Small (45x43mm) system-on-module packs Rockchip RK3562 AIoT SoC, 16GB eMMC, 2GB RAM, and PMIC

Rockchip RK3562 development board

MIYR Tech MYC-YR3562 is a small 45x43mm system-on-module that packs a Rockchip RK3562 or RK3562J quad-core Cortex-A53 AIoT SoC with a 1 TOPS AI accelerator, up to 2GB LPDDR4, 16GB eMMC flash, 32 Kbit EEPROM, and a PMIC. To keep the module small while making no compromise on the number of I/Os offered, the company designed the module with 164 castellated holes (LCC – ) and 58 pads (LGA). That means the MYC-YR3562 system-on-module gets all interfaces from the RK3562(J) SoC, including Gigabit Ethernet, USB 3.0, PCIe 2.1, RGB, LVDS, and MIPI-DSI interfaces, camera inputs (MIPI-CSI), and a range of low-speed I/Os. MYC-YR3562 SoM specifications SoC –  Rockchip RK3562 or RK3562J CPU RK3562 – Quad-core Arm Cortex-A53 quad-core @ 2.0 GHz RK3562J – Quad-core Arm Cortex-A53 quad-core @ 1.2 GHz (stock, overclock up to 1.8 GHz) GPU – Mali-G52-2EE with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0/1.1 AI accelerator […]

Zalmotek RA6M1, RA8M1, and RZ/A3U SoMs follow Adafruit Feather form factor, support carrier board for robotics and industrial control

Zalmotek RZ A3UL, RA8M1, and RA6M1 SoM

Romanian company Zalmotek has recently introduced three new SoMs, the RA6M1, RA8M1, and RZ/A3UL, and a modular carrier board designed for embedded applications such as robotics, industrial control, and edge computing. There are a few things that I find interesting about this setup. The SoM comes in Adafruit Feather form factor and, as a result, supports various Adafruit FeatherWings. The modular carrier board supports the Dynamixel motor driver module, the Particle M-SoM breakout module, Ethernet, and CAN modules. The RA6M1 Feather SoM is powered by a Renesas RA6M1 Arm Cortex-M4 CPU at up to 120 MHz, with 512 KB flash and 96 KB SRAM while the RA8M1 Feather SoM features a Renesas RA8M1 64-bit Arm Cortex-M85 running at up to 360 MHz with 128 Mbit SPI flash, the RZ/A3UL Feather SoM is based on a Renesas RZ/A3UL 64-bit Arm Cortex-A55 CPU at up to 1 GHz, with 512 Mbit OctaFlash […]

Muse Pi Pro is a feature-packed, credit card-sized SpacemIT M1 RISC-V SBC with HDMI, GbE, 4x USB, M.2 and mPCIe sockets

Muse Pi Pro

Muse Pi Pro is a feature-packed, credit card-sized SBC powered by the SpacemIT M1 octa-core 64-bit RISC-V AI SoC with a 2 TOPS NPU and equipped with up to 16GB LPDDR4x and 128GB eMMC flash. The single board computer features gigabit Ethernet and a WiFi 6 + Bluetooth 5.3 module for connectivity, HDMI and MIPI DSI display interfaces, two MIPI CSI interfaces, a 3.5mm audio jack,  four USB 3.0 ports, an M.2 socket for an NVMe SSD or wireless module, a mini PCIE socket for WiFi and 4G LTE/5G cellular connector, and a 40-pin GPIO header for expansion. That’s quite a lot of features for such a compact board. Muse Pi Pro specifications: SoC – SpacemiT M1 (similar to SpacemIT K1, but clocked at 1.8 GHz) CPU – 8-core X60 RISC-V processor @ 1.8 GHz GPU – Imagination IMG BXE-2-32 with support for OpenGL ES3.2, Vulkan 1.2, OpenCL 3.0; 20 […]

IBASE EC3100 – A fanless NVIDIA Jetson Orin NX/Nano embedded computer with up to 6x GbE ports (4x with PoE)

IBASE EC3100 Fanless Embedded Computer

IBASE EC3100 is a fanless edge AI computer powered by NVIDIA Jetson Orin NX or Orin Nano module with up to six GbE ports, including four with PoE for cameras, a wide 9V to 36V DC input, and a -20°C to 70°C temperature range for industrial environments. The EC3100 is equipped with a choice of modules from the Jetson Orin Nano 4GB up to the Jetson Orin NX 16GB, delivering a maximum of 157 TOPS of AI performance. The embedded system also features an HDMI 2.1 video output, audio input and output jacks, optional WiFi and/or 4G LTE/5G cellular connectivity, RS232 and CAN Bus DB9 connectors, and several digital inputs and outputs. EC3100 specifications: System-on-Module (one or the other) EC3100-NANO-4 – NVIDIA Jetson Orin Nano 4GB with 8-core Arm Cortex-A78AE CPU @ 1.5 GHz, 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores; 34 TOPS max EC3100-NANO-8 – NVIDIA Jetson […]

Espressif Systems ESP32-P4-EYE development kit looks like a camera

ESP32-P4-EYE

Espressif Systems’ ESP32-P4-EYE is a development kit designed for AI vision applications that looks like a standard camera. It combines an ESP32-P4 RISC-V microcontroller with an ESP32-C6 WiFi 6, BLE, and 802.15.4 SoC, and is equipped with a MIPI-CSI camera, a 2MP display, a microphone, and a MicroSD card to store photos or videos. There’s also a rotatory encoder to control the menu on the LCD or adjust the zoom, a fill/flash light, a few buttons, an LED, and support for either USB or battery power. The company says the ESP32-P4 camera devkit targets smart surveillance, vision-based edge AI, real-time image detection, and audio-visual IoT interfaces. ESP32-P4-EYE specifications: Microcontroller – ESP32-P4 MCU Dual-core RISC-V microcontroller @ 400 MHz with AI instructions extension and single-precision FPU Single-RISC-V LP (Low-power) MCU core @ up to 40 MHz GPU – 2D Pixel Processing Accelerator (PPA) VPU – H.264 and JPEG codecs support Memory […]

JUMPtec SMARC-sAM67 – An industrial SMARC SoM based on TI AM67x Jacinto SoC for Edge AI and vision applications

Jumptec SMARC sAM67 SoM

JUMPtec, a subsidiary of Kontron, has recently introduced SMARC-sAM67, an industrial SMARC SoM built around Texas Instruments’ AM67x Jacinto dual- or quad-core processors (AM67, AM67A, or AM67D) designed for industrial, robotic, and vision applications. The SMARC-sAM67 module features up to 8GB LPDDR4 memory, up to 64GB eMMC 5.1 flash, dual Gigabit Ethernet, PCIe Gen3 x1 expansion, USB 3.2 and USB 2.0, and display interfaces including dual-channel LVDS and DSI (or optional DisplayPort). It also features four UARTs, CAN bus, SPI, I2S, I2C, MIPI CSI cameras, and various industrial features such as extended temperature support (-40°C to 85°C), failsafe update support, and an ultra-low power RTC. JUMPtec SMARC-sAM67 SoM Specifications: SoC – Texas Instruments dual- or quad-core AM67x Jacinto processor (Standard AM67, optional AM67A or AM67D) System Memory – Up to 8GB LPDDR4 RAM Storage – Up to 64GB eMMC 5.1 flash storage Networking – 2x 10/100/1000 Mbps Ethernet PHY with […]

Boardcon EM1103B AIoT SBC for video surveillance applications features PIR sensor, fingerprint interface, and dual camera support

EM1103B Rockchip RV1103B SBC

Boardcon EM1103B is an AIoT SBC powered by a Rockchip RV1103B SoC designed for surveillance applications with dual camera, fingerprint, and a PIR sensor. This unique combination makes it suitable for vision-based applications such as smart cameras, doorbells, and battery-powered surveillance devices. The SBC consists of a compact core board that mounts to a large baseboard, which gives access to all the necessary I/O modules and also provides power. The SBC together features 100 Mbps Ethernet, Wi-Fi, USB 2.0 OTG, UART, GPIO, and interfaces for speakers, microphones, fingerprint sensors, and PIR motion sensors. It also features PoE (5V) support and expandable storage via microSD. Additionally, it integrates two MIPI CSI camera interfaces mad the RV1103B’s 8MP hardware ISP with enables advanced image processing features such as HDR, 3A (AE/AF/AWB), and 3DNR. The chip also supports H.264/H.265 video encoding for local and cloud streaming. Boardcon EM1103B specifications: Core Board – Boardcon […]

Radxa Dragon Q6A – A Qualcomm QCS6490 Edge AI SBC with GbE, WiFi 6, three camera connectors

Radxa Dragon Q6A

Radxa Dragon Q6A is an upcoming credit card-sized SBC powered by a Qualcomm QCS6490 octa-core SoC with a 12 TOPS AI accelerator, up to 16GB LPDDR5 memory, and the usual ports found on Raspberry Pi-like single board computers such as gigabit Ethernet, four USB ports, HDMI video output, and a 40-pin GPIO header. The board will also feature an M.2 Key-M socket for SSD storage, a WiFi 6 and Bluetooth 5.4 wireless module, a MIPI DSI display interface, three MIPI CSI connectors, a connector for an eMMC or UFS flash module, a microphone input connector, and an RTC battery connector. Radxa Dragon Q6A specifications: SoC – Qualcomm QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL […]

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