High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

COM-HPC Mini Academy

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]

NXP i.MX 95 SMARC 2.1 system-on-modules – ADLINK LEC-IMX95 and iWave iW-RainboW-G61M

SMARC 2.1 development board NXP i.MX95

Several companies have unveiled SMARC 2.1 compliant system-on-modules powered by the NXP i.MX 95 AI SoC, and today we’ll look at the ADLINK LEC-IMX95 and iWave Systems iW-RainboW-G61M and related development/evaluation kits. The NXP i.MX 95 SoC was first unveiled at CES 2023 with up to six Cortex-A55 application cores, a Cortex-M33 real-time core, and a low-power Cortex-M7 core, as well as an eIQ Neutron NPU for machine learning applications. Since then a few companies have unveiled evaluation kits and system-on-modules such as the Toradex Titan evaluation kit or the Variscite DART-MX95 SoM, but none of those were compliant with a SoM standard, but at least two SMARC 2.1 system-on-modules equipped with the NXP i.MX 95 processor have been introduced. ADLINK LEC-IMX95 Specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB […]

ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

Intel Amston Lake COM Express module

ADLINK has released two Intel Atom X7000RE & x7000C Amston Lake-powered modules with the cExpress-ASL COM Express Type 6 Compact module and the LEC-ASL SMARC 2.1 system-on-module both offered with up to 16GB LPDDR5 soldered-down memory and 2.5GbE networking. The modules are designed for high-performance, low-power, and ruggedized edge solutions running 24/7, and with support for Intel TCC and Time Sensitive Networking (TSN), the modules are also suitable for hard-real-time computing workloads required by use cases such as industrial automation, AI robots, smart retail, transportation, network communication, and more. Intel Atom x7000RE and x7000C Amston Lake processors The announcement came as a surprise because I had never heard about Intel Amston Lake processors so far. It might be because they were just announced and all seven SKUs are embedded parts with two to eight cores, and as a result, they may not quite get as much coverage as consumer processors. […]

ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93

ADLINK OSM-IMX93 is an OSM r1.1 Size-L module based on NXP i.MX 93 Arm Cortex-A55 & Cortex-M33 AI processor, and the first from the company to comply with the Open Standard Module (OSM) standard. The 45x45mm module is fitted with up to 2GB LPDDR4L, 128GB eMMC flash, an optional WiFi/Bluetooth module, and its 662 contacts provide a range of interfaces that include LVDS and DSI graphics output, 2x GbE (including 1x TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and more. ADLINK OSM-IMX93 specifications: SoC – NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Memory – 640 KB OCRAM w/ ECC Security – EdgeLock Secure Enclave System Memory – 1 or 2GB LPDDR4L Storage […]

ADLINK MXA-200 5G IIoT gateway ships with Debian or Yocto Linux

ADLINK MXA-200 5G industrial gateway

ADLINK MXA-200 is an NXP i.MX8M Plus-based 5G IIoT gateway running Debian or a Yocto-based Linux distribution with two RS-232/422/485 isolated serial ports, two gigabit Ethernet ports, two USB 3.0 port, and an operating temperature range of -20 to 70°C. The fanless gateway also features two M.2 slots for integrating Wi-Fi and/or 4G LTE or 5G modules, and ADLINK expected the MXA-200 to find its way into renewable energy applications, EV chargers, smart city and smart factory applications that require big data collection, cloud-based applications, and video related monitoring solutions. ADLINK MXA-200 specifications: SoC – NXP i.MX8M Plus CPU – Quad-core Arm Cortex-A53 processor @ 1.6/1.8GHz MCU – Arm Cortex-M7 real-time core @ 400 MHz GPU – Vivante GC520L 2D GPU, Vivante GC7000UL 3D GPU VPU – 1080p60 hardware decoder (HEVC, H.264, VP9, and VP8) and encode (H.265/H.264) AI accelerator – 2.3 TOPS NPU System Memory – 2GB or 4GB […]

COM Express Type 6 Compact module features 14th gen Intel Core Ultra “Meteor Lake” processor

Intel Core Ultra COM Express

ADLINK cExpress-MTL is a COM Express Type 6 Compact module based on the just-announced 14th gen Intel Core Ultra “Meteor Lake” processor family with up to fourteen CPU cores in 6P+8E configuration, eight Xe-cores (128 EUs), and an NPU (11pTOPS/8.2eTOPS) in a 15 or 28W TDP thermal configuration delivering up to 1.9x the GPU performance of the previous generation (Raptor Lake). The power consumption will also be lower thanks to Intel Core Ultra’s new Low-Power E-cores that are 30 to 50% more efficient than the E-cores in 13th gen Intel Core processors, and the faster GPU and built-in NPU will enable hardware-accelerated AV1 encoding/decoding and various devices leveraging AI such as portable medical ultrasound devices, industrial automation, autonomous driving, AI robots, and more. cExpress-MTL specifications: Meteor Lake-H/U SoC (one of the other) Intel Core Ultra 7 MS3 165H 16-core (6P+8E+2LPE) processor @ 1.4 / 5.0 GHz with 24MB cache, Intel […]

AMD Ryzen Embedded V3000 COM Express Type 7 module supports up to 64GB DDR5 memory

AMD Ryzen V3000 COM Express Module

ADLINK Express VR7 is a COM Express Basic size Type 7 computer-on-module powered by the eight-core AMD Ryzen Embedded V3000 processor with two 10GbE interfaces, fourteen PCIe Gen 4 lanes, and optional support for the “extreme temperature range” between -40°C and 85°C. The COM Express module supports up to 64GB dual-channel DDR5 SO-DIMM  (ECC/non-ECC) memory and targets headless embedded applications such as edge networking equipment, 5G infrastructure at the edge, video storage analytics, intelligent surveillance, industrial automation and control, and rugged edge servers. Express-VR7 specifications: SoC – AMD Embedded Ryzen V3000 (one or the other Ryzen V3C48 8-core/16-thread processor @ 3.3/3.8GHz; TDP: 45W Ryzen V3C44 4-core/8-thread processor @ 3.5/3.8GHz; TDP: 45W Ryzen V3C18I 8-core/16-thread processor 1.9/3.8GHz; TDP: 15W (useful in the extreme temperature range) Ryzen V3C16 6-core/12-thread processor 2.0/3.8GHz; TDP: 15W Ryzen V3C14 4-core/8-thread processor 2.3/3.8GHz; TDP: 15W System Memory – Up to 64GB (2x 32GB) dual-channel ECC/non-ECC DDR5 memory […]

Giveaway Week 2023 – i-Pi SMARC 1200 devkit with Mediatek Genio 1200 Cortex-A78/A55 SoC

i-Pi SMARC 1200 Yocto Linux glmark2 benchmark

We’ll end this year’s Giveaway Week with a pretty powerful development kit – ADLINK i-Pi SMARC 1200 – powered by a MediaTek Genio 1200 octa-core processor with four Cortex-A78 cores @ up to 2.2 GHz, four Cortex-A55 cores, an Arm Mali Mali-G57 MC5 GPU, 4K hardware video decoding and decoding support, and a 4.8 TOPS NPU. The mainboard is comprised of a SMARC 2.1-compliant system-on-module with 4GB LPDDR4 memory and 64GB UFS storage and fitted with a heatsink for cooling as well as a carrier board with a 4Kp60 capable HDMI 2.0 port, two Gigabit Ethernet ports, two USB 3.0 ports, two USB 2.0 ports, a 3.5mm audio jack, two 40-pin headers for I/Os including one compatible with the 40-pin Raspberry Pi GPIO header, plus LVDS connectors, MIPI CSI camera connectors, and M.2 expansion slots for storage and/or wireless expansion. I tested the MediaTek Genio 1200 devkit with a Yocto […]

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