateway with Coral Edge TPU via PCIe M.2, or up to 4x Coral Edge TPU […]
Pine64 mailbag – PinePhone postmarketOS Edition, PineCone BL602 board, and Pinecil soldering iron
Pine64 community was pretty busy last year with the launch of several products. Recently I’ve received a couple of packages with some of those products, namely PinePhone Community Edition: PostmarketOS, PineCone WiFi & BLE IoT board based on BL602 RISC-V SoC, and Pinecil soldering iron also based on a RISC-V chip for control, but this time GD32V generic-purpose MCU. I’ll most show what I have received without going into too many details, except for PinePhone which I have already set up and used for one hour or so. PineCone BL602 board I received PineCone at the end of last year in a separate envelope with the board only. There’s not much to it with the BL602 processor offering WiFI and Bluetooth, a USB-C port for programming and power, and a few I/Os. The board is interesting as it is the first RISC-V IoT board with wireless connectivity built into the […]