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Posted on by Debashis Das - 4 Comments on SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

SolidRun P100 COM Express Type 6 module features LPCAMM2 memory, up to 12-core AMD Ryzen AI Embedded P185 SoC

Ryzen AI Embedded P100 COM Express module

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced its new P100 COM Express Type 6 module family. These compact (95 x 95mm) modules are among the first to support the newly released 8- to 12-core Zen 5 SKUs, with up to 50 TOPS from the NPU and 80 TOPS of total system AI. Another fairly unique feature of the new SolidRun computer-on-module is support for LPCAMM2 LPDDR5X memory. The company uses a screw-lock mechanism to deliver high-bandwidth LPDDR5X performance (up to 9600 MT/s) while maintaining the mechanical reliability required for “systems in motion,” such as autonomous mobile robots (AMRs), heavy machinery, and rail systems. A mini-ITX development kit for the module is also available. SolidRun P100 COM Express Type 6 module SolidRun P100 COM Express Type 6 module specifications: AMD Ryzen AI Embedded P100 Series […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK Express-PTL Panther Lake COM Express Type 6 module supports up to Intel Core Ultra 7 368H, 128GB DDR5

ADLINK Express-PTL Panther Lake COM Express Type 6 module supports up to Intel Core Ultra 7 368H, 128GB DDR5

ADLINK Express-PTL

ADLINK Express-PTL COM Express Type 6 computer-on-module is built on Intel Core Ultra Series 3 “Panther Lake-H” SoCs up to the 16-core Core Ultra 7 368H processor delivering 180 TOPS of AI performance. The module pairs up to 128 GB DDR5 memory with IBECC support, features high-speed I/O such as PCIe Gen4, multiple display options, USB4/Thunderbolt capability, and industrial features such as TSN Ethernet, TPM 2.0, and advanced power management. As an industrial part, the Express-PTL is designed to operate across an extended –40°C to 85°C temperature range, and targets applications in robotics, industrial automation, medical imaging, transportation, and smart infrastructure. ADLINK Express-PTL specifications: SoC – Intel Core Ultra Series 3 Panther Lake-H processors (one or the other) Intel Core Ultra 5 336H 12-core (4P+4E+4LPE) processor up to 1.9 GHz / 4.6 GHz (Turbo) with 18MB cache, 4-core Xe3 graphics (37 TOPS), 47 TOPS NPU; TDP: 25W (15-65W cTDP) Intel […]

Posted on by Debashis Das - No Comments on Congatec conga-TCRP1 COM Express Type 6 module features AMD Ryzen AI Embedded P100 SoC with 50 TOPS NPU

Congatec conga-TCRP1 COM Express Type 6 module features AMD Ryzen AI Embedded P100 SoC with 50 TOPS NPU

conga TCRP1 COM Express Compact (Type 6) module with AMD Ryzen AI Embedded P100 Series SoCs

Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 Series processors, which feature AMD’s latest Zen 5 architecture, RDNA 3.5 graphics, and an XDNA 2 NPU for 59 TOPS of combined AI performance, including up to 50 TOPS from the NPU. The module supports up to 96 GB of DDR5-5600 memory and is available in 4-core and 6-core variants with a configurable 15 W to 54 W TDP, allowing both passive and active cooling designs. It supports up to four independent displays, offers PCIe Gen4 and PEG x4 expansion, and includes 2.5 GbE, USB 3.2 Gen 2, and USB 2.0 ports, along with SATA or optional onboard NVMe storage options. Additional features include TPM 2.0, UEFI firmware, and hardware monitoring. The module is available in both commercial and industrial variants with operating temperatures down to -40 °C, which […]

Posted on by Debashis Das - No Comments on SECO’s COM Express Type 6 module features Intel Core Ultra Series 3 Panther Lake-H processor with up to 180 TOPS

SECO’s COM Express Type 6 module features Intel Core Ultra Series 3 Panther Lake-H processor with up to 180 TOPS

SECO SOM COMe BT6 PTL COM Express Type 6 module

We have just covered Vecow’s new TGS-2000 series of Edge AI computers built around Intel’s new Panther Lake-H SoCs, and now SECO has announced the SOM-COMe-BT6-PTL, a COM Express Type 6 Basic module which supports the higher-end 16-core Core Ultra X9 series processors and can deliver up to 180 TOPS of AI performance. The module follows the COM Express Release 3.1 Type 6 Basic form factor (125 × 95 mm), supports up to 128GB DDR5 memory via dual SO-DIMM slots, offers high-speed expansion through PCIe Gen4/Gen5, USB 4.0/Thunderbolt, and 2.5Gbps Ethernet, and provides multiple display interfaces including eDP, DP++, and HDMI. It is available with an optional industrial temperature range and is designed for rugged and mission-critical applications. SECO SOM-COMe-BT6-PTL Specifications: Panther Lake SoC (one or the other) Intel Core Ultra X9 388H – 16-core (4P + 8E + 4LPE) processor up to 1.6 GHz / 5.1 GHz (Turbo), 18MB cache, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Ryzen Embedded 8840U COM Express Type 6 Compact module takes up to 128GB DDR5

AMD Ryzen Embedded 8840U COM Express Type 6 Compact module takes up to 128GB DDR5

SolidRun Ryzen R8000 COM6 Compact Module

SolidRun has unveiled a new COM Express Type 6 Compact module powered by the AMD Ryzen Embedded 8840U Series with up to 39 TOPS of AI performance for industrial, medical, automation, and edge AI applications. The module supports up to 128GB DDR5 of memory via two SO-DIMM sockets, on-module M.2 NVME SSD storage, and features an Intel i226 2.5GbE controller. It exposes I/Os through standard board-to-board connectors, including 16-lane PCIe Gen4, four DisplayPort video outputs, eDP or LVDS display interface, two SATA, various USB ports, and more. Ryzen R8000 CoM6 specifications: SoC – AMD Ryzen Embedded 8840U CPU – 8-core/16-thread Zen4 processor up to 3.3 GHz / 5.1 GHz (Turbo) GPU – AMD Radeon 780M with 12x Compute Units @ 2700 MHz (RDNA3 graphics) AI 16 TOPS NPU (AMD XDNA) Total combined 39 TOPS of AI performance Memory – 2x SODIMM DDR5-5600 with/without ECC up to 128GB RAM Storage – […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC

Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC

Advantech SOM 6820

Advantech SOM-6820 is a COM Express Type 6 Compact Computer-on-Module powered by a Qualcomm Snapdragon X Elite SoC with up to twelve 64-bit Arm Oryon cores, instead of an x86 processor from Intel or AMD, more commonly found on COM Express modules. The COM also features up to 64GB LPDDR5 memory, two MIPI CSI camera connectors, an RTL8153B USB 3.0 Gigabit Ethernet controller, and a TPM 2.0 security chip. All I/Os are exposed through two standard 220-pin B2B connectors, including DisplayPort and LVDS/eDP interfaces for up to four 4K displays, up to four SATA III for storage, twelve USB 3.0/2.0 interfaces, multiple PCIe Gen4/3 interfaces, and more. With up to 45 TOPS of AI performance, the SOM-6820 is especially well-suited to medical imaging and machine vision applications as well as mission-critical systems and humanoid robots. Advancec SOM-6820 specifications: Snapdragon X Elite SoC variants (one or the other) X1E-00-1DE 12-core up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on COM Express Type 6 module targets Edge AI applications with an up 99 TOPS Intel Core Ultra 9 “Arrow Lake” CPU

COM Express Type 6 module targets Edge AI applications with an up 99 TOPS Intel Core Ultra 9 “Arrow Lake” CPU

COM Express Type 6 Intel Core Ultra 9 285H Arrow Lake CPU module

AAEON COM-ARHC6 is a COM Express Type 6 Compact module powered by a choice of Intel Arrow Lake processors up to the 16-core Core Ultra 9 285H processor, delivering up to 99 TOPS for high-performance Edge AI applications such as diagnostic imaging equipment and automated optical inspection. The Computer-on-Module features two SO-DIMM sockets for up to 128GB DDR5 at 6400MHz, an optional 256GB NVMe SSD BGA chip, a 2.5GbE controller, two MIPI CSI connectors, and two standard 220-pin board-to-board connectors exposing SATA, display (HDMI, DP, LVDS/eDP, VGA), SATA, and USB interfaces, as well as several PCIe and PEG interfaces. COM-ARHC6 COM Express Type 6 Compact Arrow Lake Computer-on-Module AAEON COM-ARHC6 specifications: Arrow Lake-H SoC Intel Core Ultra 5 225H 14-core (4P+8E+2LPE) processor up to 4.9 GHz (P) / 4.3 GHz (E) / 2.5 GHz (LPE) with 18MB cache, 7x Xe Intel Arc 130T GPU (63 TOPS), Intel AI Boost (13 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on cExpress-R8 COM Express Type 6 Compact module features up to Ryzen Embedded 8845HS SoC, supports up to 96GB DDR5

cExpress-R8 COM Express Type 6 Compact module features up to Ryzen Embedded 8845HS SoC, supports up to 96GB DDR5

AMD Ryzen Embedded 8000 COM Express Type 6 Module

ADLINK cExpress-R8 is a COM Express Type 6 Compact CPU module powered by a choice of AMD Ryzen Embedded 8000 SoCs, up to the 8-core Ryzen Embedded 8845HS SKU with up to 39 TOPS of AI performance, support for up to 96GB of DDR5 (ECC or non-ECC) memory, and optional NVMe SSD BGA storage. The module also features an Intel i226 2.5GbE controller, a SEMA board controller, and a debug connector, and exposes all I/Os through two standard 220-pin COM Express board-to-board connectors with four SATA III, up to 16x PCIe Gen4 lanes, DDI, LVDS, and/or eDP interface for up to four displays, and more. cExpress-R8 specifications: Hawk Point SoC (one or the other) AMD Ryzen Embedded 8845HS octa-core processor up to 5.1GHz with 6 WG (WorkGroup) AMD Radeon RDNA 3 Graphics Core; TDP: 35-54W AMD Ryzen Embedded 8840U octa-core processor up to 5.1GHz with 6 WG AMD Radeon RDNA […]