Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux. We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability. Advantech MIO-5355 specifications: SoC (one or the other) Qualcomm DragonWing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU […]
Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC
Advantech SOM-6820 is a COM Express Type 6 Compact Computer-on-Module powered by a Qualcomm Snapdragon X Elite SoC with up to twelve 64-bit Arm Oryon cores, instead of an x86 processor from Intel or AMD, more commonly found on COM Express modules. The COM also features up to 64GB LPDDR5 memory, two MIPI CSI camera connectors, an RTL8153B USB 3.0 Gigabit Ethernet controller, and a TPM 2.0 security chip. All I/Os are exposed through two standard 220-pin B2B connectors, including DisplayPort and LVDS/eDP interfaces for up to four 4K displays, up to four SATA III for storage, twelve USB 3.0/2.0 interfaces, multiple PCIe Gen4/3 interfaces, and more. With up to 45 TOPS of AI performance, the SOM-6820 is especially well-suited to medical imaging and machine vision applications as well as mission-critical systems and humanoid robots. Advancec SOM-6820 specifications: Snapdragon X Elite SoC variants (one or the other) X1E-00-1DE 12-core up […]
Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs
The Qualcomm Dragonwing IQ-X family, comprised of the IQ-X7181 and IQ-X5181 SoCs, offers eight or twelve Oryon cores clocked at up to 3.4 GHz, an Adreno GPU, and up to 45 TOPS of AI performance for industrial PCs running Windows LTSC. Those are upgrades to the Dragonwing IQ9/IQ8/IQ6 SoCs introduced last year, offering faster cores, higher speed interfaces, and more. The IQ-X chips support up to 64GB LPDDR5x memory, UFS 4.0 and SD 3.0 storage, eDP and USB-C display interfaces, up to six cameras, PCIe Gen4 connectivity for optional Ethernet, WiFi 7, and 5G cellular connectivity, and feature eleven USB interfaces and 221 GPIOs. As industrial-grade parts, they are rated for -40°C to 105°C operation. Qualcomm DragonWing IQ-X7181 and IQ-X5181 specifications: CPU IQ-X5181 – Custom Qualcomm Oryon 8-core 64-bit Armv8 CPU clocked up to 3.4 GHz IQ-X7181 – Custom Qualcomm Oryon 12-core 64-bit Armv8 CPU clocked up to 3.4 GHz […]
Advantech unveils NXP i.MX 95 SMARC 2.2 and OSM Size L system-on-modules
Advantech has introduced two new NXP i.MX 95 system-on-modules: the AOM-5521, compliant with the SMARC 2.2 standard, and the solder-on AOM-2521 OSM Size L system-on-module. With up to six Arm Cortex-A55 cores running at up to 2.0 GHz, a dedicated 2 TOPS NPU, and up to 8GB LPDDR4/5 memory, the AOM-5521 and AOM-2521 modules target industrial automation, medical devices, intelligent vision systems, and other Edge AI and IoT applications. AOM-5521 SMARC 2.1 CPU module AOM-5521 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode […]
AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU
AMD has recently “announced” the Ryzen Embedded 8000 Series processors in a community post with the latest AMD embedded devices combining a 16 TOPS NPU based on the AMD XDNA architecture with CPU and GPU elements for a total of 39 TOPS designed for industrial artificial intelligence. The Ryzen Embedded 8000 CPUs will be found in machine vision, robotics, and industrial automation applications to enhance the quality control and inspection processes, enable real-time, route-planning decisions on-device for minimal latency, and predictive maintenance, and autonomous control of industrial processes. AMD Ryzen Embedded 8000 key features and shared specifications: CPU – Up to 8 “Zen 4” cores, 16 threads Cache L1 Instruction Cache – 32 KB, L1 Data Cache = 32 KB (per core) L2 Cache – Up to 8 MB (total) L3 Cache- Up to 16 MB unified Graphics – RDNA 3 graphics with up to 6 WGPs (Work Group processors) […]
AMD Ryzen Embedded 5000 Series CPUs show up in Micro-ATX motherboard
Advantech has announced the AIMB-522 industrial Micro-ATX motherboard with AMD Ryzen Embedded 5000 Series Zen3 processors for AI image processing in automation and surveillance applications. I had never heard about “Ryzen Embedded 5000 Series” processors, but that motherboard comes with a choice of new SKUs such as the 12-core Ryzen 5950E, the 10-core Ryzen 5900E, the 8-core Ryzen 5800E, and the 6-core Ryzen 5600E, as well as existing Ryzen 5000 desktop processors. AIMB-522 Micro-ATX motherboard specifications: Processor (one or the other) Ryzen 5950E 12-core processor @ up to 3.4 GHz with 64MB L3 cache; TDP: 105W Ryzen 5900E 10-core processor @ up to 3.7 GHz with 64MB L3 cache; TDP: 105W Ryzen 5800E 8-core processor @ up to 3.7 GHz with 32MB L3 cache; TDP: 100W Ryzen 5600E 6-core processor @ up to 3.6 GHz with 32MB L3 cache; TDP: 65W Ryzen 5950X 16-core processor @ up to 3.4 GHz […]
AMD unveils Ryzen Embedded R2000 Series processors with up to four cores, quad-display support
As expected, AMD has now launched the Ryzen Embedded R2000 series processors that build up on the earlier Ryzen Embedded R1000 family, but doubles the number of cores to up to four, gets improved Radeon graphics, and adds support for Windows 11 operating system. Performance and efficiency have also improved with the new Ryzen Embedded R2514 CPU exhibiting up to 81 percent higher CPU (Passmark v10) and graphics (3DMark) performance compared to Ryzen Embedded R1606G processor, as well as higher performance-per-watt efficiency thanks to the Zen+ core architecture. The company has four Ryzen Embedded R2000 processors in its portfolio at launch. Key features and specifications include: Memory – 2,400 to 3,200 MT/s (depending on SKU) DDR4 dual-channel memory support Storage – 2x SATA 3.0, NVMe support 16 lanes of PCIe Gen3, except for R2312 limited to just 8 lanes Up to four independent 4Kp60 displays using DisplayPort 1.4, HDMI 2.0b, […]
NXP i.MX 8M Plus 2.5-inch Pico-ITX SBC supports UIO40-Express expansion modules
With NXP i.MX 8M Plus AI processor nearing mass production, we’ve seen many companies introduce i.MX 8M Plus systems-on-module at Embedded World 2021. But as one would come to expect, there should also be single board computers based on the new processor, and Advantech has unveiled the RSB-3720 2.5-inch SBC (aka Pico-ITX SBC) compatible with the company’s UIO40-Express expansion boards. RSB-3720 specifications: SoC – NXP i.MX8M Plus dual or quad-core Arm Cortex-A53 processor up to 1.8GHz (1.6 GHz for industrial temperature range) with Cortex-M7 real-time core, Vivante GC7000UL 3D GPU, 1080p60 H.265/H.264/VP9 decoder, 1080p60 H.265/H.264 encoder, 2.3 TOP/s Neural Network Accelerator System Memory – 4GB or 6GB LPDDR4 4000MT/s Storage – 16 GB eMMC Flash for OS, 8 MB QSPI NOR Flash for board information, microSD socket Video Output – HDMI 2.0a up to 3840 x 2160 at 30Hz Single or dual-channel 24 Bit LVDS with backlight power, 5/12V, Max. […]

