congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

Alder Lake COM-HPC COM Express

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

COM-HPC Alder Lake-H

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

COM Express Type 10 Tiger Lake UP3 module targets embedded mobile applications

NanoCOM-TGU

AAEON NanoCOM-TGU is a COM Express Type 10 module powered by the 11th generation Intel Tiger Lake UP3 designed for embedded mobile applications, potentially leveraging AI and Deep Learning acceleration engines from the processor with use cases ranging from telematics, Smart Cities, and industrial automation. The NanoCOM-TGU supports up to 16GB LPDDR4x memory with in-band ECC, up to 256GB PCIe NVMe SSD, and offers two SATA 3.0 interfaces, 2.5GbE networking, DDI and eDP video outputs, as well as ten USB ports and four PCI Express x1 interfaces.   NanoCOM-TGU specifications: SoC – Intel Tiger Lake UP3 “E” or “GRE” processor with Intel UHD Graphics from Celeron 6305E up to Core i7-1185G7E/1185GRE @ 1.8 GHz /4.4 GHz; 15W TDP System Memory – Up to 16GB onboard LPDDR4x-4266 memory in-band ECC supported by SoC Storage – Up to 256GB onboard NVMe SSD Networking – Intel i225-LM 2.5GbE controller COM Express Type 10 […]

COM Express Type 6 module supports up to 64GB ECC RAM, 2.5GbE, 4 displays, and more

COM Express Type 6 module ECC RAM

Here’s another Tiger Lake UP3 COM Express module courtesy of AAEON with the COM-TGUC6 COM Express Compact Type 6 modules equipped with a choice of Celeron. Core i3/i5/i7 embedded processors from the 11th generation Tiger Lake family. The module supports up to 64 GB ECC RAM via two SO-DIMM sockets, 2.5 Gpbs Ethernet, up to four independent displays via LVDS, VGA, and 4K DDI interfaces, SATA storage, PCIe Gen 3 & Gen4, and more for industrial. medical, and military applications. COM-TGUC6 specifications: Tiger Lake UP3 SoC (one or the other) Intel Core i7-1185G7E/GRE quad-core/octa-thread processor @ 1.8/4.4 GHz with 12 MB cache, 96 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i7-1145G7E/GRE quad-core/octa-thread processor @ 1.5/4.1 GHz with 8 MB cache, 80 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i3-1115G4E/GRE dual-core/quad-thread processor @ 2.2/3.9 GHz with 6 MB cache, 48 EU […]

Portwell COM Express Tiger Lake-H module supports 2.5GbE, PCIe Gen 4, 8K, up to 64GB DDR4

Portwell PCOM-B657VGL COM Express TIger Lake-H

Portwell PCOM-B657VGL joins other COM Express and COM HPC modules based on Intel Tiger Lake-H Xeon, Core, and Celeron embeddded processors such as ADLINK Express-TL and Congatec conga-HPC/cTLH. Just like its competitors, the Portwell COM Express Type 6 Basic module offers 8K video output, PCIe x16 Gen 4, up to 64GB DDR4, USB 3.2 Gen 2, and 2.5GbE networking for a wide range of higher-end embedded applications such as industrial automation, medical equipment, graphics-intensive applications, and artificial intelligence. Portwell PCOM-B657VGL specifications: SoC (one or the other) General Embedded Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 16EU Intel UHD graphics, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 16EU Intel UHD graphics, 45/35W cTDP Intel Core i5-11500HE processor with 6 cores / 12 threads @ 2.6GHz (up to 4.1GHz in Turbo […]

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

QSeven_vs_SMARC

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Tiger Lake-H COM-HPC & COM Express CPU modules

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

Express-TL Tiger Lake-H COM Express module offers 8K video, PCIe Gen4 x16 connectivity

Tiger Lake-H COM Express

We just noticed some Intel Tiger Lake-H Xeon/Core/Celeron processors for embedded systems last week, and at the time it was not clear when they’d be announced and/or become available. It turns out it did not take long, as ADLINK has just unveiled their TL-Express COM Express Basic Size Type 6 module with the new processors. The new computer-on-module offers a more powerful alternative to the company’s cExpress-TL Tiger Lake UP3 COM Express Compact module, with up to 8 cores/16 threads, 128 GB memory, 8K video output, support for -40°C – 85°C industrial temperature range, and the company also claims it is the first COM Express module to support PCI Express Gen 4 x16, doubling the bandwidth of previous COM Express modules in the market. Express-TL COM Express Compact 6 CPU module specifications: Tiger Lake-H Embedded SoC (one or the other) Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 […]