Qualcomm 315 5G IoT modem announced for 5G IIoT applications

Qualcomm 5G IoT modem

Qualcomm has announced the Qualcomm 315 5G IoT modem just a couple of days after the company’s introduction of Snapdragon 778G 5G SoC and M.2 5G card reference designs based on Snapdragon X65/62 modem. Qualcomm Technologies say it is their first purpose-built Internet of Things modem solution equipped with 5G connectivity and optimized for Industrial IoT (IIoT) applications. Qualcomm 315 5G IoT modem Qualcomm 315 5G IoT modem specifications: CPU – Cortex-A7 core running Linux Cellular connectivity 5G Technology – 3GPP Rel.15 5G NR Peak speeds – Download: 1.54 Gbps; upload: 330 Mbps Modes – SA (standalone), TDD & FDD RF – Adaptive antenna tuning, power tracking Sub-6 GHz Specs – 100 MHz bandwidth, 4×4 MIMO DL, 64 QAM DL/UL 4G LTE Technology – Rel.15 Cat.13 DL, Cat.5 UL Peak speeds – Download: 400 Mbps; upload: 75 Mbps LTE Modes – TDD & FDD LTE RF – 700 MHz to […]

Snapdragon 778G 5G SoC to power “high-tier” smartphones with up to 16GB LPDDR5

Snapdragon 778G 5G

There used to be “premium mid-range” smartphones, but Qualcomm now calls those “high-tier” smartphones in the recent announcement of Snapdragon 778G 5G processor succeeding Snapdragon 765G/768G 5G mobile platforms. The octa-core Cortex-A78/A55 SoC features a Snapdragon X53 5G Modem supporting up to 3.7 Gbps downlink, support FHD+ display up to 144 Hz, up to 16GB LP-DDR5 memory, and packs 12 TOPS of AI processing power. Snapdragon 778G (SM7325) specifications: CPU – Eight Kryo 670 CPU cores including 4x Arm Cortex-A78 @ 2.4GHz and 4x Arm Cortex-A55 @ 1.8GHz GPU – Adreno 642L with Vulkan 1.1, Snapdragon Elite Gaming features, H.265 and VP9 video decode, HDR10+, HDR10, HLG DSP – Hexagon 770 Processor with fused AI Accelerator architecture, Hexagon Tensor Accelerator, Hexagon Vector eXtensions, Hexagon Scalar Accelerator 2nd generation Qualcomm Sensing Hub Memory – Up to 16 GB LP-DDR5 memory up to 3200 MHz Display On-Device Display – up to FHD+ […]

Qualcomm unveils Snapdragon X65 and X62 5G M.2 card reference designs

Qualcomm 5G M.2 card reference design

Qualcomm has introduced 5G M.2 card reference designs based on Snapdragon X65 and X62 5G modems with the aim of accelerating 5G adoption in PCs, Always-Connected PCs (ACPCs), laptops, Customer Premises Equipment (CPEs), XR, gaming, and other mobile broadband (MBB) devices. The Snapdragon X65 card will allow download speeds of up to 10 Gbps, while the Snapdragon X62 model can handle up to 4.4 Gbps with both versions compliant with 3GPP Release 16, and supporting mmWave and sub-6GHz networks. For those who may not know, reference designs are ready to be manufactured solutions provided by silicon vendors to OEM’s. So Qualcomm will not sell the cards themselves but instead, rely on partners who may manufacture them as is or with some tweaks. Companies committed to either sell cards or include them into their offering include Compal Electronics, Fibocom Foxconn, MeiG Smart, Partron, Quectel, Sierra Wireless, Telit, and others with most […]

MediaTek Dimensity 900 6nm SoC brings UFS 3.1, LPDDR5 to mid-range 5G smartphones

Mediatek Dimensity 900

Arm Cortex-A78 and LPDDR5 would have been premium features not so long ago, but time flies, and the just-announced MediaTek Dimensity 900 5G SoC for mid-range smartphones includes two Cortex-A78 cores, six Cortex-A55 cores, support for LPDRR5/4 memory, UFS 3.1 storage, and of course 5G cellular connectivity up to 2.77Gbps. The mobile processor’s multimedia capabilities are pretty good as well with support for displays up to 2520 x 1080 resolution at 120 Hz, up to 108MP camera, 4Kp30 video with H.265, H.264, AV1, as well as an Arm Mali-G68 MC4 GPU and third-generation APU 3.0 AI accelerator. MediaTek Dimensity 900 specifications: CPU – Octa-core DynamIQ processor with 2x Arm Cortex-A78 @ Up to 2.4GHz, 6x Arm Cortex-A55 @ Up to 2GHz GPU – Arm Mali-G68 MC4 AI Accelerator – MediaTek APU 3.0 VPU Video Encoding – H.264, H.265 / HEVC up to 4K @ 30FPS Video Playback – H.264, H.265 […]

Armv9 architecture to focus on AI, security, and “specialized compute”

Armv9

Armv8 was announced in October 2011 as the first 64-bit architecture from Arm. while keeping compatibility with 32-bit Armv7 code. Since then we’ve seen plenty of Armv8 cores from the energy-efficient Cortex-A35 to the powerful Cortex-X1 core, as long as some custom cores from Arm partners. But Arm has now announced the first new architecture in nearly ten years with Armv9 which builds upon Armv8 but adds blocks for artificial intelligence, security, and “specialized compute” which are basically hardware accelerators or instructions optimized for specific tasks. Armv9 still supports Aarch32 and Aarch64 instructions, NEON, Crypto Extensions, Trustzone, etc…, and is more an evolution of Armv8 rather than a completely new architecture. Some of the new features brought about by Armv9-A include: Scalable Vector Extension v2 (SVE2) is a superset of the Armv8-A SVE found in some Arm supercomputer core with the addition of fixed-point arithmetic support, vector length in multiples […]

Snapdragon 780G 5G SoC announced with 12 TOPs AI performance, triple ISP, WIFI 6E

Qualcomm has just announced an update to its Snapdragon 765G 5G processor with Snapdragon 780G 5G mobile platform equipped with  Qualcomm Spectra 570 triple ISP (Image Signal Processor) and a 6th generation Qualcomm AI Engine that delivers up to 12TOPS AI performance, or twice that of Snapdragon 765G 5G SoC. As a “G” part, Snapdragon 780G comes with Snapdragon Elite Gaming features to improve the gaming experience with updateable GPU drivers, ultra-smooth gaming, and True 10-bit HDR gaming.  Snapdragon 780G also updates its 5G modem with Snapdragon X53 with peak download speeds of 3.3 Gbps on sub-6 GHz frequencies, and supports premium Wi-Fi 6/6E and Bluetooth audio features offered on Snapdragon 888 premium SoC. Snapdragon 780G 5G (SM7350-AB) key features and specifications: CPU – Octa-core Kryo 670 processor with 1x Arm Cortex-A78 @ 2.4GHz, 3x Arm Cortex-A78 @ 2.2GHz, 4x Arm Cortex-A55 @ 1.9GHz GPU – Adreno 642 with support […]

Firefly unveils Core-3568J AI Core Rockchip RK3568 system-on-module & devkit

RK3568 devkit

Firefly has unveiled a new 314-pin SO-DIMM system-on-module (SoM) with Core-3568J AI Core powered by Rockchip RK3568 processor and equipped with up to 8GB RAM, 128GB eMMC flash with interfaces including PCIe, SATA, dual Gigabit Ethernet, HDMI 2.0, eDP 1.3, MIPI DSI and more. The company also provides a development kit for the module with all those interfaces plus an M.2 socket for 5G or WiFi 6 connectivity, and PoE support among other features. Core-3568J AI Core system-on-module Specifications: SoC – Rockchip RK3568 quad-core Cortex-A55 processor @ 2.0 GHz with Arm Mali-G52 2EE GPU with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, 0.8 TOPS NPU for AI acceleration, 4Kp60 H.265/H.264/VP9 video decoding, and 1080p100 H.265/H.264 video encoding System Memory – 2GB, 4GB, or 8GB LPDDR4 ECC RAM up to 1600 MHz Storage – 32GB, 64GB, or 128GB eMMC flash 314-pin SO-DIMM edge connector with: Storage – SATA 3.0 […]

UP Squared Pro SBC gets more I/Os, 3x M.2 sockets, TPM 2.0 security chip

UP Squared Pro SBC

UP Squared Apollo Lake SBC was launched in 2016 via a crowdfunding campaign with a price starting at just 89 Euros for the model with 2GB RAM 16GB storage, and a dual-core Intel Celeron N3350 processor. AAEON has now announced an update simply called UP Squared Pro with many of the same features, but greater expandability and I/O features, for example, to add 5G modules and AI accelerators through one of the three M.2 sockets, as well as improved security via a TPM 2.0 chip. UP Squared Pro (UPN-APL01) specifications with highlights in bold or strikethrough in comparison to the UP Squared specifications (in 2016): SoC (one or the other) Intel Celeron N3350 dual-core “Apollo Lake” processor @ 1.1 GHz / 2.4 GHz with 12 EU Intel HD graphics 500 @ 200 MHz / 650 MHz (6W TDP) Intel Pentium N4200 quad-core “Apollo Lake” processor @ 1.1 GHz / 2.5 […]