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Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on ADLINK OSM-MTK520 – A MediaTek Genio 520-based OSM Size-L system-on-module

ADLINK OSM-MTK520 – A MediaTek Genio 520-based OSM Size-L system-on-module

MediaTek Genio 520 OSM Size L system-on-module

ADLINK OSM-MTK520 is a 45 x 45mm OSM Size-L system-on-module (SoM) powered by a MediaTek Genio 520 AIoT processor with a 10 TOPS NPU for Edge AI workloads. It’s basically an upgrade to the company’s OSM-MTK510 OSM Size-L module with a Genio 510 hexa-core SoC (3.2 TOPS NPU), up to 32GB eMMC flash, and 8GB LPDDR4 with a Genio 520 octa-core SoC (10 TOPS NPU), up to 256GB or 512GB UFS 3.1 storage, and up to 16GB LPDDR5 memory. There are also some minor changes to I/Os with an extra USB OTG interface, DisplayPort instead of HDMI, an extra MIPI CSI camera interface, fewer I2C interfaces, and more GPIOs. ADLINK OSM-MTK520 specifications: SoC – MediaTek Genio 520 (MT8371) CPU – Octa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 6x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU up to 880 MHz […]

Posted on by Debashis Das - No Comments on ADLINK DLAP-701 – An NVIDIA Jetson T5000/T4000 Edge AI platform for humanoid robots and vision sensing systems

ADLINK DLAP-701 – An NVIDIA Jetson T5000/T4000 Edge AI platform for humanoid robots and vision sensing systems

Adlink DLAP 701 Edge AI Platform Powered by NVIDIA Jetson Thor

ADLINK has just launched the DLAP-701 Series, a NVIDIA Jetson T5000/T4000-based compact edge AI platform designed for humanoid robots, autonomous mobile robots (AMR), and vision sensing systems (VSS). It supports up to 128GB LPDDR5X memory and features various I/O options, including dual Gigabit Ethernet, a QSFP port supporting 4×25GbE LAN, multiple USB 3.2 ports, and HDMI output, along with M.2 slots for Wi-Fi 6, 5G, and NVMe storage, as well as an mPCIe slot. It also integrates CAN-FD interfaces for robotics and vehicle control and TPM 2.0 security. With an operating voltage range of 9-36V DC and an industrial temperature range of -20°C to 60°C, it is designed for demanding edge environments. ADLINK DLAP-701 specifications Supported system-on-module – NVIDIA Jetson Thor T5000 or Jetson Thor T4000 Memory – Up to 128GB (T5000 variant), 64 GB (T4000 variant) 256-bit LPDDR5X (273 GB/s bandwidth) Storage 128GB SSD for the OS (most probably ADLINK’s ASD+ industrial […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK Express-PTL Panther Lake COM Express Type 6 module supports up to Intel Core Ultra 7 368H, 128GB DDR5

ADLINK Express-PTL Panther Lake COM Express Type 6 module supports up to Intel Core Ultra 7 368H, 128GB DDR5

ADLINK Express-PTL

ADLINK Express-PTL COM Express Type 6 computer-on-module is built on Intel Core Ultra Series 3 “Panther Lake-H” SoCs up to the 16-core Core Ultra 7 368H processor delivering 180 TOPS of AI performance. The module pairs up to 128 GB DDR5 memory with IBECC support, features high-speed I/O such as PCIe Gen4, multiple display options, USB4/Thunderbolt capability, and industrial features such as TSN Ethernet, TPM 2.0, and advanced power management. As an industrial part, the Express-PTL is designed to operate across an extended –40°C to 85°C temperature range, and targets applications in robotics, industrial automation, medical imaging, transportation, and smart infrastructure. ADLINK Express-PTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 336H 12-core (4P+4E+4LPE) processor up to 1.9 GHz / 4.6 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (37 TOPS), 47 TOPS NPU; TDP: 25W (15-65W cTDP) Intel […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK OSM-IMX95 – An NXP i.MX 95 OSM Size-L system-on-module for IoT and industrial applications

ADLINK OSM-IMX95 – An NXP i.MX 95 OSM Size-L system-on-module for IoT and industrial applications

ADLINK OSM-IMX95

ADLINK OSM-IMX95 is an OSM Size-L solder-on system-on-module powered by an NXP i.MX 95 hexa-core Arm Cortex-A55 SoC with an up to 2 TOPS eIQ Neutron NPU/AI accelerator. It follows the OSM-IMX93 OSM Size-L module based on NXP i.MX 93 SoC, but features a more powerful SoC, up to 16GB LPDDR4L RAM, up to 256GB eMMC flash, and high-speed interfaces like USB 3.0 and PCIe Gen3. The new NXP i.MX 95 OSM module is designed for Smart Home, Smart Building, Smart City, medical, and Industry 4.0 applications. ADLINK OSM-IMX95: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 cores @ up to 1.8 GHz Real-time co-processors – Arm Cortex-M7 @ 800MHz and Cortex-M33 @ 250MHz 2D/3D Graphics Acceleration Arm Mali-G310 3D GPU with OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0 2D GPU Video Encode / Decode – 4Kp30 H.265 and H.264 AI/ML – 2 TOPS eIQ Neutron NPU System […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on cExpress-R8 COM Express Type 6 Compact module features up to Ryzen Embedded 8845HS SoC, supports up to 96GB DDR5

cExpress-R8 COM Express Type 6 Compact module features up to Ryzen Embedded 8845HS SoC, supports up to 96GB DDR5

AMD Ryzen Embedded 8000 COM Express Type 6 Module

ADLINK cExpress-R8 is a COM Express Type 6 Compact CPU module powered by a choice of AMD Ryzen Embedded 8000 SoCs, up to the 8-core Ryzen Embedded 8845HS SKU with up to 39 TOPS of AI performance, support for up to 96GB of DDR5 (ECC or non-ECC) memory, and optional NVMe SSD BGA storage. The module also features an Intel i226 2.5GbE controller, a SEMA board controller, and a debug connector, and exposes all I/Os through two standard 220-pin COM Express board-to-board connectors with four SATA III, up to 16x PCIe Gen4 lanes, DDI, LVDS, and/or eDP interface for up to four displays, and more. cExpress-R8 specifications: Hawk Point SoC (one or the other) AMD Ryzen Embedded 8845HS octa-core processor up to 5.1GHz with 6 WG (WorkGroup) AMD Radeon RDNA 3 Graphics Core; TDP: 35-54W AMD Ryzen Embedded 8840U octa-core processor up to 5.1GHz with 6 WG AMD Radeon RDNA […]

Posted on by Debashis Das - No Comments on ADLINK SBC35-MTL – A 3.5-inch Intel Core Ultra SBC with up to 96GB DDR5, SBC-FM I/O expansion

ADLINK SBC35-MTL – A 3.5-inch Intel Core Ultra SBC with up to 96GB DDR5, SBC-FM I/O expansion

ADLINK SBC35 MTL 3.5 Inch SBC

ADLINK SBC35-MTL 3.5-inch SBC for high-performance edge AI applications is built around Intel Core Ultra (Meteor Lake) SoCs with integrated AI Boost NPU, and is designed to run real-time AI applications in a small footprint. The SBC supports up to 96GB DDR5 memory, 4K quad-display output (HDMI, DP, eDP, USB-C), dual 2.5GbE, and MIPI-CSI for AI cameras. Storage options include SATA and NVMe via M.2, with expansion through M.2 B-Key and E-Key. There is also ADLINK’s SBC-FM connector for additional I/O options. Other features include TPM 2.0, USB/serial I/O, wide 12–24V input, and a compact fanless design rated for 0°C to 60°C operation. ADLINK SBC35-MTL specifications: Meteor Lake SoC – Intel Core Ultra with either 15W (MTL-U) or 28W (MTL-H) TDP options 15W (MTL-U) Intel Core Ultra 5 125U 12-core (2P+8E+2LPE) processor @ 1.3 / 4.3 GHz with 12MB cache, Intel 4Xe LPG graphics @ 1.85 GHz, Intel AI Boost […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK COM-HPC-mMTL – A COM-HPC Mini Computer-on-Module with up to 16-core Intel Core Ultra 7 165H processor

ADLINK COM-HPC-mMTL – A COM-HPC Mini Computer-on-Module with up to 16-core Intel Core Ultra 7 165H processor

COM-HPC-mMTL 16-core Intel Core Ultra COM-HPC Mini

ADLINK COM-HPC-mMTL is an industrial-grade COM-HPC Mini Computer-on-Module based on Intel Meteor Lake processors up to the 16-core Intel Core Ultra 7 165H featuring Intel Arc Graphics with eight Xe cores, Intel AI Boost NPU up to 8.2 TOPS, and 16x PCIE Gen4 lanes. The COM-HPC R1.2-compliant Mini size module also supports up to 64GB LPDDR5x memory soldered directly onto the board, an optional NVMe BGA SSD, and features two SATA interfaces, two 2.5 Gbps Ethernet, multiple DDI/USB4, and USB 3.0/2.0 through the standard 400-pin board-to-board connector of the 95x70mm CoM. ADLINK COM-HPC-mMTL specifications: Meteor Lake H/U SoC (one or the other) Intel Core Ultra 7 165H 16-core (6P+8E+2LPE) processor @ up to 5.0 / 3.8 / 2.5 GHz with 24MB cache, 8x Xe-cores Intel Arc graphics @ 2.35 GHz, Intel AI Boost NPU; TDP: 28W Intel Core Ultra 7 155H 16-core (6P+8E+2LPE) processor @ up to 4.8 / 3.8 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

OSM-MTK510

ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]

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