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July 28, 2026 by Debashis Das - No Comments

DFI X6X-ORN – An IP67-rated, rugged Jetson Orin NX/Nano edge AI computer with GMSL2 camera support

DFI X6X ORN Jetson IP67 fanless edge AI computer

The DFI X6X-ORN is a fanless, IP67-rated Edge AI computer powered by the NVIDIA Jetson Orin NX/Nano. It is designed for extreme outdoor and industrial environments in maritime, agriculture, construction, and intelligent transportation applications. The system fully relies on rugged M12 and M20 circular waterproof connectors for all its I/O, including PoE and GMSL2 camera interfaces. It delivers up to 157 TOPS of AI performance when equipped with the Jetson Orin NX 16GB module, complies with MIL-STD-810H shock and vibration standards, and supports an operating temperature range of -20°C to 60°C. DFI X6X-ORN specifications: SoM – NVIDIA Jetson Orin NX/Nano module Jetson Orin NX 16GB – Up to 157 TOPS, 16GB LPDDR5, 10W/15W/25W/ 40W power modes Jetson Orin NX 8GB – Up to 117 TOPS, 8GB LPDDR5, 10W/15W/25W/40W power modes Jetson Orin Nano 8GB – Up to 67 TOPS, 8GB LPDDR5, 7W/10W/25W power modes Jetson Orin Nano 4GB – Up […]

July 15, 2026 by Debashis Das - 2 Comments

Bigme Hibreak Dual 2 – An Android 16 smartphone with 6.13-inch 80fps E-Ink and 5-inch LCD display (Crowdfunding)

Bigme has launched the Hibreak Dual 2, an Android 16 smartphone with a 6.13-inch 80fps E-Ink display on the front and a 5-inch LCD on the rear. Built around the MediaTek Dimensity 8300 processor and supports dual 5G connectivity, positioning it as an E-Ink smartphone with flagship-class hardware. The front E-Ink can be used for reading, writing, and general everyday use, whereas the LCD in the back serves as a conventional smartphone display for applications that require higher refresh rates and full-color output, like video gaming and navigation. This dual-screen setup allows users to switch between the two displays depending on the task. Bigme Hibreak Dual 2 specifications: SoC – MediaTek Dimensity 8300 CPU – Octa-core processor with 4x Arm Cortex-A715 and 4x Cortex-A510 GPU – Arm Mali-G615 VPU Video Encoding – H.264, HEVC Video Playback – H.264, HEVC, VP9, AV1 AI accelerator – MediaTek NPU 780 Memory – 12GB […]

July 9, 2026July 8, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Norik Systems introduces nRF9151-based USB Dongle for DECT NR+ deployments

Norik Systems has developed a compact USB dongle based on Nordic Semiconductor’s nRF9151 SiP, mostly designed to work as a DECT NR+ child node or a USB-powered gateway. As a reminder, DECT NR+ is a non-cellular 5G standard for long-range low-power applications that works at 1.9 GHz and supports up to one million nodes through mesh, star, and point-to-point topologies. The Norik USB dongle enables developers to easily add DECT NR+ to gateways or child modes. Norik Systems DECT NR+ USB dongle specifications: Wireless System-in-Package – Nordic Semi nRF9151 CPU – Arm Cortex-M33 @ 64 MHz Memory – 256KB RAM Storage – 1MB flash Connectivity Multimode LTE-M/NB-IoT/NB-NTN modem with DECT NR+ support and GNSS. 700-2200 MHz LTE band support. Power Class 5 20 dBm Power Class 3 23 dBm 1.9 GHz and 915 MHz DECT NR+ band support (1, 2, 9, 22) Security – Arm TrustZone + Arm CryptoCell 310. […]

June 26, 2026June 26, 2026 by Debashis Das - No Comments

Firefly AIBOX-9075 Edge AI box features 200 TOPS Qualcomm IQ-9075 SoC, 36GB LPDDR5, industrial I/Os

The AIBOX-9075 is an industrial Edge AI box built around the Qualcomm IQ-9075 SoC, designed for running AI workloads directly on the device without relying on the cloud. With up to 200 TOPS of AI performance, it is designed for edge computing, private LLM deployment, robotics, computer vision, and more. The system comes with 36GB LPDDR5 ECC memory, 128GB UFS 2.2 storage, and an M.2 PCIe 4.0 NVMe SSD slot. Connectivity options include dual 2.5GbE with TSN, optional Wi-Fi 6, Bluetooth 5.2, and 4G/5G, while peripheral interfaces include eight GMSL2 camera inputs, HDMI 2.0, USB 3.0, CAN-FD, RS485, and opto-isolated digital I/O. Its rugged aluminum enclosure operates from -40°C to 85°C, making it suitable for continuous deployment in industrial and outdoor environments. Firefly AIBOX-9075 specifications: SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up to 1.85GHz […]

June 23, 2026June 23, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

MYiR MAC-B5760 fanless Edge AI industrial PC features Rockchip RK3576 SoC, optional RK1828 LLM/VLM module

MYiR MAC-B5760 is a fanless Edge AI industrial box PC powered by a Rockchip RK3576 SoC with a built-in 6 TOPs NPU, and equipped with 8GB LPDDR5 and 64GB flash by default. The embedded system offers two Gigabit Ethernet ports, four USB 3.0 ports, HDMI and mini DP video outputs, a 3.5mm audio jack, a USB-C port for convenient serial console access, an optional WiFi 6 and Bluetooth 5.4 module, and expansion capability through an M.2 socket for NVMe SSD or AI accelerator, and a mini PCIe socket to add 4G LTE/5G cellular connectivity. MYiR MAC-B5760 specifications: SoC – Rockchip RK3576 CPU 4x Cortex-A72 cores @ 2.2GHz, four Cortex-A53 cores @ 1.8GHz Arm Cortex-M0 MCU at 400MHz GPU – ARM Mali-G52 MC3 GPU with support for OpenGL ES 1.1, 2.0 and 3.2, OpenCL up to 2.0 and Vulkan 1.1 NPU – 6 TOPS (INT8) AI accelerator with support for INT4, […]

June 18, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Broadcom unveils fully-integrated quad-core Wi-Fi 8 access point SoCs, 5G FWA router reference platform

Broadcom Wave 5 BCM6772 BCM6774 BCM6776 WiFi 8 SoC family

Broadcom has launched three new Wi-Fi 8 access point SoCs: the BCM6772 for mass-market Ethernet routers, extenders, and repeaters, the BCM6774 for high-volume Ethernet routers and extenders, and the BCM6776 for premium Ethernet tri-band routers and extenders. The latter is also part of a 5G FWA router platform based on Samsung B1320 5G Modem. Broadcom’s first Wi-Fi 8 chips were introduced in May 2025 for clients and access points, and the company followed up with BCM6714 and BCM6719 dual-band radios earlier this year, and the BCM67142, BCM67192, and BCM68565 chips for low-cost Wi-Fi 8 10 Gbps fiber access points last month. So far, all the Broadcom Wi-Fi 8 chips enable multi-chip solutions with an application processor connected to one or more Wi-Fi 8 chipsets over a PCIe connection. The new BCM677x chips are fully-integrated SoCs with (Armv8>) application cores and 802.11bn connectivity in a single chip, except for 6 GHz […]

June 8, 2026June 8, 2026 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Mudi 7 (GL-E5800) 5G NR Wi-Fi 7 travel router supports up to 4.67 Gbps link rate

GL.iNet Mudi 7, codenamed GL-E5800, is a battery-powered 5G NR WiFi-7 travel router with 2.5GbE, up to 4.67 Gbps downlink cellular speed, up to 5.76 Gbps WiFi link rate, and 700 Mbps VPN transfer rate using OpenVPN-DCO (600 Mbps with WireGuard VPN). It’s the third model since the company introduced the Mudi portable 4G LTE WiFi router in 2019, and followed up with the Mudi V2 (GL-E750V2) 4G LTE router in 2024. The Mudi 7 is a serious upgrade with 2.5GbE, 5G cellular, and WiFi 7 connectivity, and a large 5380 mAh battery good for a full day. It also features two USB-C ports for power and tethering, a 2.8-inch touchscreen display, eight internal antennas, and two TS-9 connectors for external antennas. Mudi 7 specifications: SoC – Unnamed Qualcomm quad-core processor @ 2.2GHz (potentially IPQ9574 quad-core Cortex-A73) System Memory – 2GB LPDDR4X Storage – 8GB eMMC flash Display – 2.8-inch […]

June 4, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Forlinx launches Rockchip RK3572 system-on-module (SoM) and development board with Linux 6.12 BSP

We noticed the Rockchip RK3572 mid-range HMI SoC a couple of months ago, and Forlinx has launched the first system-on-module (FET3572-C SoM) based on the processor, along with a development board (OK3572-C) and BSP (Board Support Package) with a fairly recent Linux 6.12 kernel. The octa-core Cortex-A73/A53 processor features a 4 TOPS NPU (the same as in the RK3588) and targets HMI applications leveraging Edge AI for consumer electronics, industrial control, edge computing, smart security, and in-vehicle terminals. Forlinx FET3572-C Rockchip RK3572 system-on-module Specifications: SoC – Rockchip RK3572 or RK3572J Octa-core CPU – 2x Arm Cortex-A73 @ up to 2.2 GHz+ 2x Arm Cortex-A53 @ up to 2.1 GHz + 4x Arm Cortex-A53 @ up to 2.1 GHz GPU – Arm Mali-G310V2 MC1 with support for OpenGL ES 1.1/2.0/3.2, OpenCL 3.0, and Vulkan 1.4 VPU Hardware Encoding -H.264, H265, 4K @ 60fps Hardware Decoding – H.264, H.265, VP9, AV1, AVS2, […]