Selecting Raptor Lake COM-HPC or COM Express modules for your application (Sponsored)

COM Express vs COM HPC Raptor Lake modules

ADLINK Technology introduced the COM-HPC-cRLS (Raptor Lake-S) COM-HPC size C module and Express-RLP Raptor Lake-P COM Express Type 6 module at the beginning of the year, and while we covered the specifications for both in detail at the time of the announcement, we’ll compare the advantages and benefits of the two types of 13th generation Raptor Lake modules in this post and compare 12th gen Alder Lake-S and 13th Gen Raptor Lake-S processor performance to help potential buyers select the right one for their applications. Raptor Lake COM-HPC vs COM Express vs modules The table above provides a high-level comparison between the COM-HPC-cRLS (Raptor Lake-S) and the Express-RLP (Raptor Lake-P) modules. The Raptor Lake-S socketed processor family found in the COM-HPC provides more processing power, supports up to 128GB DDR5, and the COM-HPC standard adds support for PCIe Gen5 which is not possible with the COM Express standard. The Raptor […]

IoT Prototype Kit is powered by an Alder Lake-H COM Express module with up to Core i5-12600HE CPU

IoT Prototype Kit Intel Alder Lake-P module

ADLINK has launched an IP-i IoT Prototype Kit based on their Express-ADP COM Express Type 6 Basic “Alder Lake-H” module with either an Intel Core i5-12600HE 12-core (4P+8E) processor clocked at up to 4.5 GHz or a Core i3-12300HE 8-core (4P+4E) processor reaching up to 4.3 GHz. The kit also includes the Express-BASE6 R3.1 carrier board, a thick heatsink with an active fan, a debug board (DB30 x86), and various cables for SATA storage, a DB9 COM port, and I/Os, and the kit can be used to develop applications for industrial automation and control, medical ultrasound, image processing and analysis, high-speed video encoding and streaming, predictive traffic analysis, multi camera-based AI, etc… The Express-ADP module supports up to 64GB DDR5 memory, optional on-module NVMe storage, up to 4x 4K displays, multiple PCIe Gen4 and Gen3 interfaces, SATA 3.0, and so on. You’ll find detailed Express-ADP COM Express module specifications in […]

COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors

Express-RLP Raptor Lake-P COM Express

ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

Alder Lake COM-HPC COM Express

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

COM-HPC Alder Lake-H

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

COM Express Type 10 Tiger Lake UP3 module targets embedded mobile applications

NanoCOM-TGU

AAEON NanoCOM-TGU is a COM Express Type 10 module powered by the 11th generation Intel Tiger Lake UP3 designed for embedded mobile applications, potentially leveraging AI and Deep Learning acceleration engines from the processor with use cases ranging from telematics, Smart Cities, and industrial automation. The NanoCOM-TGU supports up to 16GB LPDDR4x memory with in-band ECC, up to 256GB PCIe NVMe SSD, and offers two SATA 3.0 interfaces, 2.5GbE networking, DDI and eDP video outputs, as well as ten USB ports and four PCI Express x1 interfaces.   NanoCOM-TGU specifications: SoC – Intel Tiger Lake UP3 “E” or “GRE” processor with Intel UHD Graphics from Celeron 6305E up to Core i7-1185G7E/1185GRE @ 1.8 GHz /4.4 GHz; 15W TDP System Memory – Up to 16GB onboard LPDDR4x-4266 memory in-band ECC supported by SoC Storage – Up to 256GB onboard NVMe SSD Networking – Intel i225-LM 2.5GbE controller COM Express Type 10 […]

COM Express Type 6 module supports up to 64GB ECC RAM, 2.5GbE, 4 displays, and more

COM Express Type 6 module ECC RAM

Here’s another Tiger Lake UP3 COM Express module courtesy of AAEON with the COM-TGUC6 COM Express Compact Type 6 modules equipped with a choice of Celeron. Core i3/i5/i7 embedded processors from the 11th generation Tiger Lake family. The module supports up to 64 GB ECC RAM via two SO-DIMM sockets, 2.5 Gpbs Ethernet, up to four independent displays via LVDS, VGA, and 4K DDI interfaces, SATA storage, PCIe Gen 3 & Gen4, and more for industrial. medical, and military applications. COM-TGUC6 specifications: Tiger Lake UP3 SoC (one or the other) Intel Core i7-1185G7E/GRE quad-core/octa-thread processor @ 1.8/4.4 GHz with 12 MB cache, 96 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i7-1145G7E/GRE quad-core/octa-thread processor @ 1.5/4.1 GHz with 8 MB cache, 80 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i3-1115G4E/GRE dual-core/quad-thread processor @ 2.2/3.9 GHz with 6 MB cache, 48 EU […]

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