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January 20, 2026January 19, 2026 by Debashis Das - 2 Comments

EnviroGo ESP32-S3 wearable environmental monitor features 7 sensors (Crowdfunding)

EnviroGo s 7 in 1 ESP32 wearable environmental monitor

EnviroGo is an ESP32-S3-based wearable environmental monitor that tracks Organic Compounds (VOCs), UV index, temperature, humidity, air pressure, light, and motion via a 9-axis MEMS sensor. It is designed for indoor and outdoor use, and can be worn, clipped to a bag, or magnetically mounted, making it suitable for homes, offices, travel, labs, and daily use where real-time environmental data is needed. EnviroGo supports built-in Wi-Fi and Bluetooth connectivity through the ESP32-S3 WiSoC, features a small 0.96-inch IPS display, a microSD card slot for local data logging, and an RTC for time-stamped records. The device samples data at configurable intervals, uses RGB LEDs and a buzzer for visual and audible alerts, and can process data locally with AI-based prediction to spot trends such as rising VOC levels or humidity changes (with a stated 7-day learning period). EnviroGo is designed for IoT developers, researchers, smart home users, and health-conscious individuals who […]

January 19, 2026January 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Bedrock RAI300 fanless industrial PC is powered by an AMD Ryzen AI 9 HX 370 mobile AI SoC

SolidRun Bedrock RAI300 is the first industrial PC powered by a 12-core/24-thread AMD Ryzen AI 9 HX 370 mobile processor, typically used in premium consumer and commercial AI laptops. The fanless industrial computer supports up to 128GB DDR5 SO-DIMM memory to run AI models on the 50 TOPS NPU (80 TOPS combined) of the AMD processor, up to three M.2 NVMe 2280 PCIe Gen4 x4 storage devices, up to four display through HDMI 2.1 and DP 2.1 video outputs, and features up to four 2.5 Gbps Ethernet ports, a USB4 port, four USB 3.2 ports, and more. It’s available in two models: a thin “Tile” model and a thicker “60W model” to cater to different TDP configurations, ranging from 8W to 54W, and cooling options. Bedrock RAI300 specifications: SoC – AMD Ryzen AI 9 HX 370 “Strix Point” CPU – 12-core/24-thread processor with four Zen 5 cores up to 2.0/5.1 […]

January 19, 2026January 19, 2026 by Debashis Das - No Comments

Raspberry Pi CM0-powered low-cost industrial box PCs offer RS-485, 4G LTE, and wide DC input options

EDATEC ED IPC1100 and ED IPC1000 low cost industrial box PCs

EDATEC has recently released the ED-IPC1000 and ED-IPC1100 Raspberry Pi CM0-based industrial box PCs with DIN-rail mounting options. The ED-IPC1000 is the low-cost version, featuring standard connectivity options such as Wi-Fi and Bluetooth. In contrast, the ED-IPC1100 offers RS-485 and 4G CAT-1 connectivity, along with a wider power input, making it suitable for more advanced industrial applications. As a reminder, the Raspberry Pi CM0 is a solder-on module based on a Broadcom BCM2710A1 quad-core Arm Cortex-A53 CPU with 512 MB RAM, optional 8 GB/16 GB eMMC flash, and optional 2.4 GHz Wi-Fi/Bluetooth. It’s only available to manufacturers in China; expect finished products like the ED-IPC1000/IPC1100 box PCs can be sold worldwide. Other features of the computers include 1080p30 HDMI output, dual USB 2.0, 10/100 Mbps Ethernet, an integrated RTC with CR2032 backup, a watchdog timer, 5V USB-C power input, passive cooling, and DIN-rail mounting. The ED-IPC1100 adds an onboard 4G LTE […]

January 15, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Geniatech introduces SMARC and OSM system-on-modules powered by NXP i.MX 95 SoC

Geniatech NXP i.MX 95 SMARC OSM system-on-modules

Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 Size L-compliant SOM-iMX95-OSM and the SMARC 2.1-compliant SOM-iMX95-SMARC. Both ship with up to 16GB LPDDR5 and up to 128GB eMMC flash, and are designed for markets such as smart retail, industrial automation, intelligent transportation, medical devices, and commercial IoT. Geniatech SOM-iMX95-SMARC SOM-iMX95-SMARC specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode JPEG Encoder, JPEG Decoder AI Accelerator – NXP eIQ Neutron 2 TOPS neural processing […]

January 15, 2026 by Kumpee Teeravech - 1 Comment

reComputer Industrial R2135-12 review – A Raspberry Pi CM5-powered fanless Edge AI PC with Hailo-8 AI accelerator

Hello, today I am going to review the reComputer AI Industrial R2135-12 from Seeed Studio. This is an industrial edge computer built around the Raspberry Pi Compute Module 5 platform. The model is configured with 8 GB LPDDR4 memory and 32 GB eMMC storage. It provides a rich set of I/O options, including dual Gigabit Ethernet, USB 3.0/USB 2.0, HDMI output, and industrial interfaces such as RS-485/RS-232, CAN, and GPIO, along with Wi-Fi and Bluetooth support and a wide DC power input range suitable for industrial environments. In addition to standard checking and benchmarking the device, I will also include a hands-on demo application in which the system runs an AI model for real-time people detection from a USB camera, then sends detection results to an external ESP32 microcontroller to drive LED matrices for visually highlighting the locations of detected people. I made the following YouTube video to quickly demonstrate […]

January 13, 2026January 16, 2026 by Sponsored Post - No Comments

Compex Wi-Fi 7 Dual-Band Dual-Concurrent Modules: High-Performance Solutions for Next-Gen Connectivity (Sponsored)

Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, high-specification Wi-Fi products for demanding and mission-critical applications. For Wi-Fi 7 (802.11be), Compex has introduced a family of standard modules for system designers who are looking for flexible module options that support different band combinations, form factors, and deployment scenarios. The Compex Wi-Fi 7 Dual-Band Dual-Concurrent Module family is designed to address these requirements by offering a versatile set of dual-band configurations across 2.4GHz, 5GHz, and 6GHz, delivering high performance and adaptability for a wide range of applications. Qualcomm-Powered Dual-Band Dual-Concurrent Modules Powered by Qualcomm’s QCN6224, QCN6274, and QCN9274 ‘Waikiki’ radio chipsets, the Compex Wi-Fi 7 Dual-Band Dual-Concurrent Module family features dual-band combinations across 2.4GHz, 5GHz, and 6GHz bands. These modules support advanced Wi-Fi 7 functions such as Multi-Link Operation (MLO), OFDMA, and 4096-QAM. These 2×2 MU-MIMO modules are available in standard MiniPCIe, M.2 E-Key, […]

January 11, 2026 by Debashis Das - 1 Comment

AMD Embedded+ mini-ITX Board features Ryzen AI Embedded P132 CPU, Versal AI Edge Gen2 VE3558 SoC FPGA

SAPPHIRE EDGE+ VPR 7P132, a Mini ITX AMD Embedded+

At CES 2026, Sapphire Technology introduced the EDGE+VPR-7P132, an “AMD Embedded+” Mini-ITX motherboard built around AMD’s newly announced Ryzen AI Embedded P100 series of SoCs, namely the hexa-core Ryzen P132 (V4526iX) CPU, and an AMD Versal AI Edge Gen 2 VE3558 SoC FPGA, which features octa-core Arm Cortex-A78AE + ten Cortex-R52 real-time cores beyond FPGA fabric. It’s the first AMD Ryzen AI Embedded motherboard we’ve seen. It represents a massive update from last year’s Edge+ VPR-5050 motherboard, which relied on Zen 2-based Ryzen Embedded V2000 series and first-generation Versal silicon. The new VPR-7P132 skips multiple generations, jumping straight to Zen 5 CPU cores and RDNA 3.5 graphics, with an upgraded Versal Gen 2 adaptive Edge AI SoC for real-time inference, along with faster LPDDR5 (4266MHz) memory and 40 Gbps USB4 connectivity. SapphireTech EDGE+ VPR-7P132-MB specifications: AMD Embedded+ Architecture Adaptive SoC Subsystem Adaptive SoC – AMD Versal AI Edge Gen 2 […]

January 9, 2026January 9, 2026 by Debashis Das - No Comments

SECO’s COM Express Type 6 module features Intel Core Ultra Series 3 Panther Lake-H processor with up to 180 TOPS

SECO SOM COMe BT6 PTL COM Express Type 6 module

We have just covered Vecow’s new TGS-2000 series of Edge AI computers built around Intel’s new Panther Lake-H SoCs, and now SECO has announced the SOM-COMe-BT6-PTL, a COM Express Type 6 Basic module which supports the higher-end 16-core Core Ultra X9 series processors and can deliver up to 180 TOPS of AI performance. The module follows the COM Express Release 3.1 Type 6 Basic form factor (125 × 95 mm), supports up to 128GB DDR5 memory via dual SO-DIMM slots, offers high-speed expansion through PCIe Gen4/Gen5, USB 4.0/Thunderbolt, and 2.5Gbps Ethernet, and provides multiple display interfaces including eDP, DP++, and HDMI. It is available with an optional industrial temperature range and is designed for rugged and mission-critical applications. SECO SOM-COMe-BT6-PTL Specifications: Panther Lake SoC (one or the other) Intel Core Ultra X9 388H – 16-core (4P + 8E + 4LPE) processor up to 1.6 GHz / 5.1 GHz (Turbo), 18MB cache, […]